MSBT801 SEOUL | Alldatasheet

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Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com Specification MSBT801 CUSTOMER ApprovalApprovalDrawn SSC

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com MSBT801 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. CIE Chromaticity Diagram 6. Outline Dimension 7. Packing 8. Soldering 9. Precaution for use

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com MSBT801 MSBT801 Description Features 사진 • Industry Standard PLCC SMT package

  • High brightness using AlInGaP and InGaN dice technologies
  • Available in multiple colors
  • High volume, high reliability This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS.

Applications

  • Interior automotive
  • Electronic Signs and Signals
  • Office Automation, Electrical Appliances, Industrial Equipment

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 1. Features

  • SKY BLUE colored SMT package
  • Material INGaN/SiC
  • Suitable for all SMT assembly methods Suitable for all soldering methods
  • RoHS Compliant

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 2. Absolute maximum ratings oC-40 ~ +100TstgStorage Temperature oC-40 ~ +100ToprOperating Temperature V5VRReverse Voltage mA90IFM *2Peak Forward Current mA30IFForward Current mW120PdPower Dissipation UnitValueSymbolParameter *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics 0.0810.0700.059y deg.-120-IF =20mA2θ ½Viewing Angle *2 nm-23-IF =20mA∆λSpectral Bandwidth 50% 0.1670.1500.135 IF =20mA X Color Coordinate (x,y) nm-455-IF =20mAλPPeak Wavelength mcd450300150IF =20mAIVLuminance Intensity *1 µA10--VR=5VIRReverse Current V4.03.32.7IF =20mAVFForward Voltage UnitMaxTypMinConditionSymbolParameter *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 4. Optical characteristics 0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 (Ta=25 OC ) Forward Current vs. Forward Voltage Relative Luminous Intensity vs Forward Current (Ta=25 OC ) Forward Voltage VF (V) Forward Current IF [mA] Forward Current IF [mA] Radiation DiagramForward Current Derating Curve -40 -20 0 20 40 60 80 100 Ambient Temperature TA [OC] Forward Current IF [mA] (Ta=25 OC ) -90 -60 -30 Relative Luminous Intensity Iv/Iv [Rel]

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 5. CIE Chromaticity Diagram 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620630 830 CIE(y) CIE(x)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 0.040 0.045 0.050 0.055 0.060 0.065 0.075 0.080 0.085 0.090 0.095 CIE Coord. (Y) CIE Coord. (X) 0.070

  • COLOR RANK <IF=20mA, Ta=25℃> 0.081 0.167 0.080 0.137 0.060 0.165 0.059 0.135 yx Color Coordinate * Measurement Uncertainty of the Color Coordinates : ± 0.01

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 6.outline dimension 2.8 2.2 3.2 2.4 1.6 0.8 1.9 0.8 0.15 Cathode Mark Anode Cathode Recommended Solder Pattern 1.6 2.2 1.8 1.8 7. packing 3.83±0.1 8±0.1 1.75±0.13.5±0.1 8°1.0± 0. 1 3. 1± 0. 1 1. 55 ± 0.05 0. 22±0.05 2. 22± 0. 1 0.22.0 ± 6030° ±0.2 LABLE 11.4 0.39.0 ± ±0 .1 180 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com

  • Reel Packing Structure ca b

1 SIDE

SIZE (mm) Outer Box Structure Material : Paper(SW3B(B)) TYPE a b c HUMIDITY INDICATOR Aluminum Vinyl Bag Reel DESI PAK PART NUMBER : LOT NUMBER : XXXXXXXXX X QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. RoHS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 8. soldering 10 sec. Max.Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder 10 sec. Max.Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 November 2007November 2007 www.ZLED.com www.ZLED.com 9. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice.