L811HW-R68MF-13

L811HW_10 SUPERWORLD | Alldatasheet

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(a) (c) (b) (e) (d) 1. PART NO. EXPRESSION : (b) Type code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : 10.5 Max. A' A B' 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core (b) Wire (c) Terminal a 3. SCHEMATIC : (d) Tolerance code : M = ±20% (e) F : RoHS Compliant 5. FEATURES : b) Frequency up to 5MHz a) Shielded Construction L811HW SERIES b c PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 PCB Pattern H G 10.0±0.5 BC ' C 4.2 Max. 4.0 Max. D E C B SWORLD R36 A 2.2±0.5 D EGHL Unit:m/m L 11.8 Max. 10.2±0.5 HIGH CURRENT MOLDED POWER INDUCTORS (f) (f) 11 ~ 99 : Internal controlled number

SUPERWORLD ELECTRONICS (S) PTE LTD 7. ELECTRICAL CHARACTERISTICS : L811HW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 30.08.2010 h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. g) Saturation Current (Isat) : Will cause L to drop approximately 20% typ. a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. b) Ambient Temp. : 20°C e) Humidity Range : 50 ~ 60% RH c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C 6. GENERAL SPECIFICATION : 201.00L811HW-1R0MF- L811HW-6R8MF- L811HW-100MF- L811HW-1R5MF- L811HW-2R2MF- L811HW-4R7MF- L811HW-3R3MF- 6.56.80 10.00 5.0 3.30 4.70 1.50 2.20 10.0 8.0 11.5 ±20% @ 0 Adc Inductance L L811HW-R36MF- L811HW-R56MF- L811HW-R68MF- L811HW-R47MF- Part No. 0.56 0.68 0.36 0.47 ( µH ) Typ. ( A ) Irms 203.528 24.011 9 35.0 16.5 10.0 13.5 7.5 8.56 Max. ( mȍ ) 1.9 2.4 1.4 1.6 Typ. Isat ( A ) DCR Q Min. HIGH CURRENT MOLDED POWER INDUCTORS L811HW-R22MF- 0.22 32 40 1.4 18

SUPERWORLD ELECTRONICS (S) PTE LTD L811HW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 3 30.08.2010 8. CHARACTERISTICS CURVES : INDUCTANCE VS. FREQUENCY Q VS. FREQUENCY INDUCTANCE VS. DC CURRENT TEMP. RISE VS. DC CURRENT HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD L811HW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 30.08.2010 8. CHARACTERISTICS CURVES : HIGH CURRENT MOLDED POWER INDUCTORS 0.05 0.1 0.15 0.2 0.25 0.3 01 0 2 0 3 2 4 0 DC CURRENT (A) INDUCTANCE (u 100 TEMP RISE (°C L811HW-R22MF- INDUCTANCE(uH) 0 8 16 24 32 40 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TEMP. RISE(oC) SMPI1004HW-R36L811HW-R36MFL811HW-R36MF- 08 1 6 2 4 3 2 4 0 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI10 04HW-R47L811HW-R47MFL811HW-R47MF- 0 7.6 15.2 22.8 30.4 38 DC CUR RENT (A) 0. 25 0.5 0. 75 INDUCTANCE (uH) 100 TE MP. RI SE (oC) SMPI1004HW-R56L811HW-R56MFL811HW-R56MF- 0 6.6 13.2 19.8 26.4 33 DC CU RR ENT(A) 0.2 0.4 0.6 0.8 IN DUCTAN CE (uH) 100 TEMP. RI SE( oC) SMPI1004HW-R68L811HW-R68MFL811HW-R68MF- 0 6 12 18 24 30 DC CU RR EN T(A) 0.4 0.8 1.2 1.6 INDU CTAN CE (u H) 10 0 TE M P . RI SE(oC) SMPI1004HW-1R0L811HW-1R0MFL811HW-1R0MF-

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 5 30.08.2010 L811HW SERIES 8. CHARACTERISTICS CURVES : HIGH CURRENT MOLDED POWER INDUCTORS 0 4 .4 8.8 13.2 17.6 22 DC CURRENT(A) 0.6 1.2 1.8 2.4 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI10 04 HW-1R5L811HW-1R5MFL811HW-1R5MF- 0 4.8 9.6 14.4 19.2 24 DC CURRENT(A) 0.8 1.6 2.4 3.2 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI1004HW-2R2L811HW-2R2MFL811HW-2R2MF- 048 1 2 1 6 DC CU RR ENT(A) 1.2 2.4 3.6 4.8 INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI1004 HW-3R3L811HW-3R3MFL811HW-3R3MF- 0 2.8 5.6 8.4 11.2 14 DC CURRENT(A) 1.6 3.2 4.8 6.4 INDUC TANC E (uH) 100 TE MP . RI SE(oC) SM P I 1 00 4H W- 4R7L811HW-4R7MFL811HW-4R7MF- 0 2.2 4.4 6.6 8.8 11 DC CURRENT(A) 2.4 4.8 7.2 9.6 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI1004HW-6R8L811HW-6R8MFL811HW-6R8MF- 0 1.8 3.6 5.4 7.2 9 DC CU RR ENT(A) 2.4 4.8 7.2 9.6 INDUCTANCE (uH) 100 TE MP. RISE(oC) SM PI100 4HW- 100L811HW-100MFL811HW-100MF-

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 30.08.2010 L811HW SERIES 9. CORE LOSS : 500KHz 100KHz 100KHz and 500KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3 100KHZ 500KHZ KW / m3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 500KHz 200 400 600 800 1000 gauss 1000 2000 3000 4000 KW/m3KW / m3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3KW / m3 gauss HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 30.08.2010 L811HW SERIES 10. RELIABILITY AND TEST CONDITION : TEST CONDITIONPERFORMANCEITEM directions (Total 6 hours). 10±0.5 seconds seconds defects harmful to the characteristics should not No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. 1. Appearance : No damage Appearance : Cracking, shipping and any other be allowed. Random Vibration Test Humidity Resistance No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. 1. Appearance : No damage Low Temperature Thermal Shock Life Test Reliability Test High Temperature Life Test +125±333 0 ± 3 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular Within 3 Applied Current : Rated Curent Time : 500±12 hours Amplitude : 1.52mm Frequency : 10-55-10Hz for 1 min. Total : 5 cycles Temperature : 40±5°C Humidity : 90% to 95% Room Temperature4 Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. 30±3 Within 3 Times (min.) Temperature : -55±5°C Time : 500±12 hours Conditions of 1 cycle. Room Temperature Temperature (°C)Step 1- 5 5 ± 3 Temperature : 125±5°C Time : 500±12 hours should be covered with solder. 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Solder Heat Resistance Preheating 260°C 150°C NaturalDipping cooling seconds Preheating 150°C 245°C 4±1 seconds Dipping cooling Natural More than 90% of the terminal electrode Refer to standard electrical characteristics list Saturation Current (Isat) Mechanical Performance Test Solderability Test Heat Rated Current (Irms) Electrical Characteristics Test DCR Inductance Solder : Sn99.95-Cu0.05 Preheat : 150°C, 60sec. Dip Time : 10±0.5sec. Solder Temperature : 260±5°C Flux for lead free : rosin Solder : Sn99.95-Cu0.05 Solder Temperature : 245±5°C Dip Time : 4±1sec. Flux for lead free : rosin 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% typ. CH16502, Agilent33420A Micro-Ohm Meter. HP4284A, CH11025, CH3302, CH1320, CH1320S approximately ǻT=40°C without core loss Irms(A) will cause the coil temperature rise 1. Applied the allowed DC current Preheat : 150°C, 60sec. LCR meter. HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 9 30.08.2010 L811HW SERIES 12. PACKAGING INFORMATION : Bo Ko 1.75±0.1 Bo(mm) 11.8±0.1 12-3. Packaging Quantity

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Series Ao(mm) 10.5±0.1 11.5±0.1 F(mm) Ao P(mm) 16.0±0.1 Ko(mm) 4.5±0.1 W(mm) 24.0±0.3 P 0.35±0.05 t(mm) F W 12-2 Tape Dimension 24.0±0.5 A(mm) 13" x 24mm Type 100±2.0 B(mm) D D(mm) 13.5±0.5 330 C(mm) EMBOSSED CARRIER B A COVER TAPE 12-1. Reel Dimension L811HW 7200 1800 Carton Chip / Reel Inner Box Size 900 2.0±0.5 ØC HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 10 30.08.2010 L811HW SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 HIGH CURRENT MOLDED POWER INDUCTORS