LT230A SHARP | Alldatasheet
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In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device spcification sheets before using any SHARP device. n Outline Dimentions (Unit : Fmm) Hall IC LT230A n Features \ Same temperature coefficient of magnetic flux density as a magnet \ Operation by small magnet due to high sensitivity Operating point <20mT \ Combining a GaAs Hall device and an IC in a compact package (2.9X1.5X1.1mm) \ Wide operation temperature range obtained by GaAs Hall device (-20 to +125˚C) \ Long life time due to noncontact-type n Applications \ FDD \ HDD \ Noncontact switch * Soldering time : within 10 seconds n Absolute Maximum Ratings (Ta=25˚C) Supply voltage Output voltage Output current Power dissipation Operating temperature Storage temperature Soldering temperature* Symbol V CC V OUT IO PD T opr T stg T sol Rating 100 -20 to +125 -55 to +150 260 Unit V V mA mW Parameter n Electrical Characteristics (Ta=25˚C) Hysteresis breadth Operating voltage Supply current Low level output voltage Output leakage current Operating point temperature drift Symbol B OP B RP B H V CC ICC V OL IOH ΔB OP Condition V CC =5V V OO =5V R L =10K Ω V CC =16V, B=<5mT IO =4mA, B>=20mT V CC =16V, VOO =16V, B=<10mT V CC =5V, Ta=-20˚C to +80˚C MIN. 4.5 TYP. -0.2 MAX. 10.5 0.4 Unit mT mT mT V mA V µA %/C Parameter Operating magnetic flux density 2.7±0.3 1.5±0.2 0.6 0.40.4 0.4 1.9 2.9±0.2 0.850.95 2.9±0.2 4-R0.2 SZ 0.6 0.6 0.30.8 (0to0.15) 0.16 +0.10 -0.06 1.1+0.2 -0.1 1:VCC 2:VOUT 3:Don't use. 4:GND H REG Y X Hall device center line X:+0.05±0.23mm against package center Y:-0.05±0.1mm against package lead center between No.2 and No.3 terminals Z:0.81±0.15mm from package surface *No.3 terminal and the section of leads(both sides of package in X direction)are connected with the terminal of internal IC. Be careful in connecting other circuits. Terminal connections Hall device As for dimensions of tape-packaged products, refer to page 44 . LT230A GaAs Hall IC for Noncontact Switch (Unidirestional magnetic field-type)
Fig. 1 Operating Magnetic Flux Density vs. Supply Voltage Fig. 3 Supply Current vs. Supply Voltage Fig. 4 Supply Current vs. Ambient Temperature Fig. 5 Low Level Output Voltage vs. Output Current Fig. 6 Low Level Output Voltage vs. Ambient Temperature Fig. 2 Operating Magnetic Flux Density vs. Ambient Temperature T a=25˚C B OP B RP 01 6 81 242 0 12Operating magnetic flux density B (mT) Supply voltage VCC (V) V CC =5V B OP B RP 8004 0-40 120 12Operating magnetic flux density B (mT) Ambient temperature Ta (˚C) B=<10mT T a=25˚C 001 6 4 8 12 20 Supply current ICC (mA) Supply voltage VCC (V) V CC =5V B=<10mT 0 -40 120 04 0 8 0 Supply current ICC (mA) Ambient temperature Ta (˚C) V CC =16V B>=30mT T a=25˚C 004 12 3 5 0.5 0.4 0.3 0.2
0.1 Low level output voltage VOL (V)
Output current IO (mA) V CC =16V IO =4mA B>=30mT 0 80-40 0 40 120 0.5 0.4 0.3 0.2 Ambient temperature Ta (˚C) LT230A