MAS6501

MAS6501 MAS | Alldatasheet

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Technical content

DA6501.001

27 October 2008

1 (16) MAS6501 16-Bit Analog-to-Digital Converter

• Standby Current Consumption 0.1 µA
• Low Supply Current
• Low Power Consumption
• Resolution 16 Bits
• Ratiometric ∆∆ ∆∆ΣΣ ΣΣ ADC
• ENOB 14 Bits
• Serial Data Output (I 2C bus)

DESCRIPTION

The MAS6501 is a 16 bit Analog-to-Digital Converter (ADC), which employs a delta-sigma ( ∆Σ ) conversion technique. With the linear input signal range of 282 mV PP its resolution is 14 bits. The MAS6501 is designed especially to meet the requirement for low power consumption, thus making it an ideal choice for battery powered systems. The MAS6501 is equipped with a standby function, i.e. the ADC is in power down between each conversion. By utilizing this and overall low power consumption, current consumption values of 1.6 µA (one pressure conversion in a second with full 14-bit accuracy) or less can be achieved. The MAS6501 has an on-chip second order decimator filter to process the output of the secon d order ∆Σ -modulator. The ADC also has two selectable conversion ranges with two optional offset levels. A bi-directional 2-wire I 2C bus is used for configuring conversion parameters, starting conversion and reading out the A/D conversion result. MAS6501 has one input channel suitable for piezo resistive pressure sensor. In addition to pressure measurement configuration the device can be configured to temperature measurement. FEATURES APPLICATIONS

• Low Standby Current Consumption 0.1 µA Typ
• Low Supply Current: 0.2 µA..1.6 µA
• Supply Voltage: 2.0 V…3.6 V
• Ratiometric ∆Σ Conversion
• Two Input Signal Ranges (VDD=2.35V): /square4 325 mV PP , 98 mV PP
• Two Optional Offsets (VDD=2.35V): /square4 123 mV, 33 mV
• Over Sampling Ratio: 512, 256, 128, 64
• Conversion Times 32.2 ms…2.5 ms
• In Fast Mode: Over Sampling Ratio 64, Conversion Time 2.5 ms, Resolution 10 Bits
• Good Noise Performance due to ∆Σ Architecture
• 2-Wire I 2C Interface
• Battery Powered Systems
• Low Frequency Measurement Applications
• Pressure and Temperature Measurement
• Current/Power Consumption Critical Systems
• Industrial and Process Control Applications in Noisy Environments I2C is a registered trademark of Philips Inc. This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice.

Figure 1. MAS6501 block diagram operate under these conditions, but it will not be destroyed. cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms. The device performance may deteriorate in the long run if the Recommended Operation Conditions limits are continuously exceeded.

DA6501.001 3 (16)

ELECTRICAL CHARACTERISTICS

TA = -20 oC to +60 oC, Typ T A = 25 oC, VDD = 2.35 V, R sensor = 4.5k Ω unless otherwise noted Parameter Symbol Conditions Min Typ Max Unit Average ADC Current during Conversion Time (see Conversion Time at bottom) I CONV Max value at VDD = 3.6 V 30 50 µA Average ADC Current in Pressure and Temperature Measurement during Conversion Period (no sensor current included) I ADC 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 k Ω, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 0.5 0.25 0.13 0.07 0.9 0.5 0.3 0.2 µA Average Supply Current in Pressure Measurement during Conversion Period (including sensor bridge current) I SAVG_P 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 k Ω, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 1.6 0.8 0.5 0.3 2.5 1.3 0.7 0.4 µA Average Supply Current in Temperature Measurement (including sensor bridge current) I SAVG_T 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 k Ω, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 0.9 0.5 0.3 0.2 1.5 0.8 0.4 0.3 µA Peak Supply Current During Pressure Measurement I SC VDD = 2.35 V, R sensor = 4.5 k Ω 0.52 mA Peak Supply Current During Temperature Measurement I SC VDD = 2.35 V, R sensor = 4.5 k Ω 0.19 mA Standby Current I SS VDD = 2.35 V 0.1 0.5 µA Conversion Time t CONV MCLK = 32768 Hz, XENMCLKDIV=1 OSR=512 OSR=256 OSR=128 OSR=64 16.1 8.3 4.4 2.5 ms Note: XENMCLKDIV refer to the I 2C serial interface control bits, see table 1 on page 5.

DA6501.001 4 (16) TA = -20 oC to +60 oC, Typ T A = 25 oC, VDD = 2.35 V, R sensor = 4.5k Ω unless otherwise noted Parameter Symbol Conditions Min Typ Max Unit

16 Bit Resolution

ISR = 325 mV ISR = 98 mV 4.9 1.5 µV Accuracy ISRLIN = 282 mV, OSR = 512 ISRLIN = 85 mV, OSR = 512 5.1 µV Integral Nonlinearity INL 4 LSB Differential Nonlinearity DNL 3 LSB ENOB (Effective Number of Bits) ISRLIN = 282 mV OSR=512 OSR=256 OSR=128 OSR=64 Bit External Clock Signal MCLK 30000 32768 35000 Hz Delay Between End of Conversion and ADC Result Read-Out t DEL MCLK = 32768 Hz 0.1 ms Duty Cycle of MCLK DUTYC Master Clock Division Enab led XENMCLKDIV=0 60/40 50/50 40/60 % Serial Data Clock SCL 400 kHz Input Signal Conversion Range ISR ISCR = 1 ISCR = 0 325 mV Linear Input Signal Conversion Range ISRLIN ISCR = 1 ISCR = 0 282 mV Output Code Values 0 65152 Temperature Measurement Resistors R -15% 7710 17000 3073 17000 +15% Ω Temperature Measurement Resistors Temp Coefficient TC R TBD -280 TBD ppm / ° C Note: ISCR refer to the I 2C serial interface control bits, see table 1 on page 5. TBD = To Be Defined

Table 1. MAS6501 control register bit description

5 SCO Start Conversion 0

4 PTS Pressure/Temperature

3 ISCR Input Signal

2 XENMCLKDIV Enable Master Clock

1 XOSENABLE Enable offset 0

0 OSSELECT Offset value selection 1

that conversion has been accomplished. and resistors R1, R2, R3 and R4). ISCR selects between two A/D conversion ranges. disabled and fCLK(INT) = fMCLK.

Table 2. MAS6501 device address configure the device to proper measurement setup. 16-bit A/D conversion result. Table 3. MAS6501 internal register addresses

I2C SERIAL INTERFACE CONTROL... must be held stable in SDA pin when SCL is high. Figure 2. I2C protocol definitions SDA) for one SCL clock cycle. sequence is illustrated in Table 4. Table 4. MAS6501 I2C bus write sequence bits ended with stop command (see figure 2). conversion is done and data is ready for reading.

I2C SERIAL INTERFACE CONTROL... Table 5. MAS6501 I2C bus single register (address Ax) read sequence bits Table 6. MAS6501 I2C bus MSB (first) and LSB (second) A/D conversion result read sequence cannot be removed by averaging.

DA6501.001 9 (16)

APPLICATION INFORMATION

Figure 3. Resistive sensor connection circuit four resistors (R1, R2, R3, R4) are inside the IC.

DA6501.001 10 (16) MAS6501 PAD LAYOUT GND COMMON PI NI TE2 TE1 EOC VDD SDA SCL MCLK XCLR 6501 1740 µµ µµ m 2090 µµµµ m 6501 Die dimensions 1740 µm x 2090 µm; round PAD ∅ 80 µ m Note: Because the substrate of the die is internally conn ected to GND, the die has to be placed over a GND plate on PCB or left floating. Please make sure tha t GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in the center of the silicon die. Pad Identification Name X-coordinate Y-coordinate End of Conversion EOC -713 µ m -839 µ m Power Supply VDD -450 µ m -839 µ m Master Clock MCLK -200 µ m -839 µ m Clear I2C, Stop Conversion XCLR -18 µ m -839 µ m Serial Bus Data Input/Output SDA 318 µ m -839 µ m Serial Bus Clock SCL 726 µ m -839 µ m Supply Ground GND -713 µ m 839 µ m Sensor Ground COMMON -450 µ m 839 µ m ADC Positive Input PI -200 µ m 839 µ m Test Pin 2 TE2 -18 µ m 839 µ m ADC Negative Input NI 318 µ m 839 µ m Test Pin 1 TE1 726 µ m 839 µ m Note: Test pins TE1 and TE2 must be left floating.

DA6501.001 11 (16) SAMPLES IN SBDIL 20 PACKAGE PI 1 COMMON 2 GND 3 NC 4 NC 5 NC 6 NC 7 NC 8 EOC 9 VDD 10

20 TE2

18 TE1

14 SCL

13 SDA

12 XCLR

11 MCLK

Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number xx = Sample Version MAS6501xx YYWW XXXXX.X PIN DESCRIPTION Pin Name Pin Type Function Notes PI 1 AI ADC Positive Input COMMON 2 AI Sensor Ground GND 3 G Supply Ground 4 NC 5 NC 6 NC 7 NC 8 NC EOC 9 DO End of Conversion VDD 10 P Power Supply MCLK 11 DI Master Clock XCLR 12 DI Clear I2C, Stop Conversion SDA 13 DI/O Serial Bus Data Input/Output SCL 14 DI Serial Bus Clock 15 NC 16 NC 17 NC TE1 18 DI/O Test Pin 1 Pin must be left floating NI 19 AI ADC Negative Input TE2 20 DI Test Pin 2 Pin must be left floating A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected

DA6501.001 12 (16) PIN CONFIGURATION & TOP MARKING FOR PLASTIC TSSOP-16 PACKAGE EOC VDD MCLK XCLR SDA SCL GND COMMON PI TE2 NI TE1 6501zz YYWW Top Marking Definitions: zz = Version YYWW = Year Week PIN DESCRIPTION Pin Name Pin Type Function Note 1 NC EOC 2 DO End of Conversion VDD 3 P Power Supply MCLK 4 DI Master Clock XCLR 5 DI Clear I2C, Stop Conversion SDA 6 DI/O Serial Bus Data Input/Output SCL 7 DI Serial Bus Clock 8 NC TE1 9 DI/O Test Pin 1 Pin must be left floating NI 10 AI ADC Negative Input TE2 11 DI Test Pin 2 Pin must be left floating PI 12 AI ADC Positive Input COMMON 13 AI Sensor Ground 14 NC GND 15 G Supply Ground 16 NC A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected

DA6501.001 13 (16) PACKAGE (TSSOP-16) OUTLINES Dimension Min Max Unit A 6.40 BSC mm B 4.30 4.50 mm C 5.00 BSC mm D 0.05 0.15 mm E 1.10 mm F 0.19 0.30 mm G 0.65 BSC mm H 0.18 0.28 mm I 0.09 0.20 mm I1 0.09 0.16 mm J 0.19 0.30 mm J1 0.19 0.25 mm K 0° 8 ° L 0.24 0.26 mm M (The length of a terminal for soldering to a substrate) 0.50 0.75 mm N 1.00 REF mm O 12 ° P 12 ° Dimensions do not include mold flash, protrusions, or gate burrs. All dimensions are in accordance with JEDEC standard MO-153. B A C Pin 1 D Seating Plane E HGF B BDetail A L K M N P O Detail A I I1 J J1 Section B-B

DA6501.001 14 (16) SOLDERING INFORMATION N For Pb-Free, RoHS Compliant TSSOP-16 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260 °C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin EMBOSSED TAPE SPECIFICATIONS Dimension Min Max Unit A0 6.50 6.70 mm B0 5.20 5.40 mm D0 1.50 +0.10 / -0.00 mm D1 1.50 mm E1 1.65 1.85 mm F1 7.20 7.30 mm K0 1.20 1.40 mm P 11.90 12.10 mm P0 4.0 mm P2 1.95 2.05 mm S1 0.6 mm T 0.25 0.35 mm W 11.70 12.30 mm P A A Section A - A W Tape Feed Direction T Tape Feed Direction Pin 1 Designator

DA6501.001 15 (16) REEL SPECIFICATIONS Dimension Min Max Unit A 330 mm B 1.5 mm C 12.80 13.50 mm D 20.2 mm N 50 mm (measured at hub) 12.4 14.4 mm (measured at hub) 18.4 mm Trailer 160 mm Leader 390, of which minimum 160 mm of empty carrier tape sealed with cover tape mm Weight 1500 g DA B C N Tape Slot for Tape Start Components Trailer Leader Carrier Tape Cover Tape Start End

2000 Components on Each Reel

Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative

DA6501.001 16 (16)

ORDERING INFORMATION

Product Code Product Description MAS6501BA1WA300 16-Bit A/D-Converter EWS-tested waf er, Thickness 400 µm. MAS6501BA1ST206 16-Bit A/D-Converter TSSOP-16, Pb-f ree, RoHS compliant, Tape & Reel Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data shee t in order to improve the design or performance and to supply the best possible product s. Micro Analog Systems Oy assumes no responsibilit y for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specifi ed in this data sheet, and makes no claim that the circuits are free from patent infrin gement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.