MTA050B01DFA6 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

  • Simple drive requirement
  • Low gate charge
  • Low on-resistance
  • Fast switching speed
  • Pb-free lead plating and halogen-free package Equivalent Circuit Outline

Ordering Information

MTA050B01DFA6-0-T1-G DFN2×2-6L (Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel MTA050B01DFA6 DFN2×2-6L G：Gate S：Source D：Drain BVDSS -14V ID @VGS=-4.5 V , TA=25°C -4.3A RDSON@VGS=-4.5V , ID=-3.6A 39mΩ(TYP.) RDSON@VGS=-2.5V , ID=-3.2A 55mΩ(TYP.) RDSON@VGS=-1.8V , ID=-1.0A 69mΩ(TYP.) Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 2/10 MTA050B01DFA6 CYStek Product Specification Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source Breakdown V oltage BV DSS -14 Gate-Source V oltage V GS ±8 V Continuous Drain Current @TA=25 °C, VGS=-4.5V (Note 1) -4.3 Continuous Drain Current @TA=70 °C, VGS=-4.5V (Note 1) ID -3.4 Pulsed Drain Current (Note 2) I DM -26 A PD 1.38 W Total Power Dissipation (Note 1) Linear Derating Factor 0.01 W / °C Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec 2.Pulse width limited by maximum junction temperature Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max R θJC 75 Thermal Resistance, Junction-to-ambient, max R θJA 90 (Note ) °C/W Note :.Surface mounted on 1 in² copper pad of FR-4 board, t≤5 sec; 195°C/W when mounted on minimum copper pad Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -14 - - V V GS=0V , ID=-250μA ∆BVDSS/∆Tj - -5 - mV/°C Reference to 25 °C, ID=-250μA VGS(th) - -0.8 -1.2 V V DS=VGS, ID=-250μA IGSS - - ±100 nA V GS=±8V , VDS=0V - - -1 V DS=-12V , VGS=0V IDSS - - -25 μA VDS=-12V , VGS=0V , Tj=70°C - 55 77 V GS=-2.5V , ID=-3.2A *RDS(ON) - 69 - mΩ VGS=-1.8V , ID=-1.0A *GFS - 7.4 - S V DS=-5V , ID=-3A Dynamic Ciss - 678 - Coss - 130 - Crss - 123 - pF V DS=-10V , VGS=0V , f=1MHz *td(ON) - 11.6 - *tr - 22.8 - *td(OFF) - 56 - *tf - 33.2 - ns VDS=-10V , ID=-1A, VGS=-4.5V , RG=6Ω

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 3/10 MTA050B01DFA6 CYStek Product Specification *Qg - 8.8 - *Qgs - 0.9 - *Qgd - 2.7 - nC V DS=-10V , ID=-1.5A, VGS=-4.5V Rg - 15 - Ω f=1MHz Source-Drain Diode *VSD - -0.9 -1.2 V V GS=0V , IS=-3.4A *trr - 24.7 - ns *Qrr - 4.8 - nC IF=-3.4A, VGS=0V , dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 4/10 MTA050B01DFA6 CYStek Product Specification Typical Characteristics Typical Output Characteristics 012345 -VDS, Drain-Source Voltage(V) -ID, Drain Current (A) -VGS=2V -VGS=8V,7V,6V,5V,4V,3V,2.5V Brekdown Voltage vs Ambient Temperature 0.4 0.6 0.8 1.2 1.4 1.6 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -BVDSS, Normalized Drain-Source Breakdown Voltage ID=-250μA, VGS=0V Static Drain-Source On-State resistance vs Drain Current 100 1000 0.01 0.1 1 10 -ID, Drain Current(A) RDS(on), Static Drain-Source On-State Resistance(mΩ) VGS=-1.8V VGS=-2.5V VGS=-4.5V Reverse Drain Current vs Source-Drain Voltage 0.2 0.4 0.6 0.8 1.2 02468 1 0 -IDR, Reverse Drain Current (A) -VSD, Source-Drain Voltage(V) Tj=25°C Tj=150°C VGS=0V Static Drain-Source On-State Resistance vs Gate-Source Voltage 100 150 200 250 300 012345 -VGS, Gate-Source Voltage(V) RDS(ON), Static Drain-Source On- State Resistance(mΩ) ID=-3.6A Drain-Source On-State Resistance vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 1.6 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) RDS(ON), Normalized Static Drain- Source On-State ResistanceVGS=-4.5V, ID=-3.6A RDS( ON)@Tj=25°C : 39mΩ typ.

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 5/10 MTA050B01DFA6 CYStek Product Specification Typical Characteristics(Cont.) Capacitance vs Drain-to-Source Voltage 100 1000 10000 0123456789 1 0 -VDS, Drain-Source Voltage(V) Capacitance---(pF) Coss Ciss Crss Threshold Voltage vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -VGS(th),Normalized Threshold VoltageID=-250μA ID=-1mA Single Pulse Power Rating, Junction to Ambient 0.001 0.01 0.1 1 10 100 Pulse Width(s) Power (W) TJ(MAX)=150°C TA=25°C RθJA=90°C/W Gate Charge Characteristics 02468 1 0 1 2 1 4 1 6 1 8 2 0 Qg, Total Gate Charge(nC) -VGS, Gate-Source Voltage(V) VDS=-10V ID=-1.5A Maximum Safe Operating Area 0.01 0.1 100 0.01 0.1 1 10 100 -VDS, Drain-Source Voltage(V) -ID, Drain Current (A) DC 10ms 100ms 1ms 100μsRDS( ON) Limited TA=25°C, Tj=150°C, VGS=-4.5V, RθJA=90°C/W Single Pulse Maximum Drain Current vs JunctionTemperature 0.5 1.5 2.5 3.5 4.5 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -ID, Maximum Drain Current(A)TA=25°C, VGS=-4.5V, RθJA=90°C/W

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 6/10 MTA050B01DFA6 CYStek Product Specification Typical Characteristics(Cont.) Typical Transfer Characteristics 012345 VGS, Gate-Source Voltage(V) ID, Drain Current(A) VDS=5V Forward Transfer Admittance vs Drain Current 0.01 0.1 0.001 0.01 0.1 1 10 -ID, Drain Current(A) GFS, Forward Transfer Admittance-(S) VDS=-5V Pulsed Ta=25°C Transient Thermal Response Curves 0.001 0.01 0.1 t1, Square Wave Pulse Duration(s) r(t), Normalized Transient Thermal Resistance Single Pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TA=PDM*RθJA(t) 4.RθJA=90°C/W

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 7/10 MTA050B01DFA6 CYStek Product Specification Reel Dimension

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 8/10 MTA050B01DFA6 CYStek Product Specification Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 9/10 MTA050B01DFA6 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3 °C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C101DFA6 Issued Date : 2018.05.03 Revised Date : Page No. : 10/10 MTA050B01DFA6 CYStek Product Specification DFN2×2-6L Dimension D1 0.900 1.100 0.035 0.043 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead :Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Marking: 6-Lead DFN2×2-6L Plastic Surface Mounted Package CYStek Package Code: DFA6 Style: Pin 1. Source1 (S1) Pin 2. Gate 1 (G1) Pin 3. Drain2 (D2) Pin 4. Source2 (S2) Pin 5. Gate2 (G2) Pin 6. Drain1 (D1) Device Code Date Code A5TB