LT251A SHARP | Alldatasheet
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In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device spcification sheets before using any SHARP device. n Features \ Operation by small magnet due to high sensitivity Operating point<30mT \ Combining a GaAs Hall device and an IC in a compact package (2.9X1.5X1.1mm) \ Wide operation temperature range obtained by GaAs Hall device (-20 to +125˚C) \ Long life time due to noncontact-type n Applications \ FDD \ HDD \ Water meter \ Car stereo \` Microswitch, etc. n Outline Dimensions (Unit : mm) LT251A LT251AHall IC GaAs Hall IC for Noncontact Swich (Unidirectional magnetic field-type) n Operating Explanation As for dimensions of tape-packaged products, refer to page 44 . 2.7±0.3 1.5±0.2 0.6 0.40.4 0.4 1.9 2.9±0.2 0.850.95 2.9±0.2 4-R0.2 SZ 0.6 0.6 0.30.8 (0to0.15) 0.16 +0.10 -0.06 1.1+0.2 -0.1 1 : VCC 2 : VOUT 3 : Don't use. 4 : GND H REG Y X Hall device center line X : +0.05±0.23mm against package center Y : -0.05±0.1mm against package lead center between No.2 and No.3 terminals Z : 0.81±0.15mm from package surface *No.3 terminal and the section of leads (both sides of package in X direction) are connected with the terminal of internal IC. Be careful in connecting other circuits. Terminal connections Hall device B RP0B OP +B Magnetic flux density <Unidirectional magnetic field-type> Output voltage *1 Soldering time : within 10 seconds n Absolute Maximum Ratings (Ta=25˚C) Supply voltage Output voltage Output current Power dissipation Operating temperature Storage temperature Soldering temperature*1 Symbol V CC V OUT IO PD T opr T stg T sol Rating 100 -20 to +125 -55 to +150 260 Unit V V mA mW Parameter n Electrical Characteristics (Ta=25˚C) Operating magnetic flux density Hysteresis breadth Operating voltage Supply current Low level output voltage High level output voltage Output short circuit current Operating point temperature drift Symbol B OP B RP B H V CC ICC V OL V OH IOS ΔB OP Conditions V CC =16V V CC =16V, B=<10mT V CC =16V, IO =4mA, B>=30mT V CC =16V, IO =-100µA, B=<10mT V CC =16V V CC =16V, Ta=-5˚C to+60˚C V CC =16V, Ta=-20˚C to+80˚C MIN. 4.5 13.9 -1.55 TYP. 2.0 2.5 MAX. 10.5 0.4 -0.80 4.5 8.0 Unit mT mT mT V mA V V mA mT mT Parameter
Fig. 1 Operating Magnetic Flux Density vs. Supply Voltage Fig. 2 Operating Magnetic Flux Density vs. Ambient Temperature Fig. 6 Low Level Output Voltage vs. Ambient TemperatureFig. 5 Low Level Output Voltage vs. Output Current Fig. 3 Supply Current vs. Supply Voltage Fig. 4 Supply Current vs. Ambient Temperature LT251AHall IC T a=25˚C B OP B RP 01 6 81 242 0 12Operating magnetic flux density B (mT) Supply voltage VCC (V) V CC =16V B OP B RP 8004 0-40 120 12Operating magnetic flux density B (mT) Ambient temperature Ta (˚C) V CC =16V B=<10mT 0 -40 120 04 0 8 0 Supply current ICC (mA) Ambient temperature Ta (˚C) B=<10mT T a=25˚C 001 6 4 8 12 20 Supply current ICC (mA) Supply voltage VCC (V) V CC =16V B>=30mT T a=25˚C 004 12 3 5 1.0 0.8 0.6 0.4 .02 Low level output voltage VOL (V) Output current IO (mA) V CC =16V IO =4mA B>=30mT 0 80-40 0 40 120 1.0 0.8 0.6 0.4
0.2 Low level output voltage VOL (V)
Ambient temperature Ta (˚C)