LT1F67AF SHARP | Alldatasheet
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ELEC-XROMC COMI’ONEXTS GROUP SW CORPORATION f \\ DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. LTlF67AF 1 / 1. These specification sheets include materials protected under the copyrjght of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without S* consent . . . 2. When using this product, please 0bsen.e the absolute maximum ratin&!q.nd the instructions for use outlined in these specification sheets, as well as the precautions mentioned bei@%. Sharp assumes no responsibility for any damage resulting from use of the product which does not c&r+& tith the absolute maximum ratings and the instructions inchrded in these specification sheets, and the precautions mentioned below. Ii:. ) . (Precautions) (1) This products is designed for use in the foUowtig application areas; * OA equipment * Audio visual equipment * Home tippliance * Telecommunication equipment (Terminal) * Measur@g.equipment * Tooling machines * Computers 3 I If the use of the product in the above application areas is for equipment listed in paragraphs . (2) or (3), please be sure to observe the precautions given ixi those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safec design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which d&$nds high reliability and safety in function and precision, such as ; L * Transportation control and safety equipment (aircraft, t@n, automobile etc.) * Traffic signals * Gas leakage sensor breakers * R@ue and security equipment * Other safety equipment I (3) Please do not use this product for equipment which require extremely high reliability and safety in fnnction and precision, such as ; C * Space equipment * Tekcommunication equipment (for trunk lines) + Nuclear power control equipment * Medical equipment 1 . (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: hp. & I t?b CUSTOMER’S APPROVAL PRESENTED BY: DATE: Department General Manager of Enginewing Dept.,BI Opto-Electronic Devices Division BY: Electronic Components Group : SHARP CORPORATION
- Luminous intensity rank . c 19.7 - 24. 0 H 22.1 - 26. 9 I 24.7 - 30. I mcd J 27.7 - 33.7 . K 31.0 - 37. 0 L 34.7 - 42. 4 t See page 2 See page 3 4 5 6 See page 7 See page 8 This data sheet is to introduce the light emitting diode device’ Model No. LTlF61.G. delivered to l.Structure and characteristics Structure: CaP gellorgreen chip LED device Outline dimensions and pin connections: Taping specification: Packing specification: Soldering method: @ate l.)Duty ratio=l/lO, Pulse width*. lm~ (Note 2)Tore!ance: 415% (Ta=25”C) Condition IF=201n4 .olerance; f 15? Cvote 3)Measured by SH.UP EC&C ~lODEL660 (RadiometeriPhotometersystem)
- Plated. area j!:.; M ReqJ area bxq 2. Pin Conection
0 Cathode
@ Anode 0-0 3. Unspecified tel. to be iO.1 Outline dimensions and terminal connections
- This &tO 0h~t 10 to i*troduor thr lapin* sodi,i,fi~mlioO .Of LJ!U * dcrlcc. lode1 Ho. LmwAF 2 taping spcciflcatlaa 2. I tapiag rptciflc2tioo
2.2 Shipment table
‘SHIPMENT TABLE /-Hodel number PA-IT NO. -Quantity of prodqcts QUANTITY - Lot amber* : noi3[1oaaa -m --v LOT No. @ 0 ‘0 @ 8 SHARP - Luminous intensity rank UADC IN JAI.4.Y . *:Lo e indication
0 Production plant code(to be indicated alphabetically)
$3 Production Lot(singie or double figures)
3 Year of producrion(che last tuo figures of the year)
8 Konch of production
(to be indicated alphabetically with January corresponding to A) d Date of production(Ol-31)
2.3 Rcl+tcd l ttcrs
2.3.1. Packing There should not be missing’rbova continuous tbrte products. 2.3.2. true strength 1)Cover’trpe strength against peel iag: F= 0.1-O. 8N (I=lO* or Ied) +-- Forward Cdneir tape 2) Tape strength against bending The radius of bending circ!e should be 30~ or aore. If it .is less than 30aa.‘the cover tape may psi. 2.3.3. Taking out of products 11 Products should be easily taken out. 2) Products should not be attached to the eover’taph rt txeling. 2.3.4.. Jointing of true There should not be joint of cover tape or csrrier tape. 3: @anti tp per reel Average: 4.000 pcs. per reel
4-1. Taping 4-1-I. Shape and diwnsion of tape(TYP. > \\/I r3 - : P2 ’ PI -I Parameter ~ysbol~imens iod Benarks Concave square ‘fere icai A 1 1.1)am Dimeasioq excludes cocaes R hole lot part Horitoatal B I 1.9mm at inside bottom iasertion Pitch pi 1 4. Omm . . Round Diameter Da 1. sala sprocket _ Pitch PO 4.Omn AccumuLa{:ed error i0.5mm/lO pitch hole Position E 1.75mm DistaaciI:becueen tape edge and hole center Center Co ten- Vert.dire P2 2.omm Ceacer Line of the concave square hole and cer dimension Hori .dire F 3.5ms round sprocket hole Cover cape Wid:h ( W, 5.5mm 1 Thickness 1 t3 0. lnm [ Carrier tape Uidch 1 wo 8. Omm ) . Thickness 1 cl 0.2mm 1 kickness of the entire 1.2IIFA unit to With cover tape and carrier tape combined 1 X--I
a-l-2.Shapc and dimensian of reel (TYP. ) Parameter - 1 Symbol } Dimension )’ &e@rks Diameter I A 9178mm Flange Thickness I c l.Smm Inner space direccioa 1 W 1anlm Diqension of shaft core External diameter E )6Qmm Hub Spindle bale diameter C +13fUlQ Key slit Width 1 E 1 2.0mm Degch 1 U 4.5mm Notation for part came etc. I Labeling on one side of f Lange. 1 (Part name.quantity,loc No.) 3 Hatcrial: Reel.. .Polystyrene
In order to avoid the absorption of humidity in transport .a& storage, the~devices are psdtcd in alusim0 skve. 1. Storage Conditions The storage should lx done under follaaing conditions: Temperature . 5 to 3oc Humidity less than 6OUl-l 2. Treatment after Opening 1) Please make a soldering within 2 days after opening under following conditions: .- Temperature 5 to 3OC Humidity less than 60;YRH 2) In case the devices are not used for a long time after opening, the storage in dq box is recommendable. Or it is better to repack the devices with a desiccative by the sealer and put them in the same storage conditions as 6-I. Then they should be used rithin 2 W?XkS. 3) Please make a soldering after a following baking treatment if unused term should be over the amditions of 2). Remmendable Gmdi tions: (TJ in taping Tesprature 60t Time 90 to 100 Hours @ in individual ( on PIB or metallic tray > Temperature 11OC Time 3 to 4 Nours
- Soldering l-1 Xeflow soldering To be doae’undet the following conditiqa. UN. EOse c ux. 5’5 ec P3( Recommendable T hermal M ode1 1-2 Reflow soldering precautions Second time soldering shoufd be done witin 8 ham after the first one is l%shcd (Storage condition:at30C,RH(60%) I 2. Soldering iron method At 3OOC withln r seconds When using a soldering iran.care must be taken not to damage the package (Pay attion not to altou any undue stress or heat on package.) 1 Z X-l