L816 SUPERWORLD | Alldatasheet
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(a) (b) (d) (c) 1. PART NO. EXPRESSION : (b) Inductance code : 1R0 = 1.0uH (c) Tolerance code : M = ±20% (a) Series code 2. CONFIGURATION & DIMENSIONS : A 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core (b) Wire (c) Terminal a 3. SCHEMATIC : (d) F : Lead Free 5. FEATURES : b) Frequency up to 5MHz a) Shielded Construction L816 SERIES b c PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.11.2008 PCB Pattern 13.0 Max. BC ' C D FG H Unit:m/m 13.5 Max. A E D SWORLD C F R68 H GB NC NC 4.0 3.0 9.6 10.0 3.0 NC 2.4 NC HIGH CURRENT MOLDED POWER INDUCTORS
SUPERWORLD ELECTRONICS (S) PTE LTD 7. ELECTRICAL CHARACTERISTICS : L816 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 14.11.2008 h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. g) Saturation Current (Isat) : Will cause L to drop approximately 20% typ. a) Test Freq. : Q : 100KHz/1.0VDC f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -15°C to +40°C 6. GENERAL SPECIFICATION : e) Humidity Range : 50 ~ 60% RH L816-4R7MF L816-3R3MF 2.0 2.0 4.70 3.30 8.8 7.0 L ( µH ) Inductance ±20% @ 0 Adc ( mm ) 0Part No. L816-1R0MF L816-2R2MF L816-1R4MF L816-R68MF 2.0 1.00 2.0 2.0 2.20 1.40 ±0.5 2.0 0.68 E ( A ) ( A ) ( mȍ ) Typ. Typ. 29.7 2.034 4.5 3.4 Max. 38.8 1.5 Irms Isat DCR Min. Q HIGH CURRENT MOLDED POWER INDUCTORS L816-1R2MF 2.0 1.20 24 27 2.6 - L816-2R4MF 2.0 2.40 17 20 5.5 - Test 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 0.25VDC/100K Frequency ( Hz ) 1.0VDC/100K
SUPERWORLD ELECTRONICS (S) PTE LTD L816 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 3 14.11.2008 8. CHARACTERISTICS CURVES : INDUCTANCE VS. FREQUENCY Q VS. FREQUENCY INDUCTANCE VS. DC CURRENT TEMP. RISE VS. DC CURRENT HIGH CURRENT MOLDED POWER INDUCTORS
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 14.11.2008 8. CHARACTERISTICS CURVES : L816 SERIES 08 1 6 2 4 3 2 4 0 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI1354P3-R68L816-R68MF 0 6.8 13.6 20.4 27.2 34 DC CURRENT(A) 0.4 0.8 1.2 1.6 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI1354P3-1R0L816-1R0MF 0 5.2 10.4 15.6 20.8 26 DC CURRENT(A) 0.4 0.8 1.2 1.6 INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI1354P3-1R4L816-1R4MF 0 4 8 1 21 62 0 DC CURRENT(A) 0.5 1.5 2.5 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI1354P3-2R2L816-2R2MF 0369 1 2 1 5 1 8 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE( oC) S MPI1354P3-3R3L816-3R3MF 02 . 557 . 5 1 0 1 2 . 5 1 5 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE( oC) S MPI1354P3-4R7L816-4R7MF HIGH CURRENT MOLDED POWER INDUCTORS
HIGH CURRENT MOLDED POWER INDUCTORS 8. CHARACTERISTICS CURVES : L816 SERIES SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 5 14.11.2008 L816-1R2MF L816-1R2MF L816-2R4MF L816-2R4MF
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 14.11.2008 L816 SERIES 9. CORE LOSS : 500KHz 100KHz 100KHz and 500KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3 100KHZ 500KHZ KW / m3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 500KHz 200 400 600 800 1000 gauss 1000 2000 3000 4000 KW/m3KW / m3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3KW / m3 gauss HIGH CURRENT MOLDED POWER INDUCTORS
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 14.11.2008 L816 SERIES 10. RELIABILITY AND TEST CONDITION : LCR meter. Frequency : 10-55-10Hz for 1 min. Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss CH16502, Agilent33420A Micro-Ohm Meter. 1. Applied the allowed DC current seconds Isat(A) will cause Lo to drop approximately 20% Solder Temperature : 260±5°C Solder Temperature : 245±5°C 2. Temperature measured by digital surface thermometer Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Applied Current : Rated Curent seconds Time : 500±12 hoursLife Test Humidity : 90% to 95% RH Appearance : Cracking, shipping and any other defects harmful to the characteristics should not 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. be allowed. Random Vibration Test directions (Total 6 hours). Amplitude : 1.52mm Time : 500±12 hours 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. 1. Appearance : No damageHumidity Resistance Low Temperature Thermal Shock Life Test 1- 5 5 ± 3 Temperature : 40±5°C Total : 5 cycles Room Temperature Room Temperature +125±3 Temperature (°C) Conditions of 1 cycle. Step Time : 500±12 hours Temperature : -55±5°C 2. Inductance change : Within ±20% 1. Appearance : No significant abnormality High Temperature Reliability Test Solder Heat Resistance Dip Time : 10±0.5sec. Temperature : 125±5°C 260°C 150°C Preheat : 150°C, 60sec. Flux for lead free : rosin Solder : Sn-Ag3.0-Cu0.5 150°C More than 90% of the terminal electrode should be covered with solder. Saturation Current (Isat) Solderability Test Mechanical Performance Test Heat Rated Current (Irms) DCR Dip Time : 4±1sec. Flux for lead free : rosin 245°C Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 30±3 30±3 Within 3 Within 3 Times (min.) 4±1 seconds cooling 10±0.5 seconds Preheating Dipping Natural Preheating Dipping Natural cooling TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320SRefer to standard electrical characteristics list PERFORMANCE Electrical Characteristics Test ITEM Inductance HIGH CURRENT MOLDED POWER INDUCTORS
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 9 14.11.2008 L816 SERIES 12. PACKAGING INFORMATION : Bo Ko 1.75±0.1 Bo(mm) 13.0±0.1 12-3. Packaging Quantity
0.15 MIN
Series Ao(mm) 14.0±0.1 Ao P(mm) 16.0±0.1 Ko(mm) 5.6±0.1 W(mm) 24.0±0.3 P 0.4±0.05 t(mm) W 12-2 Tape Dimension 24.0±0.5 A(mm) 13" x 24mm Type 100±2.0 B(mm) D D(mm) 13.5±0.5 330 C(mm) EMBOSSED CARRIER B A COVER TAPE 12-1. Reel Dimension L816 4000 1000 Carton Chip / Reel Inner Box Size 500 2.0±0.5 ØC 11.5±0.05 F(mm) F HIGH CURRENT MOLDED POWER INDUCTORS
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 10 14.11.2008 L816 SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 HIGH CURRENT MOLDED POWER INDUCTORS