ME1310 KONTRON | Alldatasheet
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Technical content
Mobile Edge Computing Server for wide temperature range Embedded switch with network timing solution Daisy chain configuration connects multiple DUs together Compliant with any major vRAN software More cores, more memory, increased density
// 2 www.kontron.com ME1310 Flexible Edge Servers for rapid deployment of Telecom & 5G Services Kontron introduces the high-performance ME1310 edge server, designed to solve restricted space and power challenges by enabling complex applications closer to the network edge. The goal of Multi-Access Edge Computing is to decrease network congestion and improve the performance of applications by getting task processing closer to the user. Enable applications such as Radio Access Network (RAN), Artificial Intelligence, Data Caching, ultra-low latency, and high-bandwidth edge applications, among others. 3rd Gen Intel® Xeon® D Processor 2x PCIe Expansion Slots for Hardware Acceleration optional on-board Switch with PTP/SnycE and Ocxo holdover Long product lifecycle PRODUCT HIGHLIGHTS FRONT VIEW BACK VIEW
// 3 YOUR CONTACT Kontron America Inc.
9477 Waples Street
San Diego, CA 92121, USA T el.: + 1 888 294 4558 sales@us.kontron.com GLOBAL HEADQUARTERS Kontron Europe GmbH Gutenbergstraße 2
85737 Ismaning, Germany
T el.: + 49 821 4086-0 Fax: + 49 821 4086-111 info@kontron.com www.kontron.com www.kontron.com Copyright © 2022 Kontron. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized. Specifications are subject to change without notice. ME1310-20220211 - WMH TECHNICAL INFORMATION PROCESSOR 3rd Gen Intel® Xeon® D Processor MEMORY 8x DDR4 DIMM sockets, 4 channels @ up to 3200 MHz support up to 512 GByte (8x 64 GByte) STORAGE Storage options: - 4x M.2-2230 (up to 512GB each) NVMe, or - 2x M.2-2230 (up to 512GB each) NVMe and 2x M.2-2280 (up to 2TB each) NVMe4x M.2-2230 (up to 512GB each) RAID 1 and 10 (Intel vROC) NETWORKING (OPTIONS) Switch module - 4x SFP28 and 8x SFP+ Ports (4x 25Gb or 2x 25G + 7x 10G or 12x 10G firmware configurations) - Integrated Microchip 200Gb switch (VSC7558TSN) - 4X 25GE connections to 3rd Gen Intel® Xeon® D Processor integrated NIC controller TIMING AND SYNCHRONIZATION SyncE & PTP with T elecom profile performance Master and Boundary Clock modes Optional advanced OCXO to support 4 hours Hold-Over requirement Connector: 1x GNSS input (optional) and 1PPS output Hosted in integrated Microchip switch and telecom PLL 3rd Gen Intel® Xeon® D Processor integrated NIC controller 1588v2 support LOCAL DIAGNOSTIC PORTS 1x GE Copper Interface (shared Management port) (RJ-45) 1x Serial Console Port (RJ-45) 7x Dry contact alarm inputs (RJ-45) 2x USB 3.0 Interface to 3rd Gen Intel® Xeon® D Processor PCIe EXPANSION 2x Full Height, ¾ Length PCIe slots with x16 lanes (Gen4 32 GByte/s) Max Power PCIe 150 W (i.e: 2x 75 W PCIe add-in card) MANAGEMENT Independent management network support Redfish API, IPMI v2.0, SNMP, Web UI and independent network connectivity (Based on AST2600) Secure Remote Management Capabilities (Encrypted firmware, boot, storage, Secure Boot, Failsafe Boot) Using TPM version 2.0 Remote access using KVM & Virtual Media In-service Firmware Upgrade capability 7x Dry contact alarm inputs through an RJ-45 jack ENVIRONMENTAL PSU options: - AC: 115/230 V, 50/60 Hz - DC: -48 V (-40 VDC to -57 VDC) Operating temperature: - DC version: -40 °C to 65 °C (PCIe card selection could impact operating temperature range) - AC version: -5 °C to 65 °C (PCIe card selection could impact operating temperature range) 1U x 343 mm (13.5 in) deep and designed to be mounted in a 19” standard rack Front to back air flow Certification: UL/CSA, CE, BIS, UKCA, VCCI and CCC (on demand) 10-year lifecycle support