MAS6250

MAS6250 MAS | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 24

Technical content

DA6250.007

13 April, 2018

1 (24) MAS6250 Piezo and LED Driver with Synchronous Boost DC/DC Converter

• Both Single Ended and Differential Output
• Up to 35Vpp Output from min 1.2V Supply
• External Drive and Self-Drive Audio Frequency Control for 2-Terminal Piezo
• LED Driver
• High Efficiency
• External Schottky Diode Not Needed
• Small 0806 Size 2.2H Inductor

DESCRIPTION

MAS6250 is a piezo and LED driver device that can drive piezo outputs up to 35 Vpp and sink up to 15mA LED current using wide range of supply voltage 1.2V…5.5V. An internal high efficiency DC/DC boost converter with adjustable output voltage generates up to 1 7.5V supply voltage f or the piezo driver . Internal over voltage protection (OVP) allows also operating without external feedback resistors and when connecting FB feedback pin to GND. This configuration reduces external part count further and provides highest output voltage 17.5V typically. MAS6250 uses synchronous type boost DC/DC converter which makes external Schottky diode unnecessary. Thus MAS6250 is a low part count and low-cost solution for a high sound pressure piezo driver. Two piezo driver outputs (VOP, VON) allow driving piezo in both single -ended and differential bridge -tied load (BTL) configurations. MAS6250 supports external drive and self-drive modes for a 2-terminal piezo. In external drive mode (ROSC=VIN) an external audio frequency is fed directly to digital audio input pin (DIN) allowing external system to drive desired frequency tones to the piezo. The first rising edge of DIN pin only turns on the DC /DC boost converter but the piezo outputs are still kept disabled. When disabled the piezo driver outputs (VOP, VON) are pulled actively to GND . Continuous logic high level at DIN inputs keeps DC/DC converter on and allows using MAS6250 as DC/DC power supply which is controlled from DIN pin. At the second rising edge of DIN pin the pi ezo driver outputs are activated and DIN signal is transferred to the piezo output VOP. The same signal is inverted into output VON for using differential output. The boost DC/DC converter and piezo driver disable signal (shutdown mode) will be generated while the signal at DIN and CTRL has been at low mostly for 15ms. In self -drive mode the audio frequency is produced from precise internal oscillator which is adjustable by just one external resistor. Self -drive mode is selected by connecting frequency adjustment resistor from ROSC pin to GND . In self -drive mode the DIN pin is used to control internal oscillator on (DIN=HIGH) and off (DIN=LOW) and the oscillator signal is transf erred to the piezo outputs. MAS6250 has ILED pin for sinking up to 15mA current from series connected LEDs. The current sink is enabled by CTRL pin which can be also controlled by PWM signal in LED dimming purposes. The DC/DC converter is turned on if either one of DIN or CTRL is high. MAS6250 is available in a small 3x3x0.75 mm QFN-16 package. FEATURES APPLICATIONS

• Thin 3x3x0.75 mm QFN-16 package
• Wide Supply Voltage Range 1.2V…5.5V
• Both Single Ended and Differential Output
• External Drive and Self-Drive Modes
• Up to 15mA LED Driver
• External Schottky Diode Not Needed
• Small 0806 Size 2.2H Inductor
• Low External Part Count
• Over Voltage Protection (OVP)
• Piezo Buzzers
• Sport Watches
• Smoke Alarms
• White Goods
• Alarm Clocks
• Handheld GPS devices
• Portable Devices with Sound Feature

DA6250.007 2 (24) ABSOLUTE MAXIMUM RATINGS All voltages with respect to ground. Parameter Symbol Conditions Min Max Unit Supply Voltage VIN -0.3 6 V High Voltage Pins VOUT, VOP, VON, SW, ILED -0.3 20 V Voltage Range for Input Pins DIN, CTRL -0.3 6 V FB, RLED -0.3 3 V ROSC -0.3 VIN + 0.3 V Piezo Buffer Output Short-Circuit Duration tSC VOP=VON=GND Note 1 Continuous Storage Temperature Note 2 -40 +125 oC Junction Temperature -40 +150 oC ESD Rating VHBM Human Body Model (HBM) Note 3 ±1000 V VCDM Charged Device Model (CDM) Note 4 ±500 V Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed. Note 1: The VOUT pin is not allowed to be shorted to ground. Note 2: On chip EEPROM memory storing factory trimming values has data retention of minimum 10 years at +125°C. Note 3: JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. Note 4: JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

DA6250.007 3 (24) RECOMMENDED OPERATING CONDITIONS All voltages with respect to ground. Parameter Symbol Conditions Min Typ Max Unit Operating Supply Voltage VIN Note 1 1.2 3.0 5.5 V Steady State Operating Output Voltage VOUT Note 2 VIN+1V V Operating Ambient Temperature TA Note 3 -40 +27 +85 °C Operating Junction Temperature TJ Note 4 -40 +125 °C Thermal Shutdown Temperature TTSD Rising temperature (device off) Falling temperature (device on) +140 +125 +150 +135 +160 +145 °C Inductor Specification L Shielded inductor Note 5 1.5 2.2 3 H IRATED L=2.2H 500 600 mA RDC L=2.2H 0.18 0.5 Ω Peak Inductor Current IL_PEAK VIN=3.0V, VOUT=15V, L=2.2H 480 mA Piezo Input Signal Frequency FDIN 0.2 10 kHz LED PWM Dimming Signal FCTRL CTRL signal frequency 150 3000 Hz tON_CTRL CTRL signal ON-time 30 µs Note 1: Achieving minimum operating supply voltage 1.2V requires a low loss inductor. See note 5 for two low loss inductor examples. When driving LEDs or resistive load the minimum supply voltage can be higher than specified here. See figures 20-22 for output current drive capability at LED and resistive loading. Note 2: For stable start-up and good output regulation the steady state output voltage (VOUT) should meet following condition; VOUT≥VIN+1V. When driving one or two LEDs the output voltage may not satisfy this requirement but depending on input voltage. In this case there can be added resistor in series with LED(s) to rise output voltage above the minimum requirement. Note 3: Ambient temperature plus self-heating should not exceed +125°C in extended periods of time to not degrade EEPROM memory data retention time. Additionally user has to note that the on chip thermal shutdown feature can turn off the device at minimum +140°C rising temperature point. Note 4: On chip EEPROM memory storing factory trimming values has data retention of minimum 10 years at +125°C. Note 5: For small PCB footprint a 2x1.6x0.7mm (0806) size 2.2H inductor is available from Murata (LQM2MPN2R2MEH#). For high efficiency a 3x3x1.2mm size 2.2µH inductor is available from Taiyo Yuden (NR3012T2R2M).

DA6250.007 4 (24)

ELECTRICAL CHARACTERISTICS

TA = -40°C to +85°C, typical values at TA = 27°C, VIN = 3.0 V, L = 2.2 H, CIN = 10 F, COUT = 100 nF, CLOAD = 15 nF, DIN = 3.4 kHz; unless otherwise specified Parameter Symbol Conditions Min Typ Max Unit Undervoltage-Lockout Threshold Levels UVLORISE UVLOFALL Turn on level at VDD rising Turn off level at VDD falling 1.10 1.05 1.15 1.10 1.20 1.15 V Over Voltage Protection Voltage VOVP No feedback resistors R1, R2 17 17.5 18 V Output Voltage at Current Load VOUT VIN=3V, VOUT=15V (R2/R1=36.5) ILOAD=15mA (RLOAD=1kΩ) V Piezo Driver Output Voltage at Capacitive Load VOP, VON VIN=3V, VOUT=15V (R2/R1=36.5) VON: CLOAD=15nF VOP-VON: CLOAD=15nF VON: CLOAD=75nF, COUT=470nF VOP-VON: CLOAD=75nF, COUT=470nF 29.8 14.9 Vpp VIN=1.2V, VOUT=15V (R2/R1=36.5) VON: CLOAD=15nF VOP-VON: CLOAD=15nF VON: CLOAD=75nF, COUT=470nF VOP-VON: CLOAD=75nF, COUT=470nF 14.7 29.2 13.6 23.6 Vpp Feedback Voltage VFB 0.38 0.4 0.42 V LED Current Resistor Voltage VRLED 0.19 0.2 0.21 V Shutdown Current ISD CTRL=DIN=LOW, VOUT=17.5V (no external feedback resistors) Note 1 0.11 2 µA Quiescent Current IQ CTRL=LOW, DIN=HIGH, no load VOUT=15V (R2/R1=36.5) VIN=3.0V, VIN=4.2V, Note 2 400 140 µA Current Consumption at Shorted Piezo Driver Outputs ISC_VIN VIN=3.0V, VOP=VON=GND 176 mA Current Consumption IIN VIN=3V, VOUT=15V (R2/R1=36.5) VON: CLOAD=15nF VOP-VON: CLOAD=15nF VON: CLOAD=75nF, COUT=470nF VOP-VON: CLOAD=75nF, COUT=470nF 6.5 mA VIN=1.2V, VOUT=15V (R2/R1=36.5) VON: CLOAD=15nF VOP-VON: CLOAD=15nF VON: CLOAD=75nF, COUT=470nF VOP-VON: CLOAD=75nF, COUT=470nF 160 mA LED loading ILED=10mA (RLED=20Ω) VIN=3V, VOUT=6.4V (two 3V LEDs) VIN=3V, VOUT=9.4V (three 3V LEDs) VIN=3V, VOUT=12.4V (four 3V LEDs) mA Efficiency LED LED loading VIN=3V, VOUT=6.4V (two 3V LEDs) ILED=10mA, Note 3 Boost DC/DC Converter Switch ON- Resistance RDS(ON)_LS Low side switch VIN=3V, VOUT=15V, TA = 27°C 0.55 1.0 RDS(ON)_HS High side switch VIN=3V, VOUT=15V, TA = 27°C 1.1 2.5 Note 1: DIN has been low at least 15 ms. This shutdown current value is valid for case when no external feedback resistors are connected. When using external VOUT adjusting feedback resistors (R1, R2) the shutdown current will increase by amount of IEXT_FB = VIN/(R1+R2) since VOUT follows VIN voltage when the device is in shutdown. To keep the shutdown current low the external feedback resistance (R1+R2) should be kept close to 10M level. Note 2: Current consumption when boost converter is active but outputs are not loaded Note 3: 3x3x1.2mm size 2.2µH inductor from Taiyo Yuden (NR3012T2R2M)

DA6250.007 5 (24) TA = -40°C to +85°C, typical values at TA = 27°C, VIN = 3.0 V, L = 2.2 H, CIN = 10 F, COUT = 100 nF, CLOAD = 15 nF, DIN = 3.4 kHz; unless otherwise specified Parameter Symbol Conditions Min Typ Max Unit Audio Signal Frequency from Internal Oscillator FAUDIO Oscillator frequency adjustment resistor; VIN=3V, TA = 27°C FAUDIO=415.6kHz*kΩ/ROSC, ROSC=412kΩ ROSC=280kΩ ROSC=210kΩ ROSC=165kΩ ROSC=140kΩ ROSC=133kΩ ROSC=127kΩ ROSC=121kΩ ROSC=118kΩ ROSC=105kΩ, Note 1 3.33 1.0 1.5 2.0 2.5 3.0 3.1 3.3 3.43 3.5 4.0 3.5 kHz DC/DC Converter Startup-Up Time tSTART-UP VOUT=15V (R2/R1=36.5) VIN=3.0V VIN=1.2V 250 650 µs Output Rise/Fall Time tSLEW VIN=3V, VOUT=15V (R2/R1=36.5) VON: CLOAD=15nF VOP-VON: CLOAD=15nF VON: CLOAD=75nF, COUT=470nF VOP-VON: CLOAD=75nF, COUT=470nF 100 µs Shutdown Delay tOFF Time before device off mode after both DIN and CTRL have gone to LOW 7 10 15 ms Control Input Threshold VIH DIN and CTRL pins, Note 2 0.9 V VIL DIN and CTRL pins 0.4 V Control Input Current IIH DIN, CTRL = 3V DIN, CTRL = 0.4V, Note 3 0.01 1 µA IIL DIN, CTRL = 0V 0.01 1 µA Note 1: The external ROSC resistor adjusts oscillator bias current which sets the oscillator frequency. The oscillator frequency is not available from the OSC pin. Note 2: Control inputs can be driven even from low supply voltage controller due to low 0.9V VIH min threshold. Note 3: DIN and CTRL pins have active pull-down by 400kΩ which disabled to save current when inputs are pulled high.

Figure 1. External drive mode driving piezo in differential configuration by DIN control voltage to 17.5V when the feedback resistors are left out which also reduces external part count. Figure 2. External drive mode driving piezo in single-ended configuration by DIN control

Figure 3. External drive mode with 15V DC/DC output driving piezo in differential configuration by DIN control Figure 4. External drive mode driving piezo and two series 10mA LEDs by DIN and CTRL controls

Figure 5. External drive mode driving piezo and four series 10mA LEDs by DIN and CTRL controls Figure 6. MAS6250 circuit for driving only series connected LEDs by CTRL control

Figure 7. Self-drive mode driving piezo in differential configuration by DIN on/off control Figure 8. Self-drive mode driving piezo in differential configuration by VDD on/off control the over voltage that the piezo element could generate in a mechanical shock.

Figure 9. Self-drive mode with 15V DC/DC output driving piezo in differential configuration by VDD on/off Figure 10. Self-drive mode driving piezo and two series 10mA LEDs by DIN and CTRL controls

Figure 12. MAS6250 as +15V DC/DC power supply with DIN pin enable/disable control drive capability at LED and resistive loading.

MAS6250 operating modes are controlled by ROSC, DIN and CTRL pins as follows. Table 1. Operating modes Note 6: SELF drive mode selected by connecting frequency adjustment resistor from ROSC pin to GND. ROSC pin to GND) the oscillator is enabled (on) when the DIN is set high. power supply (see figure 12). are disabled and DC/DC converter is turned o ff after keeping DIN=LOW for typ 10ms as illustrated in figure 14. audio frequency signal to the piezo.

Figure 13. Enabling buffer outputs at rising edge of the 2nd DIN pulse Figure 14. Disabling buffer outputs after power down delay capacitors values are shown in the table 2. Table 2. Recommended capacitor values also lengthens output voltage rise time.

OVP voltage regardless of the FB pin connection. Table 3. Feedback resistor (R1, R2) and DC/DC boost output voltage (VOUT) examples Table 4. LED current setting resistor examples values. Internal oscillator is factory trimmed to produce 3.435kHz frequency when using 1 21kΩ ROSC resistor. Table 5. Self-drive mode oscillator resistor and output frequency examples

Figure 15. Piezo driver outputs at VIN=3V, VOUT=15V, DIN=3.4kHz, CLOAD=15nF, COUT=100nF Figure 16. Piezo driver outputs at VIN=3V, VOUT=15V, DIN=3.4kHz, CLOAD=75nF, COUT=470nF

DA6250.007 16 (24) TYPICAL CHARACTERISTICS (continued) Figure 1 7. Piezo driver and boost D C/DC output start-up in self -drive mode at VIN=1.2 V, VOUT=15V, FAUDIO=3.4kHz (ROSC=121kΩ), CLOAD=15nF Figure 1 8. Piezo driver and boost D C/DC output start -up in self -drive mode at VIN=3V, VOUT=15V, FAUDIO=3.4kHz (ROSC=121kΩ), CLOAD=15nF

Figure 19. Output voltage at differential and single-ended piezo loading; VOUT=15V, DIN=3.4kHz, CLOAD=15nF Figure 20. Current consumption at differential and single -ended piezo loading ; VOUT=15V, DIN=3.4kHz,

Figure 21. LED current drive capability over VIN; four LEDs (VOUT=11.7V), ILED=10mA Figure 22. LED current drive capability over VIN; four LEDs (VOUT=12.4V), ILED=15mA

Figure 23. DC/DC converter output drive capability for a resistive loading at VOUT=15V (R2/R1=36.5) regulation resistive loading as follows.

example of figure 3 application circuit which includes output voltage adjustment resistors R1 and R2. Figure 24. PCB layout example Table 6. PCB layout example component details

DA6250.007 21 (24) DEVICE OUTLINE CONFIGURATION Top Marking Information: 6250 = Product Number VVV = Version Number YWW = Year Week QFN-16 3.0x3.0x0.75 PIN DESCRIPTION Pin Name Pin Type Function Note RLED 1 AIO LED current adjustment resistor ILED 2 AO LED current sink GND 3-4 G Supply ground pin VOUT 5-6 AO Boost DC/DC converter voltage output PS 7 P Power save pin 1 VIN 8 P Positive supply voltage input SW 9-10 AO Boost DC/DC converter switch VOP 11 AO Inverted piezo driver output VON 12 AO Non-inverted piezo driver output ROSC 13 AIO Self-drive oscillator frequency adjustment resistor 2 DIN 14 DI DC/DC and Piezo Drive ON (HIGH) / OFF (LOW) control CTRL 15 DI LED current sink ON (HIGH) / OFF (LOW) control FB 16 AI Boost DC/DC converter output voltage feedback input EXP_PAD - G Exposed thermal pad connected to GND 3 G = Ground, P = Power, D = Digital, A = Analog, I = Input, O = Output Note 1: Normally the PS pin is connected to VIN . This offers reduced power consumption as part of electrical charge from piezo load is transferred back to input. In case the VOUT voltage is below 7V the PS pin should be connected GND for best efficiency. For example when driving only one or two 3V LEDs the PS pin should be connected to GND. See figures 4 and 10. Note 2: For external drive mode connect ROSC to VIN. For self-drive mode connect frequency adjustment resistor from ROSC pin to GND. Note 3: On PCB the exposed thermal pad must be connected to GND plane using thermal vias functioning as thermal heat sink.

DA6250.007 22 (24) PACKAGE (QFN-16 3X3x0.75) OUTLINE Symbol Min Nom Max Unit PACKAGE DIMENSIONS A 0.7 0.75 0.8 mm A1 --- 0.035 0.05 mm b 0.2 0.25 0.3 mm c 0.203 REF mm D 3 BSC mm E 3 BSC mm e 0.5 BSC mm J (Exposed.pad) 1.6 1.7 1.8 mm K (Exposed.pad) 1.6 1.7 1.8 mm L 0.35 0.4 0.45 mm h 0.2 0.25 0.3 mm Dimensions do not include mold or interlead flash, protrusions or gate burrs.

DA6250.007 23 (24) QFN-16 3X3x0.75 PCB LAND PATTERN Notes

• I/O lands should be 0.2mm longer than QFN pads and extend the same 0.2mm outside package outline
• exposed pad land size should be the same as QFN exposed pad size
• solder resist opening should be 120m…150m larger than the land size resulting in 60m…75m clearance between copper land and solder resist

DA6250.007 24 (24)

ORDERING INFORMATION

Product Code Product Package Comments MAS6250BA2Q1306 Piezo and LED Driver with Synchronous Boost DC/DC Converter QFN-16 3.0x3.0x0.75, Pb Free, RoHS Compliant Tape and Reel 3000 pcs / r Contact Micro Analog Systems Oy for bare die delivery options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kutomotie 16 FI-00380 Helsinki, FINLAND Tel. +358 10 835 1100 http://www.mas-oy.com NOTICE Micro Analog Systems Oy (MAS) reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. MAS assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and MAS makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. MAS products are not authorized for use in safety-critical applications (such as life support) where a failure of the MAS product would reasonably be expected to cause severe personal injury or death. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety- related requirements concerning their products and any use of MAS products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by MAS. Further, Buyers must fully indemnify MAS and its representatives against any damages arising out of the use of MAS products in such safety-critical applications. MAS products are neither designed nor intended for use in military/aerospace applications or environments. Buyers acknowledge and agree that any such use of MAS products which MAS has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. MAS products are neither designed nor intended for use in automotive applications or environments. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, MAS will not be responsible for any failure to meet such requirements.