L822HW

L822HW SUPERWORLD | Alldatasheet

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(a) (c) (b) (e) (d) 1. PART NO. EXPRESSION : (b) Type code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : 7.0 Max. A' A B' 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core (b) Wire (c) Terminal a 3. SCHEMATIC : (d) Tolerance code : M = ±20% (e) F : Lead Free 5. FEATURES : b) Frequency up to 5MHz a) Shielded Construction L822HW SERIES b c PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 PCB Pattern H G 6.47±0.5 BC ' C 2.0 Max. 1.8 Max. D E C B SWORLD R47 A 1.6±0.5 D EGHL Unit:m/m L 7.8 Max. 6.86±0.5 HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD 7. ELECTRICAL CHARACTERISTICS : L822HW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 15.01.2008 g) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. f) Saturation Current (Isat) : Will cause L to drop approximately 20% typ. a) Test Freq. : 100KHz/0.25VDC e) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C 6. GENERAL SPECIFICATION : Inductance L Part No. L822HW-1R0MF 1.00 ( µH ) L822HW-1R5MF 1.50 L822HW-4R7MF L822HW-3R3MF 3.30 4.70 L822HW-R33MF L822HW-R47MF L822HW-R68MF 0.33 0.47 0.68 ±20% @ 0 Adc 9.3 13.9 DCR Max. ( mȍ ) Irms ( A ) 3.25 ( A ) Isat L822HW-2R2MF 2.20 46 59 Typ. Typ. HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD L822HW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 3 15.01.2008 8. CHARACTERISTICS CURVES : 0 3.6 7.2 10.8 14.4 18 DC CURRENT(A) 0. 6 0. 2 0. 4 INDUCTANCE (uH) 100 TEMP. RISE(oC) SMPI0618HW-R33L822HW-R33MF 0369 1 2 1 5 1 8 DC CURRENT(A) 0.15 0. 3 0.45 0. 6 IN DUC TANC E (uH) 100 TEMP. RISE(oC) SMPI0602HW-R47L822HW-R47MF 03 . 4 6 . 8 1 0 . 2 1 3 . 6 1 7 DC CURRENT(A) 0. 2 0. 4 0. 6 0. 8 I ND UCTANCE ( uH) 100 TEMP. RISE(oC) SMPI0602HW-R68L822HW-R68MF 0 2.8 5.6 8.4 11.2 14 DC CURRENT(A) 0. 3 0. 6 0. 9 1. 2 1. 5 I ND UCTANCE ( uH) 100 TEMP. RISE(oC) SMPI0602HW-1R0L822HW-1R0MF 02468 1 0 1 2 DC CURRENT(A) 0.36 0.72 1.08 1.44 1. 8 I ND UCTANCE ( uH) 100 TEMP. RISE(oC) SMPI0602HW-1R5L822HW-1R5MF 0 1.5 3 4.5 6 7.5 9 DC CURRENT(A) 0. 6 1. 2 1. 8 2. 4 I ND UCTANCE ( uH) 100 TEMP. RISE(oC) SMPI0602HW-2R2L822HW-2R2MF HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 15.01.2008 8. CHARACTERISTICS CURVES : L822HW SERIES 01234567 DC CURRENT(A) 1. 5 4. 5 I ND UCTANCE ( uH) 100 TEMP. RISE(oC) SMPI0602HW-3R3L822HW-3R3MF 012345 DC CURRENT(A) IN DUC TANC E (uH) 100 TEMP. RISE(oC) SMPI0602HW-4R7L822HW-4R7MF HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 15.01.2008 L822HW SERIES 9. CORE LOSS : 500KHz 100KHz 100KHz and 500KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3 100KHZ 500KHZ KW / m3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 500KHz 200 400 600 800 1000 gauss 1000 2000 3000 4000 KW/m3KW / m3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3KW / m3 gauss HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 15.01.2008 L822HW SERIES 10. RELIABILITY AND TEST CONDITION : Electrical Characteristics Test No disconnection or short circuit. Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Heat Rated Current (Irms) Mechanical Performance Test Humidity Resistance Thermal Shock Reliability Test Life Test Life Test Low Temperature High Temperature Solder Heat Resistance Saturation Current (Isat) Solderability Test Inductance DCR Dipping Temperature (°C) Room Temperature Room Temperature 10±0.5 seconds Applied Current : Rated Curent Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. 2. Inductance : Within ±20% of initial value. 2. Inductance : Within ±20% of initial value. 1. Appearance : No damage No disconnection or short circuit. Total : 5 cycles Temperature : 40±5°C Humidity : 90% to 95% Step Conditions of 1 cycle. 1- 5 5 ± 3 +125±3 1. Appearance : No damage Temperature : -55±5°C Time : 500±12 hours Time : 500±12 hours Temperature : 125±5°C 150°C 260°C seconds Preheating Within 3 30±3 Within 3 30±3 Times (min.) cooling Natural Solder Temperature : 230±5°C 2. Temperature measured by digital surface thermometer 1. Applied the allowed DC current Dipping 4±1 seconds CH16502, Agilent33420A Micro-Ohm Meter. HP4284A, CH11025, CH3302, CH1320, CH1320S approximately ǻT=40°C without core loss Solder Temperature : 260±5°C Irms(A) will cause the coil temperature rise Isat(A) will cause Lo to drop approximately 20% typical Flux for lead free : rosin 1. Appearance : No significant abnormally 2. Inductance changed : Within ±20% seconds Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Flux for lead free : rosin Dip Time : 4±1sec. 150°C 230°C Preheating Refer to standard electrical characteristics list More than 90% of the terminal electrode should be covered with solder. Solder : Sn99.95-Cu0.05 Preheat : 150°C, 60sec. LCR meter. cooling Natural ITEM TEST CONDITION PERFORMANCE HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 8 15.01.2008 L822HW SERIES 12. PACKAGING INFORMATION : Bo Ko 1.75±0.1 Bo(mm) 7.30±0.1 12-3. Packaging Quantity

0.15 MIN

Series Ao(mm) 7.30±0.1 Ao P(mm) 12.0±0.1 Ko(mm) 2.20±0.1 W(mm) 16.0±0.3 P 7.50±0.05 F(mm) W 12-2 Tape Dimension 16.0±0.5 A(mm) 13" x 16mm Type 100±2.0 B(mm) D D(mm) 13.5±0.5 330 C(mm) EMBOSSED CARRIER B A COVER TAPE 12-1. Reel Dimension L822HW 12000 3000 Carton Chip / Reel Inner Box Size 1500 2.0±0.5 ØC t(mm) 0.35±0.05 F HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 L822HW SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 HIGH CURRENT MOLDED POWER INDUCTORS PG. 9