MTP405CJ3 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Single Drive Requirement
  • Low On-resistance
  • Fast switching Characteristic
  • Pb-free lead plating and halogen-free package Symbol Outline TO-252(DPAK)

Ordering Information

(Pb-free lead plating package) 2500 pcs / Tape & Reel MTP405CJ3 G：Gate G D S D：Drain S：Source Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 2/9 MTP405CJ3 CYStek Product Specification Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source V oltage VDS -30 Gate-Source V oltage VGS ±20 V Continuous Drain Current @VGS=-10V , TC=25°C -34 Continuous Drain Current @VGS=-10V , TC=100°C -21.5 Continuous Drain Current @VGS=-10V , TA=25°C -18 Continuous Drain Current @VGS=-10V , TA=100°C ID -11.4 A Pulsed Drain Current IDM -80 *1 A TC=25℃ 50 *4 TC=100℃ 20 *4 TA=25℃ 2.5 Power Dissipation TA=100℃ PD 1.0 W Single Pulse Avalanche Energy EAS 45 *2 mJ Single Pulse Avalanche Current IAS -18 A Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 2.5 °C/W Thermal Resistance, Junction-to-ambient, max Rth,j-a 50 *3 °C/W Note : *1. Pulse width limited by safe operating area. *2 . Tj=25°C, VDD=-15V , L=0.14mH, RG=25Ω. *3 . The value of Rth,j-a is measured with the device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C. The value in any given application depends on the user’s specific board design. *4 . The power dissipation PD is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. It is used to determined the current rating, when this rating falls below the package limit. Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -30 - - V VGS=0, ID=-250μA VGS(th) -1.0 -1.4 -2.5 V VDS = VGS, ID=-250μA GFS - 20 - S VDS =-5V , ID=-18A IGSS - - ±100 nA VGS=±20 IDSS - - -1 VDS =-30V , VGS =0 IDSS - - -5 μA VDS =-24V , VGS =0, Tj=55°C *RDS(ON) - 21 30 VGS =-10V , ID=-18A *RDS(ON) - 33 45 mΩ VGS =-4.5V , ID=-10A Dynamic *Qg - 18 - *Qgs - 3.3 - *Qgd - 4.9 - nC ID=-18A, VDS=-15V , VGS=-10V

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 3/9 MTP405CJ3 CYStek Product Specification *td(ON) - 7 - *tr - 11 - *td(OFF) - 27 - *tf - 8 - ns VDS=-15V , VGS=-10V , RG=3Ω, ID=-18A Ciss - 1308 - Coss - 137 - Crss - 111 - pF VGS=0V , VDS=-15V , f=1MHz Source-Drain Diode *VSD - - -1 V IS=-1A, VGS=0V *IS - - -18 A VD=VG=0, VS=-1V *trr - 24 - ns *Qrr - 14 - nC IS=-18A, VGS=0, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Recommended soldering footprint

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 4/9 MTP405CJ3 CYStek Product Specification Typical Characteristics Typical Output Characteristics 012345 DS, Drain-Source Voltage(V) -ID, Drain Current (A) 10V -VGS=3V -VGS=2V -VGS=4V -VGS=5V -VGS=6V Normalized Brekdown Voltage vs Ambient Temperature 0.6 0.8 1.2 1.4 -60 -20 20 60 100 140 180 Tj, Junction Temperature(°C) -BVDSS, Normalized Drain-Source Breakdown Voltage ID=-250μA, VGS=0V Static Drain-Source On-State resistance vs Drain Current 100 1000 0.01 0.1 1 10 100 -ID, Drain Current(A) RDS(on), Static Drain-Source On-State Resistance(mΩ) VGS=-4.5V VGS=-3V VGS=-10V VGS=-2.5V Source Drain Current vs Source-Drain Voltage 0.2 0.4 0.6 0.8 1.2 048 1 2 1 6 2 S, Source Drain Current(A) -VSD, Source-Drain Voltage(V) VGS=0V Tj=25°C Tj=150°C Static Drain-Source On-State Resistance vs Gate-Source Voltage 120 160 200 240 02468 1 Normalized Drain-Source On-State Resistance vs Junction Tempearture 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -60 -20 20 60 100 140 180 Tj, Junction Temperature(°C) RDS(on), Normalized Static Drain- Source On-State Resistance VGS=-10V, ID=-18A RDS(ON) @ Tj=25°C : 21.4mΩ -VGS, Gate-Source Voltage(V) RDS(on), Static Drain-Source On- State Resistance(mΩ) ID=-18A

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 5/9 MTP405CJ3 CYStek Product Specification Typical Characteristics(Cont.) Capacitance vs Drain-to-Source Voltage 100 1000 10000 0.1 1 10 100 -VDS, Drain-Source Voltage(V) Capacitance---(pF) Coss Ciss Crss Normalized Threshold Voltage vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 1.6 -60 -20 20 60 100 140 Tj, Junction Temperature(°C) -VGS(th), Normalized Threshold Voltage ID=-250μA Forward Transfer Admittance vs Drain Current 0.1 100 0.01 0.1 1 10 100 -ID, Drain Current(A) GFS, Forward Transfer Admittance(S) VDS=-5V Pulsed TA=25°C Gate Charge Characteristics 0 2 4 6 8 1 01 21 41 61 82 0 Qg, Total Gate Charge(nC) -VGS, Gate-Source Voltage(V) VDS=-15V ID=-18A Maximum Safe Operating Area 0.01 0.1 100 0.1 1 10 100 -ID, Drain-Source Voltage(V) -ID, Drain Current(A) DC 10ms 100m 1ms 100μs TC=25°C, Tj=150°C, VGS=-10V θJC=2.5°C/W, Single Pulse Maximum Drain Current vs Case Temperature 25 50 75 100 125 150 175 T C, Case Temperature(°C) -ID, Maximum Drain Current(A)TC=25°C, VGS=-10V

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 6/9 MTP405CJ3 CYStek Product Specification Typical Characteristics(Cont.) Single Pulse Power Rating, Junction to Case 500 1000 1500 2000 2500 3000 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width(s) Power (W) TJ(MAX)=150°C TC=25°C θJC=2.5°C/W Transient Thermal Response Curves 0.001 0.01 0.1 t1, Square Wave Pulse Duration(s) r(t), Normalized Transient Thermal ResistanceSingle Pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 1.RθJC(t)=r(t)*RθJC 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*RθJC(t) 4.RθJC=2.5°C/W

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 7/9 MTP405CJ3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 8/9 MTP405CJ3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C386J3 Issued Date : 2007.06.08 Revised Date : 2014.03.14 Page No. : 9/9 MTP405CJ3 CYStek Product Specification TO-252 Dimension Marking: Device Name Date Code 405C □□□□ 1 2 3 Style: Pin 1.Gate 2.Drain 3.Source 4.Drain 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead : Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.