MAS9275 MAS | Alldatasheet

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Technical content

DA9275.007

19 February 2004

1 (10) MAS9275 IC FOR 10.00 – 36.00 MHz VCXO

  • Square Wave (CMOS) Output
  • Very Low Phase Noise
  • Low Power
  • Wide Supply Voltage Range
  • Very High Level of Integration
  • Low Cost

DESCRIPTION

MAS9275 is a VCXO IC to be used in making VCXO modules for telecommunication and other applications. To build a complete VCXO only one additional component, a crystal, is needed. FEATURES APPLICATIONS

  • Very small size
  • Minimal current consumption
  • Wide operating temperature range
  • Phase noise <-130 dBc/Hz at 1 kHz offset
  • Square wave (CMOS) output
  • VCXO for telecommunications systems
  • VCXO for set-top boxes
  • VCXO for MPEG BLOCK DIAGRAM VSS VC VDD OUT X'Tal MAS9275 PD

DA9275.007 2 (10) PIN DESCRIPTION Pin Description Symbol x-coordinate y-coordinate Note Crystal/Varactor Oscillator Input X1 209 161 Voltage Control Input VC 425 165 Power Supply Ground VSS 600 175 Buffer Output OUT 1029 1030 Power Supply Voltage VDD 841 1016 Tri State PD 379 1028 Crystal Oscillator Output X2 197 1030 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is t he first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom co rner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Note Supply Voltage V DD - VSS -0.3 6.0 V Input Pin Voltage V SS -0.3 V DD + 0.3 V Power Dissipation P MAX 100 mW Storage Temperature T ST -55 120 oC ESD Rating HBM 2 kV RECOMMENDED OPERATION CONDITIONS Parameter Symbol Conditions Min Typ Max Unit Note Supply Voltage V DD 2.5 2.8 5.5 V 1) Supply Current I DD VDD = 2.8 V 2.3 mA Operating Temperature T OP -40 +85 oC Voltage Control Line Impedance VcIMP MAS9275A, MAS9275B

1 M Ω

Crystal Pulling Sensitivity S 30 ppm/pF Crystal Load Capacitance C L V C = 1.65 V MAS9275A1 MAS9275B2 MAS9275B3 MAS9275C2 MAS9275C3 MAS9275C4 10.5 10.5 10.5 pF Note 1: It is recommend to connect a 1 nF capacitor to the VDD pin (either in a module or in an end application). Note 2: Crystal Load Capacitance is typically 8.2 pF, when VC = 2.5 V.

DA9275.007 3 (10)

ELECTRICAL CHARACTERISTICS

(recommended operation conditions) Parameter Symbol Min Typ Max Unit Note Frequency Range f o 10.00 36.00 MHz 1) Voltage Control Range V C 0 VDD V Voltage Control Sensitivity V CSENS 100 ppm/V 2) Output Voltage (10 pF, VDD 2.7 V) V out 2.3 Vpp Output Voltage (10 pF, VDD 5.0 V) V out 4.5 Vpp Rise and Fall Time (10 - 50 pF) 10 ns Output Symmetry 40-60 % Startup Time T START 2 ms Tri State Output Buffer ON State OFF State PD 1.6 0.55 VDD V 3) Tri State Output Buffer ON State OFF State PD 1.6 VDD 0.55 V 4) Note 1: An RS < 20 Ω crystal provides 36 MHz maximum frequency. With an R S = 70 Ω crystal the maximum frequency is typically 20 MHz. Note 2: VC sensitivity value depends on the crystal used. With a 30 ppm/pF crystal typical values are: A1 > 100 ppm/V, B2 > 75 ppm/V, B3 > 60 ppm/V, C2 > 75 ppm/V, C3 > 60 ppm/V, C4 > 55 ppm/V. Note 3: MAS9275A, MAS9275B Note 4: MAS9275C Note 5: If the Tri State Output Buffer is floating (i.e., PD pin not connected), the oscillator is ON in all models (MAS9275A, -B and -C) IC OUTLINES Note 1: MAS9275 pads are round with 80 µm diameter at opening. Note 2: Die map reference is the actual left bottom corner of the sawn chip. VDDPDX2 VSSX1 VC MAS9275 OUT 1220 µm 1290 µm Die map reference

DA9275.007 4 (10) EXTERNAL COMPONENT SELECTION MAS9275 requires a minimum number of external components for proper operation. Quartz Crystal The MAS9275 VCXO function consists of the external crystal and the integrated VCXO oscillator circuit. To assure the best system performance (frequency pull range) and reliability, a crystal device with the recommended parameters (shown below) must be used, and the layout guidelines in the following section must be followed. The frequency of oscillation of a quartz crystal is determined by its “cut” and by the load capacitors connected to it. MAS9275 incorporates on-chip variable load capacitors that “pull” (change) the frequency of the crystal. T he crystal specified for use with the MAS9275B2 is designed to have zero frequency error when the total of on-chip + stray capacitance is 10 pF (See Note 1 on page 2 for other capacitance options). Recommended Crystal Parameters: Initial Accuracy at 25°C ±20 ppm Temperature Stability ±30 ppm Crystal Load Capacitance 10 pf (See Note1 below) Crystal Shunt Capacitance, C0 2 pF Typical C0/C1 Ratio Typical ≤ 300 Equivalent Series Resistance 20 Ω max. Crystals with higher ESR c an be used if frequency is < 36 MHz. See Note 2 under Electrical Characteristics on Page 3. The external crystal must be connected as close to t he chip as possible and should be on the same side of the PCB as the MAS9275. There should be no vias between t he crystal pins and the X1 and X2 device pins. There should be no signal traces underneath or close to the crystal. Note 1. If the crystal with a load other than the nomi nal Crystal Load Capacitance as defined in Recommended Operation Conditions on page 2 is used with MAS9275, t he crystal has to have frequenc y offset in order to have the nominal frequency at VC = 1.65 V or at VC = 2. 5 V. Please see table below for offset frequencies vs. crystal load. (Values are for a typical crystal with S = 30 ppm/pF.) Crystal frequency 19.68 19.68 27.00 40.00 MHz Crystal Load 8 10 12.5 16 pF VC voltage Offset in crystal frequency A1 1.65 V +0 -60 -150 -240 ppm B2, C2 1.65 V +60 0 -75 -180 ppm B3, C3, C4 1.65 V +85 +25 -50 -155 ppm B3, C3, C4 2.5 V +30 -30 -105 -210 ppm Note: 19.68 MHz crystal with 10 pF load capacitance used with MAS9275B2 or C2 may not require frequency offset because of small deviation For example: For application using MAS9275B2 or C2 with nominal frequency of 27.00 MHz a crystal with 12.5 pF load has to have a frequency of 27.00 MHz + ((27.00 MHz/106) x (- 90)) = 26.99757 MHz.

Figure 2. Modulation response (gain).

DA9275.007 6 (10) SAMPLES IN SB20 DIL PACKAGE DEVICE OUTLINE CONFIGURATION M AS9275 YYW W XXXXX.X 12 0 VSS OUT Top marking: YYWW = Year, Week XXXXX.X = Lot number VDDVC PD MSOP 8 VC VSS PD VDD OUT Top View 9275 BX YWW B = product version X = MAS internal code Y = year WW= week pin 1

DA9275.007 7 (10) b e D A A Gage plane QP Section A - A E1 E A (b) c c1 R R1L F G M N Land Pattern Recommendation PACKAGE (MSOP-8) OUTLINE Symbol Min Nom Max Unit A 1.10 mm A1 0 0.15 mm A2 0.75 0.85 0.95 mm b 0.22 0.38 mm b1 0.22 0.30 0.33 mm c 0.08 0.23 mm c1 0.08 0.18 mm D 3.00 BSC mm E 4.90 BSC mm E1 3.00 BSC mm e 0.65 BSC mm F 4.8 mm G 0.65 mm L (Terminal length for soldering) 0.40 0.60 0.80 mm M 0.41 mm N 1.02 mm P 0° 8° Q 0.25 BSC mm R 0.07 mm R1 0.07 mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. All measurement according to JEDEC standard MO-187.

DA9275.007 8 (10) A Section A-A W AO T BO KO DO PO F E User Direction of Feed Pin 1 Designator SOLDERING INFORMATION Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220°C Maximum Temperature 240°C Maximum Number of Reflow Cycles 2 Reflow profile Thermal profile param eters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% EMBOSSED TAPE SPECIFICATIONS Dimension Min/Max Unit Ao 5.00 ±0.10 mm Bo 3.20 ±0.10 mm D1 1.50 min mm E 1.75 mm F 5.50 ±0.05 mm Ko 1.45 ±0.10 mm Po 4.0 mm P1 8.0 ±0.10 mm P2 2.0 ±0.05 mm T 0.3 ±0.05 mm

DA9275.007 9 (10) REEL SPECIFICATIONS Dimension Min Max Unit A 330 mm B 1.5 mm C 12.80 13.50 mm D 20.2 mm N 50 mm W1 (measured at hub) 12.4 14.4 mm W2 (measured at hub) 18.4 mm Trailer 160 mm Leader 390, of which minimum 160 mm of empty carrier tape sealed with cover tape mm Weight 1500 g DA B C N Tape Slot for Tape Start ComponentsTrailer Leader Carrier Tape Cover Tape StartEnd

5000 Components on Each Reel

Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative

DA9275.007 10 (10)

ORDERING INFORMATION

Product Code Product Typical Vc-Sensitivity (with 30 ppm/pF crystal) Package MAS9275A1TG00 IC FOR 2.8 V VCXO Negative PD logic > 100 ppm/V EWS tested wafers 215 µm MAS9275A1SM06 IC FOR 2.8 V VCXO Negative PD logic > 100 ppm/V MSOP-8, T&R/5000 pcs/r. MAS9275B2TG00 IC FOR 3.3 V VCXO Negative PD logic > 75 ppm/V EWS tested wafers 215 µm MAS9275B2SM06 IC FOR 3.3 V VCXO Negative PD logic > 75 ppm/V MSOP-8, T&R/5000 pcs/r. MAS9275B3TG00 IC FOR 5.0 V VCXO Negative PD logic > 60 ppm/V EWS tested wafers 215 µm MAS9275B3SM06 IC FOR 5.0 V VCXO Negative PD logic > 60 ppm/V MSOP-8, T&R/5000 pcs/r. MAS9275C2TG00 IC FOR 3.3 V VCXO Positive PD logic > 75 ppm/V EWS tested wafers 215 µm MAS9275C2SM06 IC FOR 3.3 V VCXO Positive PD logic > 75 ppm/V MSOP-8, T&R/5000 pcs/r. MAS9275C3TG00 IC FOR 5.0 V VCXO Positive PD logic > 60 ppm/V EWS tested wafers 215 µm MAS9275C3SM06 IC FOR 5.0 V VCXO Positive PD logic > 60 ppm/V MSOP-8, T&R/5000 pcs/r. MAS9275C4TG00 IC FOR 5.0 V VCXO Positive PD logic > 55 ppm/V EWS tested wafers 215 µm MAS9275C4SM06 IC FOR 5.0 V VCXO Positive PD logic > 55 ppm/V MSOP-8, T&R/5000 pcs/r. Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringem ent. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.