MAS1017 MAS

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 6

Technical content

DA1017.002

29 May, 2002

1(6) MAS1017 AM Receiver IC

  • High Sensitivity
  • Very Low Power Consumption
  • Wide Supply Voltage Range
  • Power Down and Power Up Control
  • High Selectivity by Crystal Filter

DESCRIPTION

The MAS1017 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz. There are only a few external components needed. The circuit has a preamplifier, wide range automatic gain control, demodulator and output comparator built in. The output signal can be processed directly with an additional digital circuitry to extract the data from the received signal. FEATURES APPLICATIONS

  • Highly Sensitive AM Receiver
  • Wide Supply Voltage Range
  • Very Low Power Consumption
  • Power Down and Power Up Control
  • Only a Few External Components Needed
  • Wide Frequency Range from 40 kHz to 100 kHz
  • High Selectivity by Quartz Crystal Filter
  • Time Signal Receiver for DCF77 (Germany) BLOCK DIAGRAM AGC Amplifier Demodulator Comparator Power Supply/Biasing RFI DCF PUP QIQO PDNVDD VSS AGC DEC

DA1017.002 2(6) PAD LAYOUT DIE size = 2.09 x 1.59 mm; PAD size = 100 x 100 µm Substrate is connected to VDD. Please make sure that VDD is bonded first. Note: Coordinates are calculated using VDD as a centre point. Pad Identification Name X-coordinate Y-coordinate Note Power Supply Voltage VDD 0 µm 0 µm Demodulator Capacitor DEC 244 µm 8 µm AGC Capacitor AGC 520 µm 8 µm Power Up Input PUP 759 µm 8 µm 1 DCF Signal Output DCF 1075 µm 8 µm 2 Quarz Filter Input QI 1038 µm 1625 µm Quarz Filter Output QO 760 µm 1625 µm Power Down Input PDN 483 µm 1625 µm 3 Receiver Input RFI 243 µm 1625 µm Power Supply Ground VSS -15 µm 1605 µm Notes: 1) See power down control table below. - Internal pull-down resistor > 1 M Ω to VSS 2) DCF = VSS when carrier amplitude at maximum; DCF = VDD when carrier amplitude is reduced (25% modulated) - the output is a current source/sink with |I OUT| > 5 µA - at power down the output is high impedance 3) See power down control logic table below. - Internal pull-up resistor > 1MΩ to VDD PDN PUP Power Down VSS VSS NO VSS VDD NO VDD VSS YES (In power down if both PDN and PUP are left unconnected) VDD VDD NO VDD DEC QI AGC DCF VSS RFI PDN QO 1588 µm 2094 µm MAS1017 PUP

DA1017.002 3(6) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Supply Voltage V DD-VSS -0.3 5.0 V Input Voltage V IN V SS-0.3 V DD+0.3 V Power Dissipation P MAX 100 mW Operating Temperature T OP -20 70 oC Storage Temperature T ST -40 120 oC

ELECTRICAL CHARACTERISTICS

Operating Conditions: VDD = 1.4V, Temperature = 25°C Parameter Symbol Conditions Min Typ Max Unit Operating Voltage V DD 1.10 3.60 V Current Consumption I DD 40 100 µA Stand-By Current I DDoff 0.1 µA Input Range f IN 40 100 kHz Sensitivity V IN 0.001 20 mVrms Input Levels |lIN|<0.5 µA VIL VIH VDD – 0.3 0.3 V Output Current VOL<0.2 VDD;VOH >0.8 VDD |IOUT| 5 µA Output Pulse T 0 50 140 ms T 1 150 230 ms Startup Time T Start 8 s Output Delay Time T Delay 50 ms

DA1017.002 4(6) TYPICAL APPLICATION Note 1: Ferrite Antenna and Crystal The crystal as well as ferrite antenna frequencies are c hosen according to the time signal system frequency. DCF-77 transmitter frequency is 77.5 kHz. The ferrite antenna center frequency has to be tuned to 77.5 kHz. The optimal crystal frequency is 77503 Hz but also 77500 Hz crystal can be used. The shunt capacitance of the crystal should be as close as possible to internal s hunt capacitance compensation capacitor of 0.75 pF for optimal noise filtering. Note 2: AGC and DEC Capacitors The AGC and DEC capacitors should have low leakage cu rrents due to very small 40 nA signal currents through the capacitors. The insulation resistance of these capacitors should be higher than 70 M Ω. Also probes with at least 100 MΩ impedance should be used for voltage probing of AGC and DEC pins. AGC Amplifier Demodulator Comparator Power Supply/Biasing RFI DCF QIQO VDD AGC DECVSS Receiver output Ferrite- Antenna 77503 Hz +1.1V to +3.6V PUP 470 nF 47 nF PDN

DA1017.002 5(6) SAMPLES IN SBDIL 20 PACKAGE NC 1 VDD 2 NC 3 DEC 4 AGC 5 NC 6 PUP 7 DCF 8 NC 9 NC 10

20 VSS

18 RFI

17 PDN

Pin Name Pin Type Function Note NC 1 VDD 2 P Positive power supply NC 3 DEC 4 AO Demodulator capacitor AGC 5 AO AGC capacitor NC 6 PUP 7 AI Power up input 1 DCF 8 DO Demodulator output 2 NC 9 NC 10 NC 11 NC 12 QI 13 AI Quartz filter input NC 14 3 QO 15 AO Quartz filter output NC 16 PDN 17 AI Power down input 4 RFI 18 AI Receiver input NC 19 VSS 20 G Power supply ground Notes: 1) See power down control table on page 2. - Internal pull-down resistor > 1 M Ω to VSS 2) DCF = VSS when carrier amplitude at maximum; DCF = VDD when carrier amplitude is reduced (25% modulated) - the output is a current source/sink with |I OUT| > 5 µA - at power down the output is high impedance 3) Pin 14 between quartz crystal filter pins must be c onnected to VSS to eliminate package leadframe parasitic capacitances disturbing the crystal filter performance. All other NC (Not Connected) pins are also recommended to be connected to VSS to minimize noise coupling. 4) See power down control logic table on page 2. - Internal pull-up resistor > 1MΩ to VDD

DA1017.002 6(6)

ORDERING INFORMATION

Product Code Product Package Comments MAS1017ATC1 AM-Receiver IC Wafer, EWS-tested wafer thickness 400 µm MAS1017ATC1-1 AM-Receiver IC Dice on sticky tape wafer thickness 400 µm, sawn wafer, tape ring 6”, non UV tape, tape not expanded Please contact Micro Analog Systems Oy for other wafer thickness, sawn wafer delivery as well as SMD package options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O.Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringem ent. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.