LSYT676 | DigiCamel IC Datasheet

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LSYT676 AMSCO | Alldatasheet

Document overview

Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 24

Technical content

2 | Version 1.2 | 2022-05-10 Multi TOPLED® LSY T676 Two chip LEDs for indicators that allow to display red, green and yellow by color mixing

Applications

Electronic Equipment

Features

Package: white PLCC-4 package, colorless clear resin - Chip technology: InGaAlP - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 630 nm (● super red); λdom = 587 nm (● yellow) - Optical efficacy: 7 lm/W; 11 lm/W - Corrosion Robustness Class: 3B - Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

3 | Version 1.2 | 2022-05-10

Ordering Information

Type Brightness 1) Ordering Code LSY T676-P2R1-1-0+Q2S1-35 Q65110A2446

super red ● Iv = 56 ... 140 mcd (IF = 20 mA) Q65110A2446
yellow ● Iv = 90 ... 224 mcd (IF = 20 mA) Q65110A2446

4 | Version 1.2 | 2022-05-10 Maximum Ratings Parameter Symbol Values Values

super red ● yellow Operating Temperature Top min. max. -40 °C 100 °C -40 °C 100 °C Storage Temperature Tstg min. max. -40 °C 100 °C -40 °C 100 °C Junction Temperature Tj max. 125 °C 125 °C Forward Current TA = 25 °C IF max. 30 mA 30 mA Forward Current pulsed t ≤ 10 µs; D = 0.005 ; TA = 25 °C IF pulse max. 250 mA 200 mA Surge Current Single pulses; t ≤ 10 µs; TA = 25 °C IFS max. 1000 mA 200 mA Reverse voltage 2) TA = 25 °C VR max. 12 V 12 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD 2 kV 2 kV

5 | Version 1.2 | 2022-05-10 Characteristics IF = 20 mA; TA = 25 °C Parameter Symbol Values Values

super red ● yellow Peak Wavelength λpeak typ. 645 nm 588 nm Dominant Wavelength 3) λdom min. typ. max. 627 nm 630 nm 634 nm 583 nm 587 nm 592 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 16 nm 15 nm Viewing angle at 50% IV 2φ typ. 120 ° 120 ° Forward Voltage 4) IF = 20 mA VF min. typ. max. 1.80 V 2.00 V 2.30 V 1.90 V 2.00 V 2.40 V Reverse current 2) VR = 12 V IR max. typ. 10 µA 0.01 µA 10 µA 0.01 µA Temperature Coefficient of Peak Wavelength TCλpeak typ. 0.14 nm / K 0.13 nm / K Real thermal resistance junction/solderpoint 5) 1 chip on RthJS real max. 340 K / W 340 K / W

6 | Version 1.2 | 2022-05-10 Brightness Groups Color of emission Group Luminous Intensity 1) Luminous Intensity 1) Luminous Flux 6) IF = 20 mA IF = 20 mA IF = 20 mA min. max. typ. Iv Iv ΦV

super red P2 56 mcd 71 mcd 190 mlm
super red Q1 71 mcd 90 mcd 240 mlm
super red Q2 90 mcd 112 mcd 300 mlm
super red R1 112 mcd 140 mcd 380 mlm
yellow Q2 90 mcd 112 mcd 300 mlm
yellow R1 112 mcd 140 mcd 380 mlm
yellow R2 140 mcd 180 mcd 480 mlm
yellow S1 180 mcd 224 mcd 610 mlm Wavelength Groups
super red Group Dominant Wavelength 3) Dominant Wavelength 3) min. max. λdom λdom 1 627 nm 634 nm Wavelength Groups
yellow Group Dominant Wavelength 3) Dominant Wavelength 3) min. max. λdom λdom 3 583 nm 586 nm 4 586 nm 589 nm 5 589 nm 592 nm

7 | Version 1.2 | 2022-05-10 Group Name on Label Example: P2-1+Q2-3 Color Brightness Wavelength

super red P2 1
yellow Q2 3

8 | Version 1.2 | 2022-05-10 Relative Spectral Emission 6) Irel = f (λ); IF = 20 mA; TS = 25 °C LSYT 676 400 450 500 550 600 650 700 λ /n m 0,0 0,2 0,4 0,6 0,8 1,0Irel :V λ :s uper red :y ellow Radiation Characteristics 6) Irel = f (ϕ); TS = 25 °C LSYT 676 -100° -90° -80° -70° -60° -50° -40° -30° ϕ /° 0,0 0,2 0,4 0,6 0,8 1,0 Irel :0 °

9 | Version 1.2 | 2022-05-10 Forward current 6) IF = f(VF); TS = 25 °C LSYT 676 VF /V 30IF /m A :s uper red Forward current 6) IF = f(VF); TS = 25 °C LSYT 676 VF /V 30IF /m A :y ellow Relative Luminous Intensity 6), 7) Iv/Iv(20 mA) = f(IF); TS = 25 °C LSYT 676 1 5 10 15 20 25 30 IF /m A 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 IV IV(20mA) :s uper red Relative Luminous Intensity 6), 7) Iv/Iv(20 mA) = f(IF); TS = 25 °C LSYT 676 1 5 10 15 20 25 30 IF /m A 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4IV IV(20mA) :y ellow

10 | Version 1.2 | 2022-05-10 Forward Voltage 6) ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA LSYT 676 -40- 20 02 04 06 08 0 100 120 Tj /° C -0,2 -0,1 0,0 0,1 0,2 0,3 ∆VF /V :s uper red Forward Voltage 6) ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA LSYT 676 -40- 20 02 04 06 08 0 100 120 Tj /° C -0,20 -0,15 -0,10 -0,05 0,00 0,05 0,10 0,15∆VF /V :y ellow Relative Luminous Intensity 6) Iv/Iv(25 °C) = f(Tj); IF = 20 mA LSYT 676 -40- 20 02 04 06 08 0 100 120 Tj /° C 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8Iv Iv(25°C) :s uper red Relative Luminous Intensity 6) Iv/Iv(25 °C) = f(Tj); IF = 20 mA LSYT 676 -40- 20 02 04 06 08 0 100 120 Tj /° C 0,0 0,5 1,0 1,5 2,0 2,5Iv Iv(25°C) :y ellow

11 | Version 1.2 | 2022-05-10 Dominant Wavelength 6) λdom = f(Tj); IF = 20 mA LSYT 676 -40- 20 02 04 06 08 0 100 120 Tj /° C 6∆λ dom /n m :s uper red Dominant Wavelength 6) λdom = f(Tj); IF = 20 mA LSYT 676 -40- 20 02 04 06 08 0 100 120 Tj /° C -10 10∆λ dom /n m :y ellow

12 | Version 1.2 | 2022-05-10 Max. Permissible Forward Current IF = f(T); ● super red 02 04 06 08 0 100 Ts /° C IF /m A LSYT 676one chip on super red Max. Permissible Forward Current IF = f(T); ● yellow 02 04 06 08 0 100 Ts /° C IF /m A LSYT 676one chip on yellow Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; ● super red 10-6 10-5 10-4 10-3 0,01 0,11 10 Pulset ime /s 0,05 0,10 0,15 0,20 0,25 0,30IF /A TS =0 °C ... 100°C LSYT 676 super red :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005 Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; ● yellow 10-6 10-5 10-4 10-3 0,01 0,11 10 Pulset ime /s 0,05 0,10 0,15 0,20 0,25IF /A TS =0 °C ... 100°C LSYT 676 yellow :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005

13 | Version 1.2 | 2022-05-10 Dimensional Drawing 8) marking Package GPLY6837 0.8 (0.031) 0.6 (0.024) 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.4 (0.134) 3.0 (0.118) (2.4 (0.094)) 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 4˚±1 0.1 (0.004) typ 1.1 (0.043) 3.3 (0.130) 3.7 (0.146) 0.6 (0.024) CA Circuit Diagram C A Further Information: Approximate Weight: 31.0 mg Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43) Pin Description Pin 1 Cathode Super Red Pin 2 Anode Super Red Pin 3 Cathode Yellow Pin 4 Anode Yellow

14 | Version 1.2 | 2022-05-10 Recommended Solder Pad 8) OHLPY439 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) Cathode marking Kathoden Markierung / Cu Fläche / 12 mm per pad2 Cu-area 3.3 (0.130) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

15 | Version 1.2 | 2022-05-10 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

16 | Version 1.2 | 2022-05-10 Taping 8) OHAY0093 3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315) CA AC

17 | Version 1.2 | 2022-05-10 Tape and Reel 9) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000 330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 8000

18 | Version 1.2 | 2022-05-10 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

19 | Version 1.2 | 2022-05-10 TTyyppee DDeessiiggnnaattiioonn SSyysstteemm LL AA YY TT 66 77 BB WWaavveelleennggtthh EEmmiissssiioonn CCoolloorr ((λλddoomm ttyypp..)) SS:: 633 nm super red YY:: 587 nm yellow AA:: 617 nm amber OO:: 606 nm orange WWaavveelleennggtthh EEmmiissssiioonn CCoolloorr ((λλddoomm ttyypp..)) GG:: 570 nm green YY:: 587 nm yellow PP:: 560 nm pure green LLeeaadd // PPaacckkaaggee PPrrooppeerrttiieess 66:: folded leads 77:: reverse gullwing leads EEnnccaappssuullaanntt TTyyppee // LLeennss PPrrooppeerrttiieess 77:: colorless clear or white volume conversion (resin encapsulation) CChhiipp TTeecchhnnoollooggyy 00:: TSN 66:: Standard InGaAlP 11:: individual definition BB:: HOP 2000 FF:: Thinfilm InGaAlP KK:: InGaAlP low current LL:: Light emitting diode PPaacckkaaggee TTyyppee TT:: TOPLED

20 | Version 1.2 | 2022-05-10 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes

21 | Version 1.2 | 2022-05-10 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.

22 | Version 1.2 | 2022-05-10 Glossary 1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ±11 %. 2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char- acteristics or damage the LED. 3) Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. 4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

23 | Version 1.2 | 2022-05-10

Revision History

1.1 2021-01-15 Features 1.2 2022-05-10 Maximum Ratings Characteristics Electro - Optical Characteristics (Diagrams) Derating (Diagrams) New Layout

Product Information

LSYT676 specifications and overview.

Summary

Two chip LEDs for indicators that allow to display red, green and yellow by color mixing Version 1.2 2022-05-10

Description

Two chip LEDs for indicators that allow to display red, green and yellow by color mixing Version 1.2 2022-05-10

Source title LSYT676 Datasheet(PDF) - ams AG

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