MB1F FOSHAN | Alldatasheet
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MB1F~MB10F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 1 / 6 0.8A 表面贴装玻璃钝化整流桥，薄型 MBF 封装。 0.8A Surface Mount Glass Passivated Bridge Rectifier，MBF thin package。 玻璃钝化芯片，反向电压：100V~1000V，正向电流：0.8A，浪涌电流大，适用于表面贴装。无卤产 品。 Glass Passivated Chip Junction, Reverse Voltage:100to1000V, Forward Current:0.8 A, High Surge Current Capability, Designed for Surface Mount Application.Halogen free product. 一般用途. General purpose. 印章代码 / M a r k i n g 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g
MB1F~MB10F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 UnitMB1F MB2F MB4F MB6F MB8F MB10F Maximum Recurrent Peak Reverse Voltage VRRM 100 200 400 600 800 1000 V Maximum RMS Voltage V RMS 70 140 280 420 560 700 V Maximum DC Blocking Voltage V DC 100 200 400 600 800 1000 V Average Rectified Output Current at Ta = 50℃ IF(AV) 0.8 A Peak Forward Surge Current,8.3ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) I FSM 30 A Typical Junction Capacitance1） Cj 13 pF Typical Thermal Resistance2） RθJA 95 /W℃ RθJL 30 Operating and Storage Temperature Range Tj ,Tstg -55~+150 ℃ Note: 1. Measured at 1MHz and applied reverse voltage of 4 V D.C. 2. Mounted on glass epoxy PC board with 4×(5×5mm2）copper pad. 参数 Parameter 符号 Symbol 测试条件 Test Conditions 数值 Rating 单位 Unit Max Instantaneous Forward Voltage VF I F=0.8A 1.1 V Maximum DC Reverse Current at Maximum DC Blocking Voltage I R Ta=25℃ 5.0 μA Ta=125℃ 40 μA 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)
MB1F~MB10F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve
MB1F~MB10F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions
MB1F~MB10F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions
MB1F~MB10F Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 MBF 5000 2 10000 5 50000 13 〞×15 336X336X40 345X345X235 使用说明 / N o t i c e s