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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- Save space on printed circuit boards
- Glass passivated chip junction
- High surge overload rating: 30A peak Mechanical Data
- Case: Molded plastic body over passivated junctions
- Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026
- High temperature soldering guaranteed : 260°C/10 seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg) tension
- Mounting position: Any.
- Weight: 0.22gram, 0.078 oz. Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified.) Type Parameter Symbol MB05S T05 MB1S T05 MB2S T05 MB4S T05 MB6S T05 MB8S T05 MB10S T05 Units Repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum instantaneous forward voltage drop per leg at 0.4A VF 1 V Maximum average forward output rectified current @Ta=40°C IF(AV) 0.5 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 30 A TA=25°C Maximum DC reverse current at rated DC blocking voltage per leg TA=100°C IR 5 500 μA Typical thermal resistance per leg RθJA RθJL RθJC 7 5 2 0 2 4 °C /W Typical diode junction capacitance @f=1MHz and applied 4V reverse voltage CJ 25 pF Operating junction and storage temperature range TJ ;Tstg -55 ~ +150 °C
CYStech Electronics Corp. Spec. No. : C769HT Issued Date : 2014.04.29 Revised Date : 2014.06.06 Page No. : 2/ 3 MB05ST05 thru MB10ST05 CYStek Product Specification
Ordering Information
(Pb-free lead plating and halogen-free package) 750 pcs / tape & reel Characteristic Curves Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T8 : 750 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name
CYStech Electronics Corp. Spec. No. : C769HT Issued Date : 2014.04.29 Revised Date : 2014.06.06 Page No. : 3/ 3 MB05ST05 thru MB10ST05 CYStek Product Specification MBST Dimension Marking : MBST Plastic Surface Mounted Package CYStek Package Code: HT X X Date Code Device Name Type MB05ST05 MB1ST05 MB2ST05 MB4ST05 MB6ST05 MB8ST05 MB10ST05 Marking MB05S MB1S MB2S MB4S MB6S MB8S MB10S Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :
- Lead : Pure tin plated.
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
- CYStek reserves the right to make changes to its products without notice.
- CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.