MSFA0M02X8 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

  • Simple drive requirement
  • Low on-resistance
  • Fast switching speed
  • Pb-free lead plating and halogen-free package Symbol Outline DFN3×2 G：Gate S：Source A: Anode D：Drain K: Cathode

CYStech Electronics Corp. Spec. No. : C724X8 Issued Date : 2009.06.12 Revised Date : Page No. : 2/9 MSFA0M02X8 CYStek Product Specification Absolute Maximum Ratings (TA=25°C, unless otherwise noted) Parameter Symbol Limits Unit Drain-Source Breakdown V oltage BVDSS -20 V Gate-Source V oltage VGS ±12 V Continuous Drain Current @TA=25 °C ID -3 Continuous Drain Current @TA=70 °C ID -2.4 Pulsed Drain Current (Note 1) IDM -12 Average Forward Current (Schottky) IF 1 Pulsed Forward Current (Schottky) IFM 3 A TA=25 °C 1.5 Power Dissipation (MOSFET) TA=70 °C 0.9 TA=25 °C 1.2 Power Dissipation (Schottky) TA=70 °C PD 0.76 W Operating Junction and Storage Temperature Range Tj; Tstg -55~+150 °C Note : 1. Pulse width limited by maximum junction temperature. Duty cycle≤1%. Thermal Resistance Ratings Parameter Symbol Maximum Unit Thermal Resistance, Junction-to-case(MOSFET) Rth,j-c 40 Thermal Resistance, Junction-to-ambient(MOSFET) Rth,j-a 85 Thermal Resistance, Junction-to-case(Schottky) Rth,j-c 50 Thermal Resistance, Junction-to-ambient(Schottky) Rth,j-a 105 °C/W Electrical Characteristics (TA=25°C, unless otherwise noted) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -20 - - V VGS=0V , ID=-250μA VGS(th) -0.3 -0.75 -1.2 V VDS=VGS, ID=-250μA IGSS - - ±100 nA VGS=±12V , VDS=0V - - -1 μA VDS=-16V , VGS=0V IDSS - - -10 μA VDS=-16V , VGS=0, TJ=125°C ID(ON) -3 - - A VDS=-5V , VGS=-4.5V - 85 100 ID=-3A, VGS=-4.5V *RDS(ON) - 120 150 mΩ ID=-2.5A, VGS=-2.5V *GFS - 4.5 - S VDS=-5V , ID=-3A Dynamic Ciss - 1033 - Coss - 386 - Crss - 367 - pF VDS=-10V , VGS=0, f=1MHz Rg - 6.5 - Ω VGS=15mV , VDS=0V , f=1MHz

CYStech Electronics Corp. Spec. No. : C724X8 Issued Date : 2009.06.12 Revised Date : Page No. : 3/9 MSFA0M02X8 CYStek Product Specification *td(ON) - 15 - *tr - 30 - *td(OFF) - 35 - *tf - 30 - ns VDS=-10V , ID=-1A, VGS=-4.5V , RGS=6Ω *Qg - 10 - *Qgs - 3.6 - *Qgd - 3 - nC VDS=-10V , ID=-3A, VGS=-4.5V Source-Drain Diode *VSD - - 1.2 V VGS=0V , IF=IS *IS - - -2.5 A *ISM - - -10 A *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Schottky Electrical Characteristics (TA=25°C, unless otherwise noted) Symbol Min. Typ. Max. Unit Test Conditions - 0.47 0.56 IF=1A *VF - 0.44 0.53 V IF=1A, TJ=125°C - 0.008 0.08 VR=5V - 2.8 28 VR=5V , TJ=125°C - 0.009

0.09 VR=20V IRM mA

VR=20V , TJ=125°C - 3.2 32 CT - 30 - pF VR=10V *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Recommended Footprint

CYStech Electronics Corp. Spec. No. : C724X8 Issued Date : 2009.06.12 Revised Date : Page No. : 4/9 MSFA0M02X8 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C724X8 Issued Date : 2009.06.12 Revised Date : Page No. : 5/9 MSFA0M02X8 CYStek Product Specification Characteristic Curves(Cont.)

CYStech Electronics Corp. Spec. No. : C724X8 Issued Date : 2009.06.12 Revised Date : Page No. : 6/9 MSFA0M02X8 CYStek Product Specification Schottky Characteristic Curves

CYStech Electronics Corp. Spec. No. : C724X8 Issued Date : 2009.06.12 Revised Date : Page No. : 7/9 MSFA0M02X8 CYStek Product Specification DFN3×2 Dimension *: Typical Inches 8-Lead DFN3×2 Plastic Package CYStek Package Code: X8 Marking: Device Name Date Code *3.00 θ1 0° 12° 0° 12° D *0.0118 E *0.0079 *2.00 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.