L817PW

L817PW SUPERWORLD | Alldatasheet

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(a) (c) (b) (e) (d) 1. PART NO. EXPRESSION : (b) Type code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : A 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core (b) Wire (c) Terminal a 3. SCHEMATIC : (d) Tolerance code : M = ±20% (e) F : Lead Free 5. FEATURES : b) Frequency up to 5MHz a) Shielded Construction L817PW SERIES b c PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 PCB Pattern H G 9.0 Max. BC ' C 5.2 Max. 5.0 Max. D E C B A SWORLD R68 2.2±0.5 D EGHL Unit:m/m L 9.5 Max. HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD 7. ELECTRICAL CHARACTERISTICS : L817PW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 15.01.2008 h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. g) Saturation Current (Isat) : Will cause L to drop approximately 20% typ. a) Test Freq. : L : 100KHz/1.0VDC; Q : 100KHz/1.0VDC f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C 6. GENERAL SPECIFICATION : e) Humidity Range : 50 ~ 60% RH L817PW-1R0MF L817PW-R47MF L817PW-3R3MF L817PW-2R2MF L817PW-1R5MF L817PW-R68MF L817PW-R36MF 181.0 3.3 2.2 1.5 0.47 0.68 0.36 7.1 5.4 3.8 4.5 2.4 1.5 1.2 Part No. Irms ( A )( µH ) Inductance L ±20% @ 0 Adc ( A ) Isat ( mȍ ) Max. DCR L817PW-100MF L817PW-6R8MF L817PW-4R7MF 7.0 5.0 9.04.7 10.0 6.8 11 13 12.3 20.5 26.5 Typ.Typ. Min. Q HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD L817PW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 3 15.01.2008 8. CHARACTERISTICS CURVES : 0 8 16 24 32 40 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TEMP. RISE( oC) SM PI 0 905 HW-R 36L817PW-R36MF 0 7.6 15.2 22.8 30.4 38 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI 0905HW-R47L817PW-R47MF 0 6.4 12.8 19.2 25.6 32 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI 0905HW-R68L817PW-R68MF 0 4.4 8.8 13.2 17.6 22 DC CURRENT(A) 0.5 1.5 INDUCTANCE (uH) 100 TE MP . RISE(oC) SM PI 0 905 HW-1R 0L817PW-1R0MF 0 5 10 15 20 DC CURRENT(A) 0.5 1.5 INDUCTANCE (uH) 100 TEMP. RISE( oC) SM PI 0 905 HW-1R 5L817PW-1R5MF 048 1 2 1 6 DC CURRENT(A) 0.8 1.6 2.4 3.2 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI 0905HW-2R2L817PW-2R2MF HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 15.01.2008 8. CHARACTERISTICS CURVES : L817PW SERIES 0 2.8 5.6 8.4 11.2 14 DC CURRENT(A) INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI 0905HW-3R3L817PW-3R3MF 0 2.6 5.2 7.8 10.4 13 DC CURRENT(A) INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI 0905HW-4R7L817PW-4R7MF 0 2.2 4.4 6.6 8.8 11 DC CURRENT(A) INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI 0905HW-6R8L817PW-6R8MF 0 1.8 3.6 5.4 7.2 9 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE( oC) S MPI 0905HW-100L817PW-100MF HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 15.01.2008 L817PW SERIES 9. CORE LOSS : 500KHz 100KHz 100KHz and 500KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3 100KHZ 500KHZ KW / m3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 500KHz 200 400 600 800 1000 gauss 1000 2000 3000 4000 KW/m3KW / m3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3KW / m3 gauss HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 15.01.2008 L817PW SERIES 10. RELIABILITY AND TEST CONDITION : Electrical Characteristics Test defects harmful to the characteristics should not be allowed. Appearance : Cracking, shipping and any other 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Random Vibration Test Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit.Thermal Shock Low Temperature High Temperature Life Test Life Test Total : 5 cycles Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Amplitude : 1.52mm Frequency : 10-55-10Hz for 1 min. directions (Total 6 hours). Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Temperature : 40±5°C Times (min.) 30±3 Within 3 Within 3 30±3 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Temperature (°C) Room Temperature Room Temperature Conditions of 1 cycle. Step +125±3 -55±3 Time : 500±12 hours Time : 500±12 hours Temperature : -55±5°C Temperature : 125±5°C NaturalPreheating Dipping 2. Inductance change : Within ±20% 1. Appearance : No significant abnormality Reliability Test Solder Heat Resistance Preheating seconds 150°C 260°C 10±0.5 seconds Dipping Natural cooling seconds 150°C 245°C 4±1 seconds cooling Refer to standard electrical characteristics list More than 90% of the terminal electrode should be covered with solder. Solderability Test Mechanical Performance Test Saturation Current (Isat) Heat Rated Current (Irms) DCR Inductance Flux for lead free : rosin Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Solder : Sn99.95-Cu0.05 Preheat : 150°C, 60sec. Dip Time : 4±1sec. Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss HP4284A, CH11025, CH3302, CH1320, CH1320S CH16502, Agilent33420A Micro-Ohm Meter. Isat(A) will cause Lo to drop approximately 20% 2. Temperature measured by digital surface thermometer Solder Temperature : 245±5°C Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 1. Applied the allowed DC current LCR meter. ITEM PERFORMANCE TEST CONDITION HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 8 15.01.2008 L817PW SERIES 12. PACKAGING INFORMATION : Bo Ko 1.75±0.1 Bo(mm) 9.65±0.1 12-3. Packaging Quantity

0.15 MIN

Series Ao(mm) 9.0±0.1 Ao P(mm) 16.0±0.1 Ko(mm) 5.5±0.1 W(mm) 24.0±0.3 P 0.35±0.05 t(mm) W 12-2 Tape Dimension 24.0±0.5 A(mm) 13" x 24mm Type 100±2.0 B(mm) D D(mm) 13.5±0.5 330 C(mm) EMBOSSED CARRIER B A COVER TAPE 12-1. Reel Dimension L817PW 6400 1600 Carton Chip / Reel Inner Box Size 800 2.0±0.5 ØC 11.5±0.1 F(mm) F HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 9 15.01.2008 L817PW SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 HIGH CURRENT MOLDED POWER INDUCTORS