MTP2603G6 CYSTEKEC | Alldatasheet

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CYStech Electronics Corp. Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 1/5 MTP2603Q6 CYStek Product Specification P-CHANNEL ENHANCEMENT MODE POWER MOSFET MTP2603G6

Description

The MTP2603G6 is a P-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The TSOP-6 package is universally preferred for all commercial-industrial surface mount applications. Features Equivalent Circuit

  • Simple drive requirement MTP2603G6 G：Gate S：Source D：Drain
  • Low on-resistance
  • Small package outline
  • Pb-free package Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source Voltage VDS -20 V Gate-Source Voltage VGS ±12 V Continuous Drain Current @TA=25 °C (Note 1) ID -5 A Continuous Drain Current @TA=70 °C (Note 1) ID -4 A Pulsed Drain Current (Note 2, 3) IDM -20 A Pd 2 W Total Power Dissipation @ TA=25 °C Linear Derating Factor 0.016 W / °C Operating Junction Temperature Tj -55~+150 °C Storage Temperature Tstg -55~+150 °C Thermal Resistance, Junction-to-Ambient (Note 1) Rth,ja 62.5 °C/W Note : 1.Surface mounted on 1 in² copper pad of FR-4 board. 156℃/W when mounted on minimum copper pad. 2.Pulse width limited by maximum junction temperature. 3.Pulse Width ≤300μs, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 2/5 MTP2603Q6 CYStek Product Specification Electrical Characteristics (Ta=25°C, unless otherwisenoted) Symbol Min. Typ. Max. Unit Test Conditions BVDSS -20 - - V VGS=0, ID=-250μA ΔBVDSS/ΔTj - -0.1 - V/℃ Reference to 25℃, ID=-1mA VGS(th) -0.5 - -1.2 V VDS=VGS, ID=-250μA IGSS - - ±100 nA VGS=±12V, VDS=0 IDSS - - -1 μA VDS=-20V, VGS=0, Tj=25℃ IDSS - - -10 μA VDS=-16V, VGS=0, Tj=55℃ - - 53 ID=-4.5A, VGS=-10V - - 65 ID=-4.2A, VGS=-4.5V - - 120 ID=-2.0A, VGS=-2.5V *RDS(ON) - - 250 mΩ ID=-1.0A, VGS=-1.8V *GFS - 9 - S VDS=-5V, ID=-2.8A Ciss - 740 1200 Coss - 167 - Crss - 126 - pF VDS=-15V, VGS=0, f=1MHz td(ON) - 5.9 - ns tr - 3.6 - ns td(OFF) - 32.4 - ns tf - 2.6 - ns VDS=-15V, ID=-4.2A, VGS=-10V, RGEN=6Ω, RD=3.6Ω Qg - 10.6 16 nC Qgs - 2.32 - nC Qgd - 3.68 - nC VDS=-16V, ID=-4.2A, VGS=-4.5V, *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Source Drain Diode Symbol Min. Typ. Max. Unit Test Conditions *VSD - - -1.2 V IS=-1.2A,VGS=0V *Trr - 27.7 - ns Qrr - 22 - nC IS=-4.2A,VGS=0V,dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 3/5 MTP2603Q6 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 4/5 MTP2603Q6 CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C394G6 Issued Date : 2006.11.24 Revised Date :2009.03.16 Page No. : 5/5 MTP2603Q6 CYStek Product Specification TSOP-6 Dimension Marking: Style: Pin 1. Gate1 (G1) Pin 2. Source2 (S2) Pin 3. Gate2 (G2) Pin 4. Drain2 (D2) Pin 5. Source1 (S1) Pin 6. Drain1 (D1) 2603 □□□□ Device Name Date Code 6-Lead TSOP-6 Plastic Surface Mounted Package CYStek Package Code: G6 - 0.25 D 0.0748 REF 1.90 REF J 0.0177 REF 0.45 REF d1 0.0374 REF 0.95 REF K 0.0236 REF 0.60 REF d2 0.0374 REF 0.95 REF L 0° 10° 0° 10° F 0.0276 0.0394 0.70 1.00 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : 42 Alloy ; pure tin plated
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.