MAS1175 MAS | Alldatasheet

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Technical content

1 (9) DA1175.008

13 July, 2006

IC FOR 10.00 – 20.00 MHz VCTCXO

  • Low Power
  • Wide Supply Voltage Range
  • True Sine Wave Output
  • Very High Level of Integration
  • Electrically Trimmable
  • Very Low Phase Noise
  • Low Cost

DESCRIPTION

The MAS1175 is an integrated circuit well suited to build VCTCXO for mobile communication. Only two external components are needed. Temperature calibration is achieved with three calibration poin ts only. The trimming is done through a serial bus and the calibration information is stored in an interna l PROM. To build a VCTCXO only two additional components, a varactor and a crystal are needed. The compensation method is fully analog. IC compensation work is continuous without generating any steps or other interferences. FEATURES APPLICATIONS

  • Very small size
  • Minimum current draw
  • Wide operating temperature range
  • Phase noise <-130 dBc/Hz at 1 kHz offset
  • VCTCXO for mobile phones
  • VCTCXO for other telecommunications systems BLOCK DIAGRAM MAS1175 T Vref TMux Σ DA CLK PV VSS VC VDD f(T) f(T) CUB INF SENS LIN 8CDAC1 CDAC2 TE1 TE2 OUT

2 (9) DA1175.008 Pin Description Symbol x-coordinate y-coordinate Power Supply Voltage VDD 263 1330 Programming Input PV 503 1326 Serial Bus Clock Input CLK 745 1321 Serial Bus Data Input DA 1001 1321 Temperature Output TE1 1246 1325 Test Multiplexer Output TE2 1454 1325 Voltage Control Input VC 190 231 Crystal Oscillator Output X1 398 231 Crystal/Varactor Oscillator Input X2 1355 231 Power Supply Ground VSS 1828 242 Buffer Output OUT 2031 231 Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit Note Supply Voltage V DD - V SS -0.3 6.0 V Input Voltage V IN V SS -0.3 V DD + 0.3 V 1) Power Dissipation P MAX 20 mW Storage Temperature T ST -55 150 oC Note: Not valid for programming pin PV RECOMMENDED OPERATION CONDITIONS Parameter Symbol Conditions Min Typ Max Unit Supply Voltage V DD 2.7 2.8 5.5 V Supply Current I CC Vcc = 2.8 Volt 1.8 mA Operable Temperature T C -30 +85 oC Storage Temperature T S Relative humidity = 15%…70% -5 +40 oC Crystal Pulling Sensitivity S 30 ppm/pF Load Capacitance C L 10 pF

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ELECTRICAL CHARACTERISTICS

Parameter Symbol Min Typ Max Unit Note Frequency Range f o 10.00 20.00 MHz Voltage Control Range V C 0 Vdd Voltage Control Sensitivity V CSENS 10 ppm/V Output Voltage (10k Ω // 10 pF) Vout 1.0 Vpp Compensation Range ± 2.5 ppm T C -30 85 oC Compensation Range ± 2.0 ppm T C -25 75 oC Compensation Range Linear Part a1 -0.7 0.0 ppm/K Compensation Inflection Point INF 25 31 oC Compensation Range Cubic Part a3 95 ppm 2/K 3 Compensation CDAC1 (8 Bit) C X1 C10 C10 + 18 pF 2) Compensation CDAC2 (2 Bit) C X2 C20 C20 + 4 pF 3) Startup Time T START 2 ms Note 2: typ C10 = 14pF Note 3: typ C20 = 5pF (varactor capacitance has to be added) IC OUTLINES Note 1: MAS1175A pads are round with 95 µm diameter at opening. Note 2: Pins PV and TE1 shall not be connected and pins CLK and DA can either be connected to VSS or left open in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. VDD PV CLK DA TE1 TE2 VC X1 X2 VSS OUT MAS1175 2234 µm 1556 µm Die map reference

4 (9) DA1175.008 DEVICE OUTLINE CONFIGURATION MSOP10 (SnPb) TE2 DA CLK PV VDD OUT VSS VC Top View A = product version Y = year WW= week MSOP10 (Green) TE2 DA CLK PV VDD OUT VSS VC 1175 A = product version Y = year WW= week G=Green/RoHs Compliant A G YW W 1175 AYW W

5 (9) DA1175.008 PACKAGE (MSOP-10) OUTLINE Symbol Min Nom Max Unit A -- -- 1.10 mm A1 0.00 -- 0.15 mm A2 0.75 0.85 0.95 mm b 0.15 -- 0.30 mm c 0.08 0.23 mm c1 0.08 0.18 mm D 3.00 BSC mm E 4.90 BSC mm E1 3.00 BSC mm e 0.50 BSC mm F 4.8 mm G 0.50 mm L (Terminal length for soldering) 0.40 0.60 0.80 mm L1 0.95 REF L2 0.25 BSC mm M 0.41 mm N 1.02 mm S 0.50 Mm Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA. b1 B (b) c c1 F G M N Land Pattern Recommendation See Detail A Detail A 5-15 Degrees Gauge Plane Seating Plane 0 - 8 Degrees B E L D A e S E AA Section B - B

6 (9) DA1175.008 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 2*220 °C Maximum Temperature 240 °C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org Seating Plane Co-planarity max 0.08 mm Lead Finish Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15% N For Pb Free, RoHS Compliant MSOP-10 Resistance to Soldering Heat According to RSH test IEC 68-2-58/20 Maximum Temperature 260 °C Maximum Number of Reflow Cycles 3 Reflow profile Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org Lead Finish Solder plate 7.62 - 25.4 µm, material Matte Tin

7 (9) DA1175.008 EMBOSSED TAPE SPECIFICATIONS Dimension Min/Max Unit Ao 5.00 ±0.10 mm Bo 3.20 ±0.10 mm D1 1.50 min mm E 1.75 mm F 5.50 ±0.05 mm Ko 1.45 ±0.10 mm Po 4.0 mm P1 8.0 ±0.10 mm P2 2.0 ±0.05 mm T 0.3 ±0.05 mm Section A-A A W AO T BO KO DO PO F E User Direction of Feed Pin 1 Designator

8 (9) DA1175.008 B 1.5 mm C 12.80 13.50 mm D 20.2 mm N 50 mm W1 (measured at hub) 12.4 14.4 mm W2 (measured at hub) 18.4 mm Trailer 160 mm Leader 390, of which minimum 160 mm of empty carrier tape sealed with cover tape mm Weight 1500 g DA B C N Tape Slot for Tape Start Components Trailer Leader Carrier Tape Cover Tape Start End

5000 Components on Each Reel

Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative

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ORDERING INFORMATION

Product Code Product Package Comments MAS1175ATB1 IC FOR VCTCXO Tested wafers, 480 µm Die Size 2.233x1.556 mm MAS1175ASM1-T IC FOR VCTCXO MSOP10 Tape & Reel MAS1175A1SN06 IC FOR VCTCXO Green MSOP-10, Pb Free, RoHS Compliant Tape & Reel Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.