MTN5N50E3 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • BVDSS=550V typically @ Tj=150℃
  • Low On Resistance
  • Simple Drive Requirement
  • Low Gate Charge
  • Fast Switching Characteristic
  • RoHS compliant package

Applications

  • Ballast
  • Inverter Symbol Outline TO-220 MTN5N50E3 G：Gate D：Drain S：Source G D S

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 2/8 MTN5N50E3 CYStek Product Specification Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Unit Drain-Source V oltage (Note 1) VDS 500 V Gate-Source V oltage VGS ±30 V Continuous Drain Current ID 4.5* A Continuous Drain Current @TC=100°C ID 2.7* A Pulsed Drain Current @ VGS=10V (Note 2) IDM 18* A Single Pulse Avalanche Energy (Note 3) EAS 171 mJ Avalanche Current (Note 2) IAR 4.5 A Repetitive Avalanche Energy (Note 2) EAR 8 mJ Peak Diode Recovery dv/dt (Note 4) dv/dt 4.5 V/ns Maximum Temperature for Soldering @ Lead at 0.125 in(3.175mm) from case for 10 seconds TL 300 °C W Total Power Dissipation (TC=25℃) Linear Derating Factor above 25℃ PD 85

0.67 W/°C

Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C *Drain current limited by maximum junction temperature Note : 1. TJ=+25℃ to +150℃. 2. Repetitive rating; pulse width limited by maximum junction temperature. 3. ISD=4.5A, dI/dt<100A/μs, VDD<BVDSS, TJ=+150℃. 4. IAS=4.5A, VDD=50V , L=15mH, RG=25Ω, starting TJ=+25℃. Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 1.47 °C/W Thermal Resistance, Junction-to-ambient, max Rth,j-a 62.5 °C/W

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 3/8 MTN5N50E3 CYStek Product Specification Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS 500 - - V VGS=0, ID=250μA BVDSS - 550 - V VGS=0, ID=250μA, Tj=150°C ∆BVDSS/∆Tj - 0.6 - V/°C Reference to 25°C, ID=250μA VGS(th) 2.0 - 4.0 V VDS = VGS, ID=250μA *GFS - 3 - S VDS =15V , ID=2.25A IGSS - - ±100 nA VGS=±30 - - 25 VDS =500V , VGS =0 IDSS - - 250 μA VDS =400V , VGS =0, Tj=125°C *RDS(ON) - - 1.5 Ω VGS =10V , ID=2.7A Dynamic *Qg - 11 - *Qgs - 3 - *Qgd - 5 - nC ID=4.5A, VDD=250V , VGS=10V *td(ON) - 13 - *tr - 22 - *td(OFF) - 28 - *tf - 20 - ns VDD=250V , ID=4.5A, VGS=10V , RG=10Ω Ciss - 460 - Coss - 60 - Crss - 5 - pF VGS=0V , VDS=25V , f=1MHz Source-Drain Diode *VSD - - 1.5 V IS=4.5A, VGS=0V *IS - - 4.5 *ISM - - 18 A VD=VG=0, VS=1.3V *trr - 230 - ns *Qrr - 1.6 - μC VGS=0, IF=4.5A, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking MTN5N50E3 TO-220 (RoHS compliant) 50 pcs/tube, 20 tubes/box, 4 boxes / carton 5N50

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 4/8 MTN5N50E3 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 5/8 MTN5N50E3 CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 6/8 MTN5N50E3 CYStek Product Specification Test Circuit and Waveforms

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 7/8 MTN5N50E3 CYStek Product Specification Test Circuit and Waveforms(Cont.)

CYStech Electronics Corp. Spec. No. : C740E3 Issued Date : 2009.09.14 Revised Date : Page No. : 8/8 MTN5N50E3 CYStek Product Specification TO-220 Dimension A B E G I KM OP C N H D Marking: CYS 5N50 □□□□ Device Name Date Code 1 2 3 3-Lead TO-220 Plastic Package CYStek Package Code: E3 Style: Pin 1.Gate 2.Drain 3.Source 4.Drain *: Typical Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: KFC ; pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.