L201610 SUPERWORLD | Alldatasheet

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(a) (b) (d) (b) Dimension code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 3. SCHEMATIC : (d) Tolerance code : M = ±20%, Y = ±30% 5. GENERAL SPECIFICATION : b) Rated current : Base on temp. rise a) Temp. rise : 40°C Max. L201610 SERIES FERRITE CHIP INDUCTORS PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 13.10.2011 1.6 ±0.2 Unit:m/m 2.0 ±0.3 A 1.0 Max. C A D B 0.50 ±0.3 b Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) c) Storage temp. : -40°C to +105°C d) Operating temp. : -40°C to +105°C e) Resistance to solder heat : 260°C.10secs (c) (e) Internal Controller Number (e) B C D

SUPERWORLD ELECTRONICS (S) PTE LTD FERRITE CHIP INDUCTORS L201610 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 13.10.2011 6. ELECTRICAL CHARACTERISTICS : Part Number Inductance (µH) 6-1. INDUCTANCE VS. FREQUENCY CURVE : 6-2 INDUCTANCE-CURRENT CURVE : L2016101R0M- Test Frequency (MHz) Rated Current (mA) Max DC Resistance (ȍ) SRF (MHz) Min 1.0 ±20% 1 1300 0.12 ±30% 110 L2016101R5M- 1.5 ±20% 1 1300 0.12 ±30% 75 L2016102R2M- 2.2 ±20% 1 1200 0.14 ±30% 70 L2016103R3M- 3.3 ±20% 1 1000 0.18 ±30% 50 L2016104R7M- 4.7 ±20% 1 900 0.23 ±30% 40

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 13.10.2011 FERRITE CHIP INDUCTORS L201610 SERIES 7. RELIABILITY & TEST CONDITION : Bending 40(1.575) not be damaged by the forces applied on the The terminal electrode & the dielectric mustFlexture Strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. TEST CONDITIONPERFORMANCE not be damaged by the forces applied on the The terminal electrode & the dielectric must More than 95% of the terminal electrode Refer to standard electrical characteristics list 10±0.5 seconds seconds Terminal Strength Solderability right conditions. W should be covered with solder. seconds Preheating 245°C 150°C 4¡À1.0 seconds cooling Dipping Natural Solder Heat Resistance Temperature Rise Test Operating Temperature DC Resistance Inductance Storage Temperature Preheating 40°C max. (ǻt) 260°C 150°C Dipping cooling Natural Solder : Sn-Cu0.5 Flux for lead free : ROL0 Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder Temperature : 245±5°C 2. Temperature measured by digital surface thermometer. Flux for lead free : ROL0 Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 260±5°C 1. Applied the allowed DC current. HP4291, HP E4991+HP4287 +HP16192 HP4338 No mechanical damage Remaining terminal electrode : 75% min. ITEM 1.0L201610 Size Force (Kfg) Time (sec) -40~+105°C (Including self-temperature rise) -40~+105°C Rated Current Appearance: No significant abnormality. Inductance change: Within ± 10%. Long storage conditions, please see the aplication notice DC Power Supply, over rated current ,there will be some risk > 30 The duration of the applied forces shall be 60(+5) Sec

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 13.10.2011 FERRITE CHIP INDUCTORS L201610 SERIES not be allowed. Appearance : Cracking, Chipping & any other defects harmful to the characteristics should The ferrite should not be damaged by forces applied on the right condition. Random Vibration Test Bending Strength ITEM mutually perpendicular direction.(Total 9 hours) Amplitude : 1.52mm Frequency : 10-55-10Hz for 15 min. Directions & times : X, Y, Z directions for 15 mins This cycle shall be performed 12 times in each of three A PERFORMANCE TEST CONDITION Chip height of 75cm. Drop 10 times on a concrete floor from aDrop No mechanical damage Appearance : No damage. Inductance : Within ±10% of initial value.Temperature Life testing at high temperature Humidity : 90~95% RH. Temperature : 40±2°C Duration : 504±8hrs Duration : 1008±12hrs Applied Current : rated current Temperature : 105±2°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity Measured : 500 times Appearance : No damage. Phase Inductance : Within ±10% of initial value. Low temperature storage test Thermal Shock Number of cycles : 500 Step2 : +105±5°C 30±5 min. Duration : 500±8hrs Temperature : -40±2°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs.room temp -40±2°C <0.5 30±5 Step1 : -40±2°C 30±5 min. Condition for 1 cycle Temperature (°C) Times (min.) 7. RELIABILITY & TEST CONDITION : mm (inches)Size L201610 P-Kgf Appearance : No damage. Inductance : Within ±30% of initial value. 1.40(0.055) 1.0 Inductance: within±30% Inductance change : within±10% +105±2°C3 30±5

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 13.10.2011 FERRITE CHIP INDUCTORS L201610 SERIES 9. PACKAGING INFORMATION : may cause the failure of mechanical or electrical perform ance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanical st ress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 8-3. Solder Volume 9-1. Reel Dimension R0.5 R10.5 13.5±0.5 7" x 8mm D 9-2 Tape Dimension / 8mm B 7" x 8mm C 120° R1.9 2±0.5 A 178.0±2.0 B(mm) 60.0±2.09±0.5 A(mm)Type 13.5±0.5 C(mm) D(mm) Chip Size Reel 3000 L201610 9-3. Packaging Quantity 1.45 max Ko(mm) L201610 Size P(mm) 4.0±0.1 Ao(mm) 1.95±0.10 Bo(mm) t(mm) 0.3 max2.40±0.10 Material : Plastic Po:4±0.1 P P2:2±0.05 F:3.5±0.05 E:1.75±0.1 Bo W:8.0±0.1 Ao D1:1±0.1 A Section A-A Ko A D:1.5+0.1 t

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 13.10.2011 FERRITE CHIP INDUCTORS L201610 SERIES The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 300 (mm/min) Tearing SpeedRoom atmRoom Temp. Room Humidity 2. Transportation : a) Products should be handled with care to avoid dam age or contamination from perspiration and skin oils. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. Application Notice b) Recommended products should be used within 6 months from the time of delivery. 1. Storage Conditions : a) Temperature and humidity conditions : 40°C and 70% RH. To maintain the solderabililty of terminal electrodes : Top cover tape Base tape (%) 45~85 (°C) 5~35 860~1060 (hPa) 9-4. Tearing Off Force 165° to 180° F