LM832 LMTECHNOLOGIES | Alldatasheet
Document overview
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Technical content
Features
General Specification Wireless Wireless Standard Module Type Profiles OS Compatibility Security Network Architecture WiFi: 802.11 b/g/n Bluetooth: v2.1+EDR / v3.0 / v4.1 Standalone (Embedded Wireless Stack) or Host Controller Interface (HCI) TBA Linux, Android and Windows XP WiFi: WEP, WPA Personal, WPA2 Personal, WMM, WMM-PS(U-APSD), WMM-SA, WAPI, AES (Hardware Accelerator), TKIP(host-computed), CKIP(Software Support) Bluetooth; Secure Simple Paring WiFi: Ad hoc mode (Peer-to-Peer), Infrastructure mode, Software AP and WiFi Direct Bluetooth; Piconet; Scatternet Hardware Chipset Antenna Microcontroller (MCU) Flash Memory RAM Interfaces Power Supply Crystal Oscillators Development Kit Cypress PCB Antenna or IPEX Receptical ARM Cortex-M3, with 512 kB on-chip flash 8 MB 128 kB WiFi: SDIO 2.0 Bluetooth: UART (Baud rates up to 4 Mbps) 3V6 (VDDIO) or 4V8 (VBAT) 26 MHz and 32.768 kHz (External) LM522 Part No Product See Last Page LM832 Standalone with SDIO and UART Interfaces LM832 Page 2 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module
Standalone with SDIO and UART Interfaces LM832 Page 3 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com General Specification (Continued) RF Characteristics Tx Output Power Rx Sensitivity Data Transfer Rate Frequency Modulation Scheme Spread Spectrum Operating Channel WiFi: 17dBm – 802.11b@11Mbps 15dBm – 802.11g@6Mbps 15dBm – 802.11g@54Mbps 13dBm – 802.11n@MCS0_HT20 13dBm – 802.11n@MCS7_HT20 Bluetooth: Class 1 WiFi: -76dBm – 802.11b@11Mbps -65dBm – 802.11g@54MBps -64dBm – 802.11n@MCS7_HT20 Bluetooth: -89dBm@1Mbps -90dBm@2Mbps -83dBm@3Mbps WiFi: 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n MCS0 to 7 for HT20MHz Bluetooth: Basic Rate 1Mbps; Enhanced Rate 2, 3Mbps; High Speed 6, 9, 12, 18, 24, 36, 48, 54Mbps 2.4GHz to 2.4835 GHz WiFi: 802.11b: CCK, DQPSK, DBPSK 802.11g: 64QAM, 16QAM, QPSK, BPSK 802.11 g/n: 64QAM, 16QAM, QPSK, BPSK Bluetooth: GFSK, π/4 DPSK, 8DPSK WiFi: IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n: OFDM (Orthogonal Frequency Division Multiplexing) Bluetooth: FHSS (Frequency Hopping Spread Spectrum) WiFi (2.4GHz): 11: (Ch. 1-11) – United States 13: (Ch. 1-13) – Europe 14: (Ch. 1-14) – Japan Bluetooth (2.4GHz): Ch. 0 to 78 LM832 WiFi and Bluetooth® Dual Mode Combi Module
Standalone with SDIO and UART Interfaces LM832 Page 4 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com -20°C to +60°C ambient temperature 5 to 90 % (non-condensing) -20°C to +70°C ambient temperature 0 to 95 % (non-condensing) 19mm x 12mm x 2mm 0.44 g (PCB Antenna Module) and 0.46 g (IPEX Module) See our website for this products certifications RoHS, REACH and WEEE Physical Characteristics Operating Temperature Storage Temperature Dimensions (L x W x H) Weight Certifications Compliance General Specification (Continued) LM832 WiFi and Bluetooth® Dual Mode Combi Module
Standalone with SDIO and UART Interfaces Part No Product See Last Page LM832 RF Type 1: PCB Antenna Module RF Type 2: IPEX Connector Module LM832 Page 5 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module Antenna Options RF Connector Dimensions 2.60±0.10 0.60 0.60 0.60 0.10 0.25 AA MAX 0.25±0.050 ø1.85±0.050 ø2.00±0.050 3.10 1.80±0.050 0.25±0.050 2.60±0.10A A 0.15 30.00° ø1.70±0.050 ø1.00 ø0.50±0.050 Ground Contact Contact Housing SECT A-A A A B 0.050 B 0.10 1.25±0.050 0.90±0.05 0.05 0.35
Standalone with SDIO and UART Interfaces Part No Product See Last Page LM832 LM832 Page 6 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com Pin Outs BT_HOST_WAKE BT_DEV_WAKE BT_UART_RXD BT_UART_CTS BT_UART_TXD BT_UART_RTS GND VBAT GND BT_REG_ON WL_REG_ON CLK_32KHz GPIO_1 SDIO_CLK SDIO_DATA_2 SDIO_CMD SDIO_DATA_0 SDIO_DATA_3 SDIO_DATA_1 VDDIO WL_HOST_WAKE PIN 1 10 LM832 WiFi and Bluetooth® Dual Mode Combi Module The LM832 can be powered in one of 2 ways: 1) Powered through the VDDIO (Pin 9) 2) Powered from a Lithium ion / Lithium polymer battery through VBAT (Pin 14)
Standalone with SDIO and UART Interfaces Part No Product See Last Page LM832 Pin Assignments Pin Signal CLK_32KHz GPIO_1 SDIO_CLK SDIO_DATA_2 SDIO_CMD SDIO_DATA_0 SDIO_DATA_3 SDIO_DATA_1 VDDIO WL_HOST_WAKE WL_REG_ON BT_REG_ON GND VBAT GND BT_UART_RTS BT_UART_TXD BT_UART_CTS BT_UART_RXD BT_DEV_WAKE BT_HOST_WAKE Type Input I/O Input I/O I/O I/O I/O I/O Input I/O Input Input Power Power Power Output Output Input Input I/O I/O LM832 Page 7 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module
Description
External sleep clock input (32.768 kHz). If an external 32.768 kHz clock cannot be provided, pull this pin low. However, BLE will be always on and cannot enter deep sleep. Programmable GPIO pins SDIO clock input SDIO data line 2. Also used as a strapping option. SDIO command line SDIO data line 0 SDIO data line 3 SDIO data line 1 VDDIO input supply. Connect to VDDIO. Programmable GPIO pins. This pin becomes an output pin when it is used as WLAN_HOST_WAKE/out-of-band signal. Used by PMU to power up or power down the internal regulators used by the WiFi section. Also, when deasserted, this pin holds the WiFi section in reset. This pin has an internal 200 k/uni03A9 pull-down resistor that is enable by default. It can be disabled through programming. Used by PMU to power up or power down the internal regulators used by the Bluetooth section. Also, when deasserted, this pin holds the Bluetooth section in reset. This pin has an internal 200 k/uni03A9 pull-down resistor that is enable by default. It can be disabled through programming. Ground VBAT input power supply Ground UART request-to-send. Active-low request-to-send signal for the HCI UART interface. UART serial output. Serial data output for the HCI UART interface. UART clear-to-send. Active-low clear-to-send signal for the HCI UART interface. UART serial input. Serial data input for the HCI UART interface. DEV_WAKE or general-purpose I/O signal HOST_WAKE or general-purpose I/O signal
Standalone with SDIO and UART Interfaces Part No Product See Last Page LM832 LM832 Page 8 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module DC Power Supply Voltage for VBAT Voltage for digital I/O Minimum 1.71 V Signal VBAT VDDIO Maximum 4.8V 3.63V VDDIO_SD = 1V8 Input high voltage Input low voltage Output high voltage (at 2mA) Output low voltage (at 2mA) Minimum 1.27V 1.40V Signal VIH VIL VOH VOL Maximum 0.58V 0.45V Recommended Operating Conditions SDIO Interface I/O Pins VDDIO_SD = 3V3 Input high voltage Input low voltage Output high voltage (at 2mA) Output low voltage (at 2mA) Minimum 0.625V x VDDIO 0.75V x VDDIO Signal VIH VIL VOH VOL Maximum 0.25V x VDDIO 0.125V x VDDIO VDDIO = 1V8 Input high voltage Input low voltage Output high voltage (at 2mA) Output low voltage (at 2mA) Minimum 0.65V x VDDIO VDDIO - 0.45V Signal VIH VIL VOH VOL Maximum 0.35V x VDDIO 0.45V Other Digital I/O Pins VDDIO = 3V3 Input high voltage Input low voltage Output high voltage (at 2mA) Output low voltage (at 2mA) Minimum VDDIO - 0.4V Signal VIH VIL VOH VOL Maximum 0.8V 0.4V
Standalone with SDIO and UART Interfaces Part No Product See Last Page LM832 LM832 Page 9 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module Module Block Diagram Filter Cypress Chipset LM832 BT_RF ANT BT_REG_ON PCM Bluetooth Host I/F CLK_REQ BT_DEV_WAKE BT_HOST_WAKE UART WL_REG_ON WL_IRQ SDIO* / SPI WiFi Host I/F VDDIO / VBAT XTAL
26 MHz
32.768 KHz
8 MB SPI
The recommended layout pads for LM832 module are shown below. TOP VIEW Standalone with SDIO and UART Interfaces Part No Product See Last Page LM832 LM832 Page 10 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 1mm 12mm 19mm 10mm 7.8mm Physical Dimensions 15mm Pin 1 1mm x 10 1mm x 11 1mm 2.20mm TOP VIEW SIDE VIEW FRONT VIEW BOTTOM VIEW 10.03mm 2mm+0.2 Sheilding19mm+0.15 0.6+0.10 12mm+0.15
Standalone with SDIO and UART Interfaces Soldering and Reflow Chart 1. If the system PCBA is double side design please reflow the side without this module first. 2. Don’t let the solder machine temperature over 250□ or follow solder paste vender’s recommended temperature. 3. The Ramp-up temperature speed is 1~4 oC per second, the Ramp-down temperature speed is 1~4 oC per second. 4. This temperature reflow chart is for reference only, it depends on the manufaturing machine’s characters requirement. Bake @ 125 oC Bake @ 90 oC Bake @ 40 oC Exceeding floor Life By > 72h Exceeding floor Life By ≤ 72h Exceeding floor Life By > 72h Exceeding floor Life By ≤ 72h Exceeding floor Life By > 72h Exceeding floor Life By ≤ 72h 9 hours 7 hours 33 hours 23 hours 13 days 9 days LM832 Page 11 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module PCB Drying Conditions This module is a Moisture Sensitivity Level 3 (MSL-3) surface mount device. Please refer below for drying conditions prior to the solder reflow processes. If your PCB was baked at the below temperatures, you should follow the below guidelines. 1000 2:000:00 4:00 6:00 Preheat 50-120s Re/f_low 30-60s 2000 3000 4000 50.0 100.0 110.0 150.0 190.0 200.0 230.0 250.0 Temperature °C Time (mm:ss)
Standalone with SDIO and UART Interfaces LM832 Page 12 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com Tape Dimensions Reel Dimensions Tape and Reel Packaging 330mm 100mm 49.4mm 1500 modules per Tape
5 Boxes per Carton
Carton Dimensions (L x W x H): 395mm x 360mm x 305mm Notes LM832 WiFi and Bluetooth® Dual Mode Combi Module 4mm 12.4mm 20mm ∅1.50mm 1.2mm 14.20mm 2.4mm 0.35mm 12.4mm 19.4mm 32mm 28.40mm Xmm
Standalone with SDIO and UART Interfaces LM832 Page 13 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com Packaging for Tape & Reel / Tray Model name label box carton carton label box drying agent Humidity Indicator Card Trays are stacked up with an empty tray on the top. Reels are place within a vacuum bag. The trays/reels are stacked and inserted into an anti-static vacuum bag, with the anti-static, model name and moisture sensitive labels affixed. The vacuum bag is placed inside the box and a model name label affixed on the front-side of each box. Anti-static aluminium vacuum bag. Anti-static aluminium vacuum bag. Each carton contains 4 boxes. LM832 WiFi and Bluetooth® Dual Mode Combi Module
Standalone with SDIO and UART Interfaces LM832 Page 14 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 WiFi and Bluetooth® Dual Mode Combi Module Datasheet Version Notes Added version notes to datasheet. MSL Description text improvement in the PCB Drying Conditions section. v1.0 v1.1
13 MAR 2018
Standalone with SDIO and UART Interfaces Product User Guides, Manuals and Configuration Software can be downloaded via our website - http://www.lm-technologies.com/downloads LM832 Page 15 of 15 +44(0) 207 428 2647 | sales@lm-technologies.com LM832 Packaging Options 3.3V Module with IPEX Connector832-0476 MOD SDIO Wi-Fi + BT4.1 ROM 3-4.8v IPEX -20c PCS 3.3V Module with IPEX Connector832-0472 MOD SDIO Wi-Fi + BT4.1 ROM 3-4.8v IPEX -20c TRAY 3.3V Module with IPEX Connector832-0473 MOD SDIO Wi-Fi + BT4.1 ROM 3-4.8v IPEX -20c T&R 3.3V Module with PCB Antenna832-0477 MOD SDIO Wi-Fi + BT4.1 ROM 3-4.8v PCB ANT -20c PCS LM832 WiFi and Bluetooth® Dual Mode Combi Module 3.3V Module with PCB Antenna832-0474 MOD SDIO Wi-Fi + BT4.1 ROM 3-4.8v PCB ANT -20c TRAY 3.3V Module with PCB Antenna832-0475 MOD SDIO Wi-Fi + BT4.1 ROM 3-4.8v PCB ANT -20c T&R