MAS9280 MAS | Alldatasheet

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Technical content

DA9280.003

13 July 2006

1 (8) MAS9280 IC FOR 18.00 – 40.00 MHz VCTCXO

  • Min. Supply Voltage 2.4 V
  • Max. Frequency 40 MHz
  • True Sine Wave Output
  • Frequency Stability +/- 1.5 ppm
  • Suitable Also for Low Pull Crystals
  • Very Low Phase Noise

DESCRIPTION

The MAS9280 is an integrated circuit well suited to build VCTCXO for mobile communication. Temperature calibration is achieved in three calibration temperatures only. The trimming is done through a serial bus and the calibration informatio n is stored in an internal PROM. This means no rework for trimming is needed. To build a VCTCXO additionally only a crystal is required. The compensation method is fully analog, working continuously without generating any steps or other interference. Divider function allows the usage of double frequency crystal. FEATURES APPLICATIONS

  • Very small size
  • Minimum Vdd 2.4V
  • No voltage reference capacitor needed
  • Phase noise <-110 dBc/Hz at 100 Hz and <-130 dBc/Hz at 1kHz @ 32 MHz crystal
  • Programmable VC-sensitivity
  • Oscillator frequency output f o /2 versions available
  • VCTCXO for mobile phones
  • VCTCXO for other telecommunications systems BLOCK DIAGRAM T Vref TMux Σ DA CLK PV VSS VC VDD f(T) f(T) CUB INF SENS LIN 8CDAC1 CDAC2 TE1 TE2 OUT MAS9280 This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice.

DA9280.003 2 (8) PIN DESCRIPTION Pin Description Symbol MAS9280A1/ A3 /B1/B3 x-coordinate MAS9280A1/ A3 /B1/B3 y-coordinate MAS9280A2 /B2 x-coordinate MAS9280A2 /B2 y-coordinate Power Supply Voltage VDD 268 1320 268 1320 Programming Input PV 604 1320 604 1320 Serial Bus Clock Input CLK 1047 1320 1420 1320 Serial Bus Data Input DA 1420 1320 1047 1320 Temperature Output TE1 1848 1320 1848 1320 Crystal/Varactor Oscillator Input X2 1048 164 1048 164 Voltage Control Input VC 268 164 268 164 Crystal Oscillator Output X1 796 164 796 164 Buffer Output OUT 2020 164 2020 164 Power Supply Ground VSS 1701 164 1701 164 Test Multiplexer Output TE2 2058 1320 2058 1320 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. Note: Test Multiplexer Output is for testing only and must not be connected in module. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit Note Supply Voltage V DD - V SS -0.3 6.0 V Input Voltage V IN V SS -0.3 V DD + 0.3 V 1) Power Dissipation P MAX 20 mW Storage Temperature T ST -55 150 oC Note 1: Not valid for programming pin PV RECOMMENDED OPERATION CONDITIONS Parameter Symbol Conditions Min Typ Max Unit Note Supply Voltage V DD 2.4 2.6 5.0 V Supply Current I CC Vdd = 2.8 Volt 1.8 mA Operating Temperature T OP -40 +85 oC Load Capacitance C L 8 pF 1 Load Capacitance C L 10 pF 2 Crystal Pulling Sensitivity S 18 30 ppm/pF Crystal Rs C RS 50 Ω 3 Note 1: MAS9280A1, MAS9280A2 and MAS9280A3 with CDAC1 = 160 …200 Note 2: MAS9280B1, MAS9280B2 and MAS9280B3 with CDAC1 = 160 …200 Note 3: At 30 MHz to 40 MHz maximum Rs 30 ohm.

DA9280.003 3 (8)

ELECTRICAL CHARACTERISTICS

Parameter Symbol Min Typ Max Unit Note Frequency Range f o 18.00 40.00 MHz 1) Voltage Control Range V C 0 VDD V Voltage Control Sensitivity (VCR = 0) V CSENS 10 ppm/V Voltage Control Sensitivity (VCR = 1) V CSENS 5 ppm/V 2) Frequency vs. Supply Voltage df o ±0.2 ppm 3) Frequency vs. Load Change df o ±0.2 ppm 4) Output Voltage (10k Ω // 10 pF) Vout 0.6 1.0 Vpp Harmonic Distortion -25 dBc Compensation Range ± 2.5 ppm T C -40 85 oC Compensation Range ± 2.0 ppm T C -30 85 oC Compensation Range ± 1.5 ppm T C -25 75 oC Compensation Range Linear Part a1 -0.7 0.0 ppm/K Compensation Inflection Point INF 25 31 oC Compensation Range Cubic Part a3 95 ppm 2/K 3 Compensation CDAC1 (8 Bit) C X1 C10 C10 + 10.6 pF 5) Compensation CDAC2 (2 Bit) C X2 C20 C20 + 3 pF 6) Start up Time T START 2 ms Note 1: MAS9280B1, MAS9280B2 and MAS9280B3 maximum frequency are 36MHz Note 2: default Note 3: VDD +/- 5% Note 4: R=10 kohm +/- 10%, C=10 pF +/- 10% Note 5: typ C10 = 9.7pF Note 6: typ C20 = 15.2pF IC OUTLINES Note 1 : MAS9280A and MAS9280B pads are round with 80 µm diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. MAS9280A1/A3 /B2/B3 VDD PV CLK DA TE1 X2 VC X1 OUT VSS TE2 1484um 2194um Die map reference MAS9280A2 /B2 VDD PV DA CLK TE1 X2 VC X1 OUT VSS TE2 1484um 2194um Die map reference

DA9280.003 4 (8) SAMPLES IN SBDIL 20 PACKAGE DEVICE OUTLINE CONFIGURATION M AS9280A1 YYW W XXXXX.X 1 20 Top marking: YYWW = Year, Week XXXXX.X = Lot number TE1 TE2 VDD VC VSS DA CLK PV OUT MSOP10 TE2 DA CLK PV VDD OUT VSS VC Top View 9280 AX YW W A = product version X = pad layout and fo version Y = year WW= week

DA9280.003 5 (8) PACKAGE (MSOP-10) OUTLINE Symbol Min Nom Max Unit A -- -- 1.10 mm A1 0.00 -- 0.15 mm A2 0.75 0.85 0.95 mm b 0.15 -- 0.30 mm c 0.08 0.23 mm c1 0.08 0.18 mm D 3.00 BSC mm E 4.90 BSC mm E1 3.00 BSC mm e 0.50 BSC mm F 4.8 mm G 0.50 mm L (Terminal length for soldering) 0.40 0.60 0.80 mm L1 0.95 REF L2 0.25 BSC mm M 0.41 mm N 1.02 mm S 0.50 Mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA. b1 B (b) c c1 F G M N Land Pattern Recommendation See Detail A Detail A 5-15 Degrees Gauge Plane Seating Plane 0 - 8 Degrees B E L D A e S E AA Section B - B

DA9280.003 6 (8) SOLDERING INFORMATION Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220 °C Maximum Temperature 240 °C Maximum Number of Reflow Cycles 2 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µ m, material Sn 85% Pb 15% EMBOSSED TAPE SPECIFICATIONS Dimension Min/Max Unit Ao 5.00 ±0.10 mm Bo 3.20 ±0.10 mm D1 1.50 min mm E 1.75 mm F 5.50 ±0.05 mm Ko 1.45 ±0.10 mm Po 4.0 mm P1 8.0 ±0.10 mm P2 2.0 ±0.05 mm T 0.3 ±0.05 mm Section A-A A W AO T BO KO DO PO F E User Direction of Feed Pin 1 Designator

DA9280.003 7 (8) REEL SPECIFICATIONS Dimension Min Max Unit A 330 mm B 1.5 mm C 12.80 13.50 mm D 20.2 mm N 50 mm W1 (measured at hub) 12.4 14.4 mm W2 (measured at hub) 18.4 mm Trailer 160 mm Leader 390, of which minimum 160 mm of empty carrier tape sealed with cover tape mm Weight 1500 g DA B C N Tape Slot for Tape Start Components Trailer Leader Carrier Tape Cover Tape Start End

5000 Components on Each Reel

Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative

DA9280.003 8 (8)

ORDERING INFORMATION

Product Code Product Comments Package MAS9280A1TG00 IC FOR VCTCXO For 8pF Crystal load E WS Tested wafers 215 µm MAS9280A1SM06 IC FOR VCTCXO For 8pF Crystal load MSOP-10, T&R/5000 pcs/r. MAS9280A2TG00 IC FOR VCTCXO, CLK and DA pins swapped round For 8pF Crystal load EWS Tested wafers 215 µm MAS9280A3TG00 IC FOR VCTCXO, frequency output fo /2 For 8pF Crystal load EWS Tested wafers 215 µm MAS9280A3SM06 IC FOR VCTCXO, frequency output fo /2 For 8pF Crystal load MSOP-10, T&R/5000 pcs/r. MAS9280B1TG00 IC FOR VCTCXO For 10pF Crystal load E WS Tested wafers 215 µm MAS9280B1SM06 IC FOR VCTCXO For 10pF Crystal load MSOP-10, T&R/5000 pcs/r. MAS9280B2TG00 IC FOR VCTCXO, CLK and DA pins swapped round For 10pF Crystal load EWS Tested wafers 215 µm MAS9280B3TG00 IC FOR VCTCXO, frequency output fo /2 For 10pF Crystal load EWS Tested wafers 215 µm MAS9280B3SM06 IC FOR VCTCXO, frequency output fo /2 For 10pF Crystal load MSOP-10, T&R/5000 pcs/r. Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.