LM813 LMTECHNOLOGIES | Alldatasheet
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The LM813 Series Combination Module supports both WiFi 802.11ac with data rates up to 433Mbps and Bluetooth® 4.2. USB Interface module with added terminals for enabling GPIO’s and Bluetooth Functions to enable coexistence. This IPEX, module operates under 2.4GHz or 5Ghz. LM813 is compliant to IEEE 802.11ac/ a/b/g/n, and Bluetooth® v2.1, v3.0 and v4.2 standards. Currently Bluetooth® includes EDR transmission and supports bandwidths up to 2Mbps, or in HS Mode up to 3Mbps. The module design is based on a Realtek reference, which LM engineer's have made some modifications, which include; Upgrading the PCB material to -40°C rated components and using a high quality -40°C low temperature crystal. The main IC from Realtek is only rated at 0°C Our temperature testing is conducted up to -40°C and the module has achieved good results. Although the testing period is only subject to a 72h test period, we have run previous modules using the same brand of BOM material in longer periods of temperature testing. These tests are continuous and enable us to support for -20°C Operating and -30°C Storage Temperature under our own 24 month warranty, from date of dispatch. We have added a heat resistant coating to the bottom of the module enabling higher temperature protection during the re-flow processing in production. LM813 Page 1 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection Revised 19/FEB/2021 1.2Datasheet Version Ordering Options See last page 7 8Android 10
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface General Specification Wireless Wireless Standard Module Type OS Compatibility Security Network Architecture WiFi: 802.11 a/b/g/n/ac Bluetooth®: v2.1+EDR/v3.0+HS/v4.0/4.2 Host Controller Interface (HCI) Linux, and Windows versions to be confirmed. WiFi; WPA, WPA-PSK, WPA2, Bluetooth®; Simple Paring WiFi; Ad hoc mode (Peer-to-Peer) and Infrastructure mode Software AP; WiFi Direct Bluetooth®; Pico Net; Scatter Net, Low Power Mode(Sniff Mode) Hardware Chipset Antenna Interfaces Realtek Chipset Single IPEX Connector USB 2.0 Realtek Chipset USB Interface DPX IPEX XTAL 40Mhz TX/RX (2.4G / BT) TX/RX (5G) Block Diagram LM813 Page 2 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface General Specification (Continued) RF Characteristics Range (in open space) Data Transfer Rate Frequency Modulation Scheme Spread Spectrum Antenna Security RF Output Power (tolerance ± 2dBm) WiFi: Up to 180m Bluetooth®: Up to 10m WiFi: 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 18, 24, 36, 48, 433Mbps; 802.11n MCS0 to 7 for HT20MHz, MCS0 to 7 for HT40MHz Bluetooth®: Basic Rate 1Mbps; Enhanced Rate 2, 3Mbps; High Speed 6, 9, 12, 18, 24, 36, 48, 54Mbps 2.4GHz and 5GHz ISM Band WiFi: CCK, DQPSK, DBPSK, BPSK, QPSK,16QAM, 64QAM, 256QAM Bluetooth®: 8DPSK, π/4 DQPSK, GFSKFSK WiFi: IEEE 802.11b: CCK (Complementary Code Keying) IEEE 802.11g/n/a/ac:OFDM (Orthogonal Frequency Division Multiplexing) Bluetooth®: FHSS (Frequency Hopping Spread Spectrum) IPEX Antenna x 2 WPA, WPA2 WiFi 17dBm – 802.11b@CCK 11Mbps 15dBm – 802.11g@OFDM 54Mbps 13dBm – 802.11n@MCS7_HT20 13dBm – 802.11n@MCS7_HT40 13dBm – 802.11a@OFDM 54Mbps 9dBm – 802.11ac@NSS1 MCS9_BW20, BW40, BW80 Bluetooth Max + 8dBm LM813 Page 3 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface Power Consumption
Description
Off Unassociated idle Associated idle for 2.4GHz band Data transfer for 2.4GHz Note: Data transfer test using the Linux driver: Linux_v4.3.6_11841.20140714 DC power for 5V Performance Typ 103 Units uA mA mA mA Off Unassociated idle Associated idle for 2.4GHz band Data transfer for 2.4GHz Note: Data transfer test using the Linux driver: Linux_v4.3.6_11841.20140714 DC power for 3.3V Performance Typ 141 168 Units uA mA mA mA -20°C to +85°C ambient temperature 0 to 95 % (non-condensing) -30°C to +95°C ambient temperature 0 to 95 % (non-condensing) 25mm x 12mm x 2.05mm 0.82 g See our website for certifications RoHS, REACH and WEEE Operating Temperature Storage Temperature Dimensions (L x W x H) Weight Certifications Compliance WiFi -80dBm – 802.11b@11Mbps -71dBm – 802.11g@54MBps -67dBm – 802.11n@MCS7_BW20 -64dBm – 802.11n@MCS7_BW40 -57dBm – 802.11ac@NSS1_MCS9_BW20 -54dBm – 802.11ac@NSS1_MCS9_BW40 -51dBm – 802.11ac@NSS1_MCS9_BW80 Bluetooth -89dBm@1Mbps -90dBm@2Mbps -83dBm@3Mbps Receiver Sensitivity LM813 Page 4 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface Pin Outs 19 15 10 14 Pin Assignments Pin Signal BT_LED VDD HSDM HSDP GND WL_LED GND RFIO_OUT GND BT_WAKE_HOST GPIO2 CHIP_EN GPIO1 BT_DIS GPIO8 HOST_WAKE_BT WL_DIS HOST_WAKE_WL WL_WAKE_HOST Type Output Power I/O I/O I/O RF Output I/O Input I/O Input I/O Input Input Input Output BT LED Pin(Active Low) 3.3V or 5V by factory option High-Speed USB D- Signal High-Speed USB D+ Signal Ground WLAN LED Pin(Active Low), General Purpose Input/ Output Pin Ground WLAN(2.4G/5G)/BT RF port (if don’t using IPEX connector) Ground Signal from module to wake up host,refer driver source code for details. General Purpose Input/ Output Pin This Pin Can externally shut down the RTL8821CU-CG(No Extra Power Switch Required). General Purpose Input/ Output Pin Shared with GPIO11. This pin can externally shut down the RTL8821CU-CG BT function when BT_DIS is pulled Low. When this pin is pulled low. USB interface will be also disabled. This pin can be also defined as the BT Radio-off function with host interface remaining connected WLAN LED Pin(Active Low), shared with GPIO8 General Purpose Input/ Output Pin Signal from host to wake up module,refer driver source code for details. Shared with GPIO9. This pin can externally shut down the RTL8821CU-CG WLAN function when WL_DIS is pulled Low. When this pin is pulled low. USB interface will be also disabled. This pin can also be configured as the WLAN Radio-off function with host interface remaining connected LM813 Page 5 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface LM813 Page 6 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection Physical Dimensions TOP VIEW SIDE VIEW FRONT VIEW 2.2 1.453 2mm x 5 1.05 2.05mm Sheilding 25mm 0.8 12.1mm PCB Layout 0.2+ 0.15+ 0.2+ 2.2 2.2 0.25 1.45 1.5 1.5 25mm 12.1mm 1.21 1 1 1 0.55 0.79 1.05 0.2+ 24mm 13.7mm 0.2+
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface RF Connector Dimensions 2.60±0.10 0.60 0.60 0.60 0.10 0.25 AA MAX 0.25±0.050 ø1.85±0.050 ø2.00±0.050 3.10 1.80±0.050 0.25±0.050 2.60±0.10A A 0.15 30.00° ø1.70±0.050 ø1.00 ø0.50±0.050 Ground Contact Contact Housing SECT A-A A A B 0.050 B 0.10 1.25±0.050 0.90±0.05 0.05 0.35 LM813 Page 7 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface LM813 Page 8 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection PCB Drying Conditions Probe Liquidus Line Rising 110.00-190.00 Above 230.0 Max Min Positive Negative Maximum / Minimum Slope Please refer below to the conditions for drying before the solder reflow processes. (Extracted from IPC/JEDEC J-STD-033B.1) 1. If the system PCBA is double side design please reflow the side without this module first. 2. Don’t let the solder machine temperature over 250 °C or follow solder paste vender’s recommended temperature. 3. The Ramp-up temperature speed is 1~4 °C per second, the Ramp-down temperature speed is 1~4 °C per second. 4. This temperature reflow chart is for reference only, it depends on the manufaturing machine’s characters requirement. 119.00 116.50 116.00 117.00 119.50 47.50 49.00 46.50 46.50 50.00 245.50 247.10 245.80 244.90 248.10 27.30 27.70 29.30 29.20 29.60 2.56 2.69 2.04 2.60 2.44 Zone 8 245.0 245.0 1.0 Zone 7 260.0 260.0 1.0 Zone 6 210.0 210.0 1.0 Zone 5 180.0 180.0 1.0 Zone 4 170.0 170.0 1.0 Zone 3 170.0 170.0 1.0 Zone 2 180.0 180.0 1.0 Zone 1 180.0 180.0 1.0 Name Max Min Length -1.69 -1.60 -1.57 -1.31 -1.64 Exceeding floor Life by > 72h 9 hours Exceeding floor Life by ≤ 72h 7 hours Bake @ 125 °C Bake @ 90 °C Bake @ 40 °C Exceeding floor Life by > 72h 13 days Exceeding floor Life by ≤ 72h 9 days Exceeding floor Life by > 72h 33 hours Exceeding floor Life by ≤ 72h 23 hours Soldering Reflow Chart 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 100 120 140 160 180 200 240 260 280 300 320 Temperature °C
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface LM813 Page 9 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection Tray Packaging Anti-Static PS Tray, Black. Material Thickness: 1mm Height of Tray: 20mm Carton Dimensions (L x W x H): 340mm x 290mm x 385mmm 40 modules per Tray
3 Trays per Inner Box
8 Inner Boxes per Outer Carton
960 modules per Outer Carton Notes Tray Dimensions Quantities 314 mm 144 mm Tray Depth 20mm
40 Piece Tray: 8 x 5
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface LM813 Page 10 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection Tape Dimensions Reel Dimensions Tape and Reel Packaging 330mm 100mm 49.4mm 16mm 4.0mm2.0mm 1.50mm 1.75mm 20.2mm 2.4mm 0.3mm 12.60mm 25.6mm 44mm 40mm 1500 modules per Tape & Reel
1 Tape & Reel per Inner Box
5 Inner Boxes per Outer Carton
7500 modules per Outer Carton Quantities Inner Box Dimensions (L x W x H): 360mm x 360mm x 60mm Outer Carton Dimensions (L x W x H): 395mm x 360mm x 305mm Notes
+44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface Packaging for Tape & Reel / Tray Tape & Reel Tray Reels are placed within a vacuum bag. MSL Label The Tape & Reel / Tray are inserted into an anti-static vacuum bag with a Humidity Indicator Card and Drying Agent. On the outside of the vacuum bag are MSL (Moisture Sensitivity Levels), MPN and an Anti-Static Labels. The vacuum bag is placed inside the inner box with a MPN Label stuck on the front-side of each box. Outer Carton Each Outer Carton contain 8 inner boxes max (120 pcs x 8 = 960 pcs) inner box inner box inner box Vacuum bag. MPN Label Drying Agent Anti-Static Label Humidity Indicator MPN Label Outer Carton Label Outer Carton Label LM LM CLC Outer Carton Each Outer Carton contain 5 inner boxes max (7500 pcs) CLC MSL Label Vacuum bag. MPN Label Drying Agent Anti-Static Label Humidity Indicator LM 3 bags max per inner box (40 pcs x 3 = 120 pcs) The vacuum bag is placed inside the inner box with a MPN Label stuck on the front-side of each box. inner box inner box inner box MPN Label LM 1 bags max per inner box (1500 pcs) Trays are stacked with an empty tray on the top and placed within a vacuum bag.
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface LM813 Page 12 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection Datasheet Version Notes Added version notes to datasheet, branding updates.v1.2 22 JAN 2021
LM813 WiFi and Dual Mode Bluetooth® Combination Module Host Controller Interface (HCI) via USB Interface Product User Guides, Manuals and Configuration Software can be downloaded via our website - http://www.lm-technologies.com/downloads Ordering Options 813-0813 MOD SMT HCI 802.11ac 1T1R - BT4.2 -20c 5v IPEX TRAY 5V Module with IPEX Connector813-0814 MOD SMT HCI 802.11ac 1T1R - BT4.2 -20c 5v IPEX TRAY SP 5V Module with IPEX Connector 5V Module with IPEX Connector813-0815 MOD SMT HCI 802.11ac 1T1R - BT4.2 -20c 5v IPEX T&R 813-0816 US MOD SMT HCI 802.11ac 1T1R - BT4.2 -20c 5v IPEX TRAY US ETSI ETSI ETSI US US 5V Module with IPEX Connector813-0817 US MOD SMT HCI 802.11ac 1T1R - BT4.2 -20c 5v IPEX TRAY SP 5V Module with IPEX Connector 5V Module with IPEX Connector813-0818 US MOD SMT HCI 802.11ac 1T1R - BT4.2 -20c 5v IPEX T&RTAPE & REEL TAPE & REEL SAMPLE PACK SAMPLE PACK TRAY TRAY LM813 Page 13 of 13 +44 (0) 207 428 2647 www.lm-technologies.com/contact LM Technologies Ltd A Better Connection