LPA2010 POWER | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Features
Shutdown current:<1uA 550KHz fixed frequency switching for amplifier 3W Output at 10% THD with a 4Ω Load and 5V VDD for amplifier 2.3W Outpu t at 1% THD with a 4Ω Load and 5 V VDD for amplifier Filterless, Low Quiescent Current and Low EMI Amplifier Efficiency up to 85% Free LC fi lter digital mo dulation, direct -drive speakers Short Circuit Protection Thermal Shutdown Few External Compo nents to Save the Space and cost Pb-Free Package Marking Information Typical Application Circuit GNDINN SD VDD VON VOP Speaker 1uF LPA2010 BYP 0.22uF 20K INP 20K 1uF 4ohm 22uF OFF ON 0.22uF Differential Input 2.5-5.5V Device Marking Package Shipping LPA2010 LPS LPA2010 YWX MSOP-8 3K/REEL Y: Y is year code. W: W is week code. X: X is series number.
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 2 of 9 Functional Pin Description MSOP-8/ Top View Functional Pin Description Pin PIN No. DESCRIPTION SD 1 Shutdown pin. Active low. BYP 2 Bypass pin. Connect a 1uF capacitor between this pin and GND. INP 3 Positive input of amplifier. INN 4 Negative input of amplifier. VOP 5 Positive output of signal. VDD 6 Voltage supply pin. GND 7 Ground pin. VON 8 Negative output of signal. Absolute Maximum Ratings Note 1 Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Information ESD Susceptibility Note 2. The Human body model (HBM) is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The testing is done according JEDEC. Note 3. Machine Model (MM) is a 200pF capacitor discharged through a 500nH inductor with no series resistor into each pin. The testin g is done according JEDEC. VDD INN SD BYP VOP GND VON INP
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 3 of 9 Electrical Characteristics For Amplifier (VDD = 5V, RL=4Ω,TA = 25° C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Supply power VDD 2.5 5.5 V Output power Po THD+N=10%, f=1KHz,RL=4Ω VDD=5.0V 3 W VDD=4.2V 2 VDD=3.7V 1.58 THD+N=1%, f=1KHz,RL=4Ω VDD=5.0V 2.3 VDD=4.2V 1.6 VDD=3.7V 1.28 THD+N=10%, f=1KHz,RL=8Ω VDD=5.0V 1.73 VDD=4.2V 1.2 VDD=3.7V 0.92 THD+N=1%, f=1KHz,RL=8Ω VDD=5.0V 1.42 VDD=4.2V 0.98 VDD=3.7V 0.75 Power supply ripple rejection PSRR INPUT ac-grounded with CIN=0.47uF, VDD=5.0V f=100HZ 75 dB f=1KHz 50 Signal-to-nois e ratio SNR VDD=5V,RL=4Ω ,THD=1% f=1KHz 88 dB frequency switching Fsw VDD=5V 550 KHz Output noise VN INPUT ac -grounded with CIN=0.47uF , VDD=5.0V 140 μV VOS VDD=5.0V, VSD =0V 5 mV Shutdown current ILEAK VSD =VDD=5.0V 0.1 uA Quiescent current IQ VDD=5.0V,No load 2 mA High-level input voltage VSD_H VDD=5.0V 1 V Low-level input voltage VSD_L VDD=5.0V 0.4 V
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 4 of 9 Test setup for graphs Measurment Output Ci Ci LPA2010 INP INN VOP VON VDD GND Load Cs1 Cs2VDD 30kHz Low Pass Filter Measurment Intput 1. Ci was shorted for any common-mode input voltage measurement. All other measurements were taken with CI = 0.1μF (unless otherwise noted). 2. Cs1 = 0.1 μF is placed very close to the device. The optional Cs2 = 10 μF is used for datasheet graphs. 3. The 30 kHz low -pass filter is required even if the analyzer has an internal low -pass filter. An RC low-pass filter (1 kΩ, 4700 pF) is used on each output for the data sheet graphs. Typical Operating Characteristic PO VS THD Audio Precision 03/15/17 13:57:31 PO VS THD@4ohm.ats2 ColorSweep Trace Line Style Thick Data Axis Comment 1 1 Cyan Solid 3 Analyzer.THD+N Ratio A Left 3.6V,4ohm 2 1 Green Solid 3 Analyzer.THD+N Ratio A Left 4.2V,4ohm 3 1 Red Solid 3 Analyzer.THD+N Ratio A Left 5V,4ohm 0.01 0.02 0.05 0.1 0.2 0.5 100m 200m 300m 400m 600m 800m W
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 5 of 9 Audio Precision 03/09/17 17:50:36 PO VS THD@8ohm.ats2 ColorSweep Trace Line Style Thick Data Axis Comment 1 1 Cyan Solid 3 Analyzer.THD+N Ratio A Left 3.3V,8ohm 2 1 Green Solid 3 Analyzer.THD+N Ratio A Left 3.7V,8ohm 3 1 Yellow Solid 3 Analyzer.THD+N Ratio A Left 4.2V,8ohm 4 1 Red Solid 3 Analyzer.THD+N Ratio A Left 5V,8ohm 0.01 0.02 0.05 0.1 0.2 0.5 100m 3 200m 300m 400m 500m 700m 1 2 W T Frequency response curve Audio Precision 10/20/16 12:00:02 FRQ VS THD@4ohm D.ats2 ColorSweep Trace Line Style Thick Data Axis Comment 1 1 Cyan Solid 3 Analyzer.Level A Left 5V,4ohm,D,1% 2 1 Green Solid 3 Analyzer.Level A Left 5V,4ohm,D,10% -10 +30 +10 +15 +20 +25 d B V 20k 100 200 500 10k Hz
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 6 of 9 Frequency VS THD Audio Precision 01/14/17 12:41:19 ColorSweep Trace Line Style Thick Data Axis Comment 1 1 Cyan Solid 3 Analyzer.THD+N Ratio A Left 5V,4ohm ,1W 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 20k 100 200 500 10k Hz Applications Information Maximum Gain The LPA2010 has two internal amplifier stages. The first stage's gain is externally configurable, while the second stage's is internally fixed. The closed -loop gain of the first stage is set by selecting the ratio of Rf to Ri while the second stage's gain is fixed a t 2x.The output of amplifier 1 serves as the input to amplifier 2, thus the two amplifiers produce signals identical in magnitude, but different in phase by 180°. Consequently, the differential gain for the IC is A VD=20*log [2*Rf/(Ri+6)] T h e LPA2010 sets maximum: Rf= 150 k Ω±10% Shutdown operation In order to reduce power consumption while no t in use, the LPA2010 contains shutdown circuitry to turn off the amplifier's bias circuitry. This shutdown feature turns the amplifier off whe n logic low is applied to the S D pin. By switching the SD pin connected to GND, the LPA2010 supply current draw will be minimized in idle mode. Power supply decoupling The LPA2010 is a high performance CMOS aud io amplifier that requires adequate power supply decoupling to ensure the output THD and PSRR a low as possible. Power supply decoupling affects low frequency response. Optimum decoupling is achieved by using two capacitors of different types targeting to different types of noise on the power supply leads. For higher frequency transients, spikes, or digit al hash on the line, a good low equivalent-series- resistance (ESR) ceramic capacitor, typically 1.0 uF, works best, placing it as
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 7 of 9 close as possible to the device V DD terminal. For filtering lower - frequency noise signals, a large capacitor of 2 2uF (ceramic) or greater is recommended, placing it near the audio power amplifier. Input Capacitor (C i) Ci for boost. Large input capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 100Hz to 150Hz. In the typical application, an input capacitor Ci is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. Thus, using a large input capacitor may not increase actual system performance. In this case, input capacito r (Ci) and input resistance (Ri) of the amplifier form a high-pass filter with the corner frequency determined by equation below, RiCi2 1fC GNDINN SD VDD VON VOP Cs1 LPA2010 BYP Ci Ri INP Ri Cbyp Cs2 OFF ON Ci Differential Input 2.5-5.5V GNDINN SD VDD VON VOP Cs1 LPA2010 BYP Ci Ri INP Ri Cbyp Cs2 OFF ON Ci 2.5-5.5V Single-ended Input Analog Reference Bypass Capacitor (CBYP) In addition to system cost and size, click and pop performance is affected by the size of the input coupling capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally 1/2 VDD). This charge comes from the internal circuit via the feedback and is apt to create pops upon device enable. Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be minimized. The Analog Reference Bypass Capacitor (CBYP) is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, CBYP determines the rate at which the amplifier starts up. The second function is to reduce noise caused by the power supply coupling into the output drive signal. This noise is from the internal analog reference to the amplifier, which appears as degraded PSRR and THD+N. The LPA2010 incorporates circuitry designed to detect low supply voltage. When the supply voltage drops to 2.5V or below, the LPA2010 outputs are disabled, and the device comes out of this state and starts to normal function when VDD≥2.5V. Short Circuit Protection (SCP) The LPA2010 has short circuit protection circuitry on the outputs to prevent damage to the device when output-to-output or output -to-GND short occurs. When a short circuit is detected on the outputs, the
Preliminary Datasheet LPA2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 8 of 9 outputs are disabled immediately. If the short was removed, the device activates again. Over Temperature Protection Thermal p rotection on the LPA2010 prevents the device from da mage when the internal die temperature exceeds 140 ℃. There is a 15 degree tolerance on this trip p oint from device to device. Once the die temperature exceeds the thermal set point, the device outputs are disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30℃. This large hysteresis will prevent motor boating sound well and the device begins normal operation at this point without external system intervention. When to use an output filter Design the LPA2010 without an Inductor / Capacitor (LC) output filter if the traces from the amplifier to the speaker are short. Wireless handsets and PDAs are great applications for this class -D amplifier to be used without an output filter. The LPA2010 does not require an LC output filter for short speaker connections (approximately 100 mm long or less). A ferrite bead can often be used in the design if failing radiated emissions testing without an LC filter; and, the frequency -sensitive ci rcuit is greater than 1 MHz. If choosing a ferrite bead, choose one with high impedance at high frequencies, but very low impedance at low frequencies. The selection must also take into account the currents flowing through the ferrite bead. Ferrites can begin to loose effectiveness at much lower than rated current values. VOP VON 1nF 1nF Ferrite Bead Ferrite Bead Typical ferrite-bead output filter PCB Layout notices 1, In the path of the input signal plus a 103-to-ground high-frequency filter capacitor. 2, T he power and ground and filter capacitor and bypass capacitors as close to the chip's pins, remember not to put the capacitor on the back of the board, through tiny holes through the jumper even over. 3, Power, ground, and a large current signal line to go to try to rough, if you want to add vias, the number of through-holes must be at least 6. 4, If you want to pursue as large as the effect of power, a large selection of speakers or sound chamber with low resistance (such as 3 .6Ω) speakers, or added to i mprove the supply voltage boost circuit. 5, Sensitive attention to shielding the signal line, it is best to use a differential signal. Try not to interfere with the sensitive line through the signal line. 6, The position on the board under the amplifier chip must be added vents and large areas of exposed copper and tin to enhance heat dissipation.
Preliminary Datasheet LPA 2010 LPA2010–00 May .-2016 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 9 of 9 Packaging Information MSOP8