MP108A

MP108 APEX | Alldatasheet

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Technical content

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

FEATURES

• LOW COST
• HIGH VOLTAGE - 200 VOLTS
• HIGH OUTPUT CURRENT - 10 AMPS
• 100 WATT DISSIPATION CAPABILITY
• 300kHz POWER BANDWIDTH

APPLICATIONS

• INKJET PRINTER HEAD DRIVE
• PIEZO TRANSDUCER DRIVE
• INDUSTRIAL INSTRUMENTATION
• REFLECTOMETERS
• ULTRA-SOUND TRANSDUCER DRIVE

DESCRIPTION

The MP108 operational amplifier is a surface mount con - structed component that provides a cost effective solution in many industrial applications. The MP108 offers outstanding performance that rivals much more expensive hybrid compo - nents yet has a footprint of only 4 sq in. The MP108 has many optional features such as four-wire current limit sensing and external compensation. The 300 kHz power bandwidth and 10 amp output of the MP108 makes it a good choice for piezo transducer drive applications. The MP108 is built on a thermally conductive but electrically insulating substrate that can be mounted to a heat sink. EQUIVALENT CIRCUIT DIAGRAM 34-PIN DIP PACKAGE STYLE FD TYPICAL APPLICATION INKJET NOZZLE DRIVE The MP108's fast slew rate and wide power bandwith make it an ideal nozzle driver for industrial inkjet printers. The 10 amp output capability can drive hundreds of nozzles simultaneously. EXTERNAL CONNECTIONS

APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 ABSOLUTE MAXIMUM RATINGS SPECIFICATIONS MP108 • MP108A ABSOLUTE MAXIMUM RATINGS SPECIFICATIONS MP108 MP108A PARAMETER TEST CONDITIONS1 MIN TYP MAX MIN TYP MAX UNITS INPUT OFFSET VOLTAGE 1 5 * 3 mV OFFSET VOLTAGE vs. temperature Full temperature range 20 50 * * µV/°C OFFSET VOLTAGE vs. supply 20 * µV/V BIAS CURRENT, initial3 100 70 pA BIAS CURRENT vs. supply 0.1 * pA/V OFFSET CURRENT, initial 50 30 pA INPUT RESISTANCE, DC 10 11 * Ω INPUT CAPACITANCE 4 * pF COMMON MODE VOLTAGE RANGE +V B - 15 * V COMMON MODE VOLTAGE RANGE -V B + 15 * V COMMON MODE REJECTION, DC 92 * dB NOISE 1MHz bandwidth, 1kΩ RS 10 * µV RMS GAIN OPEN LOOP @ 15Hz R L = 10KΩ, CC = 10pF 96 * dB GAIN BANDWIDTH PRODUCT @ 1MHz C C = 10pF 10 * MHz PHASE MARGIN Full temperature range 45 * degrees OUTPUT VOLTAGE SWING I O = 10A +VS - 10 +V S - 8.6 * * V VOLTAGE SWING IO = -10A -VS + 10 -V S + 7 * * V VOLTAGE SWING IO = 10A, +VB = +VS +10V +V S - 1.6 * V VOLTAGE SWING IO = -10A, -VB = -VS -10V -VS + 5.1 * V CURRENT, continuous, DC 10 11 A SLEW RATE, AV = -20 CC = 10pF 150 170 * * V/µS SETTLING TIME, to 0.1% 2V Step 1 * µS RESISTANCE No load, DC 5 * Ω POWER BANDWIDTH 180VP-P C C = 10pF, +VS = 100V, -VS = -100V 300 * kHz POWER SUPPLY CURRENT, quiescent 50 65 * * mA THERMAL RESISTANCE, AC, junction to case5 Full temperature range, f ≤ 60Hz 1 * °C/W RESISTANCE, DC, junction to case Full temperature range, f < 60Hz 1.25 * °C/W RESISTANCE, junction to air Full temperature range 13 * °C/W TEMPERATURE RANGE, case -40 85 * * °C SUPPLY VOLTAGE, +V S to -VS 200V SUPPLY VOLTAGE, +VB +V S + 15V6 SUPPLY VOLTAGE, -VB -V S – 15V6 OUTPUT CURRENT, peak 12A, within SOA POWER DISSIPATION, internal, DC 100W INPUT VOLTAGE +V B to -VB TEMPERATURE, pin solder, 10s 225°C. TEMPERATURE, junction 2 150°C. TEMPERATURE RANGE, storage -40 to 105°C. OPERATING TEMPERATURE, case -40 to 85°C. NOTES: 1. Unless otherwise noted: T C=25°C, compensation CC=100pF, DC input specifications are value given, power supply voltage is typical rating. 2. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to achieve high MTBF. 3. Doubles for every 10°C of case temperature increase. 4. +V S and -VS denote the positive and negative supply voltages to the output stage. +VB and -VB denote the positive and negative supply voltages to the input stages. 5. Rating applies if the output current alternates between both output transistors at a rate faster than 60Hz. 6. Power supply voltages +V B and -VB must not be less than +VS and -VS respectively.

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com TYPICAL PERFORMANCE GRAPHSMP108 • MP108A

APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 OPERATING CONSIDERATIONS MP108 • MP108A This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice. MP108 REV C JANUARY 2005 © 2005 Apex Microtechnology Corp. GENERAL Please read Application Note 1 "General Operating Consid- erations" which covers stability, power supplies, heat sinking, mounting, current limit, SOA interpretation, and specification interpretation. Visit www.apexmicrotech.com for design tools that help automate tasks such as calculations for stability, internal power dissipation, current limit, heat sink selection, Apex's complete Application Notes library, Technical Seminar Workbook and Evaluation Kits. GROUND PINS The MP108 has two ground pins (pins 3, 32). These pins provide a return for the internal capacitive bypassing of the small signal portions of the MP108. The two ground pins are not connected together on the substrate. Both of these pins are required to be connected to the system signal ground. SAFE OPERATING AREA The MOSFET output stage of the MP108 is not limited by second breakdown considerations as in bipolar output stages. Only thermal considerations and current handling capabilities limit the SOA (see Safe Operating Area graph on previous page). The output stage is protected against transient flyback by the parasitic body diodes of the output stage MOSFET structure. However, for protection against sustained high energy flyback external fast-recovery diodes must be used. COMPENSATION The external compensation capacitor C C is connected between pins 5 and 6. Unity gain stability can be achieved with any capacitor value larger than 100pF for a minimum phase margin of 45 degrees. At higher gains more phase shift can usually be tolerated in most designs and the compensation capacitor value can be reduced resulting in higher bandwidth and slew rate. Use the typical operating curves as a guide to select C C for the application. An NPO (COG) type capacitor is required rated for the full supply voltage (200V). OVERVOLTAGE PROTECTION Although the MP108 can withstand differential input voltages up to ±25V, additional external protection is recommended. In most applications 1N4148 signal diodes connected anti-parallel across the input pins is sufficient. In more demanding applica- tions where bias current is important diode connected JFETs such as 2N4416 will be required. See Q1 and Q2 in Figure 1. In either case the differential input voltage will be clamped to ±0.7V. This is usually sufficient overdrive to produce the maximum power bandwidth. Some applications will also need over voltage protection devices connected to the power supply rails. Unidirectional zener diode transient suppressors are rec ommended. The zeners clamp transients to voltages within the power supply rating and also clamp power supply reversals to ground. Whether the zeners are used or not the system power supply should be evaluated for transient performance including power-on overshoot and power-off polarity reversals as well as line regulation. See Z1 and Z2 in Figure 1. POWER SUPPLY BYPASSING Bypass capacitors to power supply terminals +V S and -VS must be connected physically close to the pins to prevent local parasitic oscillation in the output stage of the MP108. Use electrolytic capacitors at least 10µF per output amp required. Bypass the electrolytic capacitors with high quality ceramic capacitors (X7R) 0.1µF or greater. In most applications power supply terminals +V B and -V B will be connected to +V S and -VS respectively. Supply voltages +VB and -VB are bypassed internally but both ground pins 3 and 32 must be connected to the system signal ground to be effective. In all cases power to the buffer amplifier stage of the MP108 at pins 8 and 25 must be connected to +V B and -VB at pins 4 and 30 respectively. Provide local bypass capacitors at pins 8 and 25. See the external connections diagram on page 1. FIGURE 1 OVERVOLTAGE PROTECTION FIGURE 2

4 WIRE CURRENT LIMIT

The two current limit sense lines are to be connected directly across the current limit sense resistor. For the current limit to work correctly pin 28 must be connected to the amplifier output side and pin 27 connected to the load side of the current limit resistor R LIM as shown in Figure 2. This connection will bypass any parasitic resistances RP, formed by socket and solder joints as well as internal amplifier losses. The current limiting resistor may not be placed anywhere in the output circuit except where shown in Figure 2. The value of the current limit resistor can be calculated as follows: RLIM = .65/ILIMIT BOOST OPERATION With the boost feature the small signal stages of the amplifier are operated at a higher supply voltages than the amplifierís high current output stage. +VB (pins 4,8) and -VB (pins 25,30) are connected to the small signal stages and +VS (pins 14-16) and -VS (pins 17-19) are connected to the high current output stage. An additional 10V on the +VB and -VB pins is sufficient to allow the small signal stages to drive the output stage into the triode region and improve the output voltage swing for extra efficient operation when required. When the boost feature is not needed +V S and -VS are connected to the +VB and -VB pins respectively. The +VB and -VB pins must not be operated at supply voltages less than +VS and -VS respectively. BACKPLATE GROUNDING The substrate of the MP108 is an insulated metal substrate. It is required that it be connected to signal ground. Connect pin 2 (back plate) to signal ground. The back plate will then be AC grounded to signal ground through a 1µF capacitor.