LM1114A3B

LM1114A3B CYSTEKEC | Alldatasheet

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CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 1/11 LM1114M3B/A3B CYStek Product Specification Low Dropout CMOS Voltage Regulators LM1114 Features Applications

• Maximum output current 300mA ●Battery powered equipment
• Highly accurate : output voltage+/-2% ●Palmtops
• Low power consumption ●Portable cameras and video recorders
• Small input/output differential: ●Reference voltage sources 0.36V typ at 300mA(Vout= 3.3V) 0.3V typ at 300mA(Vout=5V)
• Pb-free lead plating and halogen-free package Product Description The LM1114 series is a group of positive voltage output, three-pin regulators, that provide a high current even when the input/output voltage differential is small. Low power consumption and high accuracy is achieved through CMOS and programmable fuse technologies. The LM1114 consists of a high-precision voltage reference, an error correction circuit, and a current limited output driver. Transient response to load variations is improved in comparison to the existing ones. Absolute Maximum Ratings Parameter Symbol Ratings Units Input V oltage Vin -0.3~+12 V Output Current Iout 500 mA

500 Continuous Total Power

Operating Ambient Temperature Topr -40〜+125 ℃ Storage Temperature Tstg -65〜+150 ℃ Pin Configuration TO-92 SOT-89 1 2 3 Vss Vin V out 1 2 3 Vss Vin V out

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 2/11 LM1114M3B/A3B CYStek Product Specification Block Diagram Voltage CurrentLimit Reference V VOUIN T V SS VSS VOUT VIN Typical Application Circuit

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 3/11 LM1114M3B/A3B CYStek Product Specification

Ordering Information

Device Output Voltage Package Shipping LM1114-3.3 A3B-0-TB- G 3.3V TO-92 (Pb-free lead plating and halogen-free package) Tape & Box / 2K LM1114-3.3 M3B-0-T2- G 3.3V SOT-89 (Pb-free lead plating and halogen-free package) Tape & Reel / 1K LM1114-5.0 A3B-0-TB- G 5.0V TO-92 (Pb-free lead plating and halogen-free package) Tape & Box / 2K LM1114-5.0 M3B-0-T2- G 5.0V SOT-89 (Pb-free lead plating and halogen-free package) Tape & Reel / 1K Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T2 :1000 pcs/tape & reel, 7” reel ; TB : 2000 pcs/ tape & box Product rank, zero for no rank products Product name Electrical Characteristics @Ta=25℃, CIN=1μF(tantalum), COUT=1μF(tantalum), unless otherwise noted LM1114-3.3 Parameter Conditions Min Typ Max Units Circuit Output Voltage Io=40mA,Vin=4.3V 3.234 3.300 3.366 V 1 Io=1mA, 5.5V<Vin<12V - - 55 mV 1 Line Regulation Io=40mA,4.3V<Vin<10V - - 60 mV 1 Vin=5V, 0.1mA<Io<100mA - - 20 mV 1 Load Regulation Vin=5V, 0.1mA<Io<300mA - - 50 mV 1 Supply Current Vin=4V - 9 50 μA 2 Current Limit Vin=7V 300 - - mA Io=80mA - 0.1 0.3 V 1 Io=160mA - 0.2 0.4 V 1 Dropout Voltage Io=300mA - 0.36 0.6 V 1 LM1114-5.0 Parameter Conditions Min Typ Max Units Circuit Output Voltage Io=40mA,Vin=6.0V 4.900 5.000 5.100 V 1 Io=1mA, 5.5V<Vin<12V - - 60 mV 1 Line Regulation Io=40mA, 6V<Vin<10V - - 55 mV 1 Vin=7V, 0.1mA<Io<100mA - - 40 mV 1 Load Regulation Vin=7V, 0.1mA<Io<300mA - - 60 mV 1 Supply Current Vin=6.0V - 16 50 μA 2 Current Limit Vin=7V 300 - - mA

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 4/11 LM1114M3B/A3B CYStek Product Specification Io=100mA - 0.1 0.3 V 1 Io=200mA - 0.2 0.4 V 1 Dropout Voltage Io=300mA - 0.3 0.6 V 1 Test Circuits Circuit 1 Circuit 2

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 5/11 LM1114M3B/A3B CYStek Product Specification Characteristic Curves @CIN=1μF(tantalum), COUT=1μF(tantalum) LM1114-3.3 Output Voltage vs Input Voltage 1.0 1.5 2.0 2.5 3.0 3.5 4.0 02468 1 0 1 2 Vin, Input Voltage(V) Vout, Output Voltage(V) Iout=1mA Iout=40mA Iout=80mA Input-Output Voltage Differential 100 150 200 250 300 350 400 0 50 100 150 200 250 300 Iout, Output Current (mA) Vd, Voltage differential(mV) Supply Current vs Input Voltage 02468 1 0 1 2 Vin, Input Voltage(V) Iss, Supply Current(μA)

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 6/11 LM1114M3B/A3B CYStek Product Specification LM1114-5.0 Output Voltage vs Input Voltage 3.0 3.5 4.0 4.5 5.0 5.5 02468 1 0 1 2 Vin, Input Voltage(V) Vout, Output Voltage(V) Iout=1mA Iout=40mA Iout=80mA Input-Output Voltage Differential 100 150 200 250 300 350 0 50 100 150 200 250 300 Iout, Output Current (mA) Vd, Voltage differential(mV) Supply Current vs Input Voltage 02468 1 0 1 2 Vin, Input Voltage(V) Iss, Supply Current(μA)

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 7/11 LM1114M3B/A3B CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 8/11 LM1114M3B/A3B CYStek Product Specification TO-92 Taping Outline Millimeters DIM Item Min. Max. A Component body height 4.33 4.83 D Tape Feed Diameter 3.80 4.20 D1 Lead Diameter 0.36 0.53 D2 Component Body Diameter 4.33 4.83 F1,F2 Component Lead Pitch 2.40 2.90 F1,F2 F1-F2 - ±0.3 H Height Of Seating Plane 15.50 16.50 H1 Feed Hole Location 8.50 9.50 H2 Front To Rear Deflection - 1 H2A Deflection Left Or Right - 1 H3 Component Height - 27 H4 Feed Hole To Bottom Of Component - 21 L Lead Length After Component Removal - 11 L1 Lead Wire Enclosure 2.50 - P Feed Hole Pitch 12.50 12.90 P1 Center Of Seating Plane Location 5.95 6.75 P2 4 Feed Hole Pitch 50.30 51.30 T Over All Tape Thickness - 0.55 T1 Total Taped Package Thickness - 1.42 T2 Carrier Tape Thickness 0.36 0.68 W Tape Width 17.50 19.00 W1 Adhesive Tape Width 5.00 7.00 - 20 pcs Pitch 253 255 H2AH2AH2H2 D2 A H W L P F1F2 D1 D T

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 9/11 LM1114M3B/A3B CYStek Product Specification Reel Dimension for SOT-89 Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 10/11 LM1114M3B/A3B CYStek Product Specification TO-92 Dimension *: Typical Inches D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 18,2002. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. LM 1114 □□□□ Marking: A D B C I α1 E F Device Name Date Code Voltage: 1.8V→18 2.5V→25 3.0V→30 3.3V→33 3.6V→36 5.0V→50H G Style: Pin 1.Vss 2.Vin 3.Vout 3-Lead TO-92 Plastic Package CYStek Package Code: A3

CYStech Electronics Corp. Spec. No. : C505A3-A Issued Date : 2003.03.21 Revised Date : 2014.01.03 Page No. : 11/11 LM1114M3B/A3B CYStek Product Specification SOT-89 Dimension *: Typical Marking: E 0.01417 0.0201 0.36 0.51 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 E F G C B A 321 I D H 1114 Style: Pin 1. Vss 2. Vin 3. Vout Device Code Date Code V oltage: 1.8V→18 2.5V →25 3.0V→30 3.3V→33 3.6V→36 5.0V→50