L825HW

L825HW SUPERWORLD | Alldatasheet

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(a) (c) (b) (e) (d) 1. PART NO. EXPRESSION : (b) Type code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : 7.0 Max. A' A B' 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core (b) Wire (c) Terminal a 3. SCHEMATIC : (d) Tolerance code : M = ±20% (e) F : Lead Free 5. FEATURES : b) Frequency up to 5MHz a) Shielded Construction L825HW SERIES b c PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 PCB Pattern H G 6.47±0.5 BC ' C 5.2 Max. 5.0 Max. D E C B SWORLD 1R5 A 1.6±0.5 D EGHL Unit:m/m L 7.8 Max. 6.86±0.5 HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD 7. ELECTRICAL CHARACTERISTICS : L825HW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 15.01.2008 g) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. f) Saturation Current (Isat) : Will cause L to drop approximately 20% typ. a) Test Freq. : 100KHz/0.25VDC e) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C 6. GENERAL SPECIFICATION : Inductance L Part No. L825HW-4R7MF 4.7 ( µH ) L825HW-5R6MF L825HW-8R2MF 5.6 8.2 L825HW-100MF 10 L825HW-1R0MF L825HW-1R5MF L825HW-2R2MF L825HW-3R3MF 1.0 1.5 2.2 3.3 L825HW-R82MF 0.82 L825HW-R68MF 0.68 L825HW-R56MF 0.56 ±20% @ 0 Adc 71.3 4.5 4.9 45.6 34.4 30.3 6.5 9.0 13.6 20.9 3.6 DCR ( mȍ ) Max. Irms ( A ) 4.5 5.5 6.5 16.5 ( A ) Isat L825HW-6R8MF 6.8 44.6 5.8 6.5 Typ. Typ. HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 15.01.2008 L825HW SERIES 8. CORE LOSS : 500KHz 100KHz 100KHz and 500KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3 100KHZ 500KHZ KW / m3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 500KHz 200 400 600 800 1000 gauss 1000 2000 3000 4000 KW/m3KW / m3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3KW / m3 gauss HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 15.01.2008 L825HW SERIES 9. RELIABILITY AND TEST CONDITION : TEST CONDITIONPERFORMANCEITEM LCR meter. HP4284A, CH11025, CH3302, CH1320, CH1320S 150°C 230°C approximately ǻT=40°C without core loss solder bath at 230±5°C for 4 seconds. Irms(A) will cause the coil temperature rise Isat(A) will cause Lo to drop approximately 20%. After fluxing components shall be dipped in a melted CH16502, Agilent33420A Micro-Ohm Meter. Solder : Sn-Ag3.0-Cu0.5 Flux for lead free : rosin 150°C 260°C Dip Time : 10±0.5sec. Temperature : 125±5°C Solder Temperature : 260±5°C Conditions of 1 cycle. Time : 500±12 hours Step Total : 5 cycles Temperature : -40±5°C Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Time : 500±12 hours Preheat : 150°C, 60sec. Time : 500±12 hours Temperature : 40±5°C Applied Current : Rated Curent Humidity : 90% to 95% Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. High Temperature Low Temperature Humidity Resistance Thermal Shock Life Test Reliability Test Life Test No disconnection or short circuit. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. Electrical Characteristics Test Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test Solder Heat Resistance Inductance DCR electrical & mechanical damage. 1. Components should have no evidence of 2. Inductance : Within ±20% of initial value. should be covered with solder. Refer to standard electrical characteristics list More than 90% of the terminal electrode 10±0.5 seconds 30±31 -55±3 Within 3 Within 3 30±3 Room Temperature Room Temperature 125±3 Times (min.)Temperature (°C) seconds 4±1 seconds DippingPreheating Natural cooling seconds DippingPreheating Natural cooling HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 15.01.2008 L825HW SERIES 11. PACKAGING INFORMATION : Bo Ko 1.75±0.1 Bo(mm) 7.80±0.1 11-3. Packaging Quantity

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Series Ao(mm) 7.00±0.1 Ao P(mm) 12.0±0.1 Ko(mm) 5.30±0.1 W(mm) 16.0±0.3 P 7.50±0.1 F(mm) W 11-2 Tape Dimension 16.0±0.5 A(mm) 13" x 16mm Type 100±2.0 B(mm) D D(mm) 13.5±0.5 330 C(mm) EMBOSSED CARRIER B A COVER TAPE 11-1. Reel Dimension L825HW 6400 1600 Carton Chip / Reel Inner Box Size 800 2.0±0.5 ØC t(mm) 0.35±0.05 F HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 15.01.2008 L825HW SERIES 11-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 HIGH CURRENT MOLDED POWER INDUCTORS