L1M-1N0S-10

L1M-1N0S-10 SUPERWORLD | Alldatasheet

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(a) (c) (b) (d) 1. PART NO. EXPRESSION : (a) Series and Dimension code 2. CONFIGURATION & DIMENSIONS : 3. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a (b) Inductance code : 1N0 = 1.0nH (c) Inductance tolerance : S = ± 0.3nH , J = ± 5% , K = ± 10% 4. GENERAL SPECIFICATION : b) Operating temp. : -40° C to +105° C ( include self-temp. rise ) a) Storage temp. : -40° C to +105° C PG. 1 PCB Pattern H G 0.50± 0.10 BD GHL Unit:m/m L 1.00± 0.10 AC 0.50± 0.10 C D A B 0.25± 0.10 b Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) L 1 M - 1 N 0 S - 1 0 (d) 10 : RoHS Compliant High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 5. ELECTRICAL CHARACTERISTICS : ( MHz ) FrequencyPart Number Inductance ( nH ) Test Rated CurrentDC Resistance ( Ω ) ( mA ) L1M-1N0S-10 1.0 100 0.10 SRF (MHz) 12000 Min. 500 Max.Max.Min. Q L1M-1N1S-10 1.1 100 0.12 11500 500 5 L1M-1N2S-10 1.2 100 0.12 11000 500 5 L1M-1N3S-10 1.3 100 0.15 10000 500 5 L1M-1N5S-10 1.5 100 0.15 9500 500 6 L1M-1N6S-10 1.6 100 0.17 9000 500 6 L1M-1N8S-10 1.8 100 0.17 8500 500 6 L1M-2N0S-10 2.0 100 0.18 8300 500 6 L1M-2N2S-10 2.2 100 0.18 8000 500 6 L1M-2N4S-10 2.4 100 0.20 7800 500 6 L1M-2N7S-10 2.7 100 0.20 7500 500 6 L1M-3N0S-10 3.0 100 0.22 7200 400 6 L1M-3N3S-10 3.3 100 0.22 7000 400 6 L1M-3N6S-10 3.6 100 0.25 6800 400 6 L1M-3N9S-10 3.9 100 0.25 6500 400 6 L1M-4N3S-10 4.3 100 0.28 6300 400 6 L1M-4N7S-10 4.7 100 0.28 6000 400 6 L1M-5N1S-10 5.1 100 0.30 5800 400 6 L1M-5N6S-10 5.6 100 0.30 5700 400 6 L1M-6N2S-10 6.2 100 0.35 5600 400 6 L1M-6N8□-10 6.8 100 0.35 5500 400 6 L1M-7N5□-10 7.5 100 0.38 5000 350 6 L1M-8N2□-10 8.2 100 0.38 5000 350 6 L1M-9N1□-10 9.1 100 0.42 4800 350 6 L1M-10N□-10 10 100 0.42 4700 350 6 L1M-12N□-10 12 100 0.47 4300 350 6 L1M-15N□-10 15 100 0.50 4000 300 6 L1M-18N□-10 18 100 0.60 4000 250 6 L1M-22N□-10 22 100 0.70 3500 200 6 L1M-27N□-10 27 100 0.80 3000 200 6 L1M-33N□-10 33 100 0.90 2500 200 6 L1M-39N□-10 39 100 1.00 2000 200 6 High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information. L1M-47N□-10 47 100 1.20 1800 200 6

L1M-56N□-10 56 100 1.30 1500 200 6 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 5. ELECTRICAL CHARACTERISTICS : ( MHz ) FrequencyPart Number Inductance ( nH ) Test Rated CurrentDC Resistance ( Ω ) ( mA ) SRF (MHz) Min. Max.Max.Min. Q L1M-68N□-10 68 100 1.50 1400 150 6 L1M-82N□-10 82 100 1.80 1300 150 6 L1M-R10□-10 100 100 2.20 1100 100 6 L1M-R11□-10 110 100 2.70 1100 100 6 L1M-R12□-10 120 100 3.00 1100 100 6 High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

FREQUE NCY(MHz) 0. 1 10 0 100 0 INDUCTANCE(nH) MGI10 05F L VS Fre q. 1.0n 2.2n 4.7n 10n 33n 100n 10 100 1 000 1000 0 FREQUENCY(MHz) 100 Q MGI100 5F Q VS Freq. 1.0n 2.2 n 4.7n 10n 33 n 100n SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 6. CHARACTERISTICS CURVES : Inductance v.s. Frequency Characteristics Q v.s. Frequency Characteristics High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 7. RELIABILITY & TEST CONDITION : Bending 40(1.575) not be damaged by the forces applied on the The terminal electrode & the dielectric mustFlexture Strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. TEST CONDITIONPERFORMANCE not be damaged by the forces applied on the The terminal electrode & the dielectric must More than 95% of the terminal electr ode Refer to standard electrical characteristics list 10± 0.5 seconds seconds Terminal Strength Solderability right conditions. W should be covered with solder. seconds Preheating 245° C 150° C 4± 1.0 seconds cooling Dipping Natural Solder Heat Resistance Temperature Rise Test Electrical Characteristics Test Rated Current Inductance (Ls) Preheating 260° C 150° C Dipping cooling Natural Solder : Sn-Cu0.5 Flux for lead free: ROL0 Dip Time : 4± 1sec. Preheat : 150° C, 60sec. Solder Temperature : 245± 5° C 2. Temperature measured by digital surface thermometer. Flux for lead free: ROL0 Dip Time : 10± 0.5sec. Preheat : 150° C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 260± 5° C 1. Applied the allowed DC current. Agilent E4991 No mechanical dam age. Remaining terminal electrode : 75% min. ITEM Rated Current < 1A ΔT 20°C Max Rated Current 1A ΔT 40°C Max≧ DC Power Supply Over Rated Current requirements, there will be some risk Q Factor Agilent4287 DC Resistance Agilent 4338 Agilent16192 The duration of the applied forces shall be 60 (+ 5) Sec. For L Series : 1.05 1.0 1.5 0.6 0.5 1.0 > 30 Size Force (Kfg) Time (sec) 10 . 2 High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 not be allowed. Appearance : Cracking, shipping & any other defects harmful to the characteristics should The ferrite should not be dam aged by forces applied on the right condition. Random Vibration Test Bending Str ength ITEM mutually perpendicular directions (Total 9hours). Amplitude : 1.52mm Frequency : 10-55-10Hz for 15 min. Directions & times : X, Y, Z directions for 15 min. This cycle shall be performed 12 times in each of t hree A PERFORMANCE TEST CONDITION Chip Temperature Life testing at High Humidity : 90~95% RH. Temperature : 60± 2° C Duration : 504± 8hrs Duration : 1008± 12hrs Applied Current : rated current Temperature : 105± 2° C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity Measured : 500 times Appearance : No dam age. Phase Inductance : within± 10%of initial value. Low temperature storage test Thermal Shock Number of cycles : 500 Step2 : +105± 2° C 30± 5 min. Duration : 500± 8hrs Temperature : -40± 2° C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. -40± 2° C 1 30± 5 Step1 : -40± 2° C 30± 5 min. Condition for 1 cycle Temperature (° C) Times (min.) height of 75cm. Drop 10 times on a concrete floor from aDrop a. No mechanical damage b. Inductance change: Within ± 30%. 7. RELIABILITY & TEST CONDITION : room temp. 0.5 ≦ Appearance : No dam age. Inductance : within± 10%of initial value. Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85° C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 2.52.70 (0.106) 0.80 (0.033) mm (inches) 1.40 (0.055) 2.00 (0.079) Series name 1.0 2.5 0.3 P-Kgf Q : within± 20%of initial value. Q: within± 20%of initial value. 3 +105± 2° C 30± 5 1. 5A Derating Derated Current(A) Operat ing T emperature(?C) 12585 Operating Temper atur e(℃) High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 8-3. Solder Volume Minimum fillet height = soldering thickness + 25% product height High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

1. PACKAGING INFORMATION : SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 9-1. Reel Dimension 7" x 12mm R0.5 R10.5 13.5± 0.5 7" x 8mm D B 7" x 8mm C 120° 7" x 12mm R1.9 2± 0.5 A 178.0± 2.0 178.0± 2.0 60.0± 2.0 B( mm) 60.0± 2.0 13.5± 0.5 9.0± 0.5 A( mm)Type 13.5± 0.5 13.5± 0.5 C(mm) D(mm) D1:1± 0.1 F:3.5± 0.05 P2:2± 0.05 P E:1.75± 0.1 Po:4± 0.1 3(09) Si ze 3(12) W:8.0± 0.1 Bo Section A- A KoAoA 5 4(11) t A D:1.5+0.1 1.27± 0.10 1.45± 0.10 3.50± 0.10 2.35± 0.10 1.88± 0.10 1.50± 0.10 4.0± 0.1 4.0± 0.1 0.22± 0.05 0.22± 0.05 1.05± 0.10 Ko(mm)Bo(mm) Ao(mm) P(mm) t(mm) Material of taping is plastic 1.0± 0.10 1.0± 0.10 1.0± 0.10 1.0± 0.10 none D1(mm) 2.0± 0.1 P(mm) 4.0± 0.1 4.0± 0.1 0.62± 0.03 1.50± 0.05 3(09) 2.30± 0.05 Si ze Bo(mm ) 1.12± 0.03 0.95± 0.05 0.95± 0.05 Ko(mm) 0.60± 0.03 Ao(mm) none0.95± 0.05 0.95± 0.05 none t(mm) 0.60± 0.03 D1(mm) none P Po:4± 0.1 P2:2± 0.1 F:3.5± 0.1 E:1.75± 0.1 Ao D:1.56 +0 . 1 -0.05 Bo W:8.0± 0.1 Ko t 2.0± 0.05 P(mm) 0.38± 0.050 Si ze Bo(mm ) 0.68± 0.05 Ko(mm) 0.50max Ao(mm) t(mm) 0.50max D1(mm) none Material of taping is paper P Po:4± 0.1 P2:2± 0.1 F:3.5± 0.1 E:1.75± 0.1 Ao D:1.50 +0 . 1 -0.00 Bo W:8.0± 0.3 Ko t 9-2 Tape Dimension / 8mm Seri e s L L Seri e s L Seri e s High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 10 9-2.1 Tape Dimension / 12mm P F:5.5± 0.05 D1:1.5± 0.1 A E:1.75± 0.1 Po:4± 0.1D:1.5+0.1 A Si ze W:12.0± 0.1 Bo Section A- A KoAo P2:2± 0.05 t 6 1.93± 0.1 Ko(mm)Ao(mm)Bo(mm) P(mm) t(mm) Application Notice a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) Recommended products should be used within 6 months from the time of delivery. a) Temperature and humidity conditions : -10~ 40° C and 30~70% RH. 2. Transportation : 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : Base tape 9-4. Tearing Off Force Top cover tape 165° to 180° F Bulk (Bags) Chip Size Chip / Reel Inner Box Middle Box Carton 9-3. Packaging Quantity 30000 125000 62500 12000 40000 20000 50000 75000 150000 2500 125004000 1000 15000 3000 4(11) The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Tearing SpeedRoom HumidityRoom Temp. (° C) 5~35 (%) 45~85 Room atm 860~1060 (hPa) 300 (mm/min) 200000 200000 100000 100000 150000 100000 200000 50000 100000 20000 4000 2000010000 2000 4000 3(09)3(12) D1(mm) 1.5± 0.1 300000 500000 250000 50000 10000 750000 375000 75000 15000 20000 80000 40000 2000 8000 50000 75000 150000 3000 15000 4(09) Seri e s L High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.