MCR22

MCR22 FOSHAN | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 TO-92 塑封封装单向可控硅。Thyristor in a TO-92 Plastic Package. 断态电压临界上升率高，大电流时正向导通电压低。 High dv/dt, very Low Forward “On” Voltage at High Current. 应用于高压控制电路。 Applied to high Voltage control circuit. PIN1：Anode PIN 2 ：Gate PIN 3 ：Cathode 放大及印章代码 / h FE Classifications & Marking 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g 1 23

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 测试条件 Test Conditions 数值 Rating 单位 Unit Repetitive peak off-state voltages VDRM， VRRM RGK=1K TC=25 to 125℃ MCR 22-2 MCR 22-3 MCR 22-4 MCR 22-6 MCR 22-8 100 200 400 600 V RMS on-state current IT(RMS) TA=80℃ 1.5 A Non-repetitive peak on-state current ITSM 1/2 Cycle, Sine Wave, 60Hz, TA=25℃ 15 A t for fusing I 2t t=8.3ms 0.9 A 2S Peak gate power P GM TA=25℃ 500 mW Peak Average power P G(AV) TA=25℃ 100 mW Peak gate current I FGM TA=25℃(300 µS,120 PPS) 0.2 A Peak Reverse Gate Voltage V RGM TA=25℃ 5.0 V Junction Temperature Tj -40～125 ℃ Storage Temperature Range Tstg -40～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Repetitive peak off-state current IDRM IRRM VAK=Rated VDRM or VRRM Tc =25℃ 10 μA Tc=+110℃ 200 On-state voltage V TM I TM=1.0A 1.2 1.7 V Gate trigger current I GT VAK=6.0Vdc, RL=100Ω Tc =25℃ 200 μA Tc=-40℃ 500 Gate trigger voltage V GT VAK=7.0Vdc, RL=100Ω Tc =25℃ 0.8 V Tc =-40℃ 1.2 Holding current I H V AK=12.0Vdc Tc =25℃ 2 5 mA Tc =-40℃ 10 Critical rate of rise of off-state voltage dv/dt T C=125℃ 25 V/us 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： MCR22： 为产品型号 2:   为规格代码 Note: BR: Company Code. MCR22: Product Type. 2: Specification Code **: Lot No. Code, code change with Lot No. MCR22 ** BR

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp.:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-92 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 编带包装 / A M M O Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 Outer Box 箱 TO-92 3,000 1 120 10 30,000 328×230×42 小箱 480×346×235， 大箱 547×407×268 使用说明 / N o t i c e s