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Technical content

Features

Radiant peak output power: >=21 W Peak emission wavelength: 905 nm Emitting area size: 70 μm × 10 μm

Applications

Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2015 Hamamatsu Photonics K.K. Note: General operating condition: pulse width tw = 50 ns, repetition frequency fr = 1 kHz

Cat. No. LPLD2017E03 JUN. 2015 HPK

3 Stack Pulsed Laser Diode L11854-307-05

Figure 1: Radiant output power vs. Forward current (typ.) Figure 3: Directivity (typ.) Figure 2: Typical emission spectrum 02468 1 0 Forward current Ifp (A) Radiant output power Φep (W) (Top(c) = 25 ℃) 885 895 100 905 915 Wavelength (nm) Relative radiant output power (%) 925 (Ifp = 7 A, Top(c) = 25 ℃) -40 100 -30 -20 Angle (degree) Relative radiant output power (%) -10 0 10 20 30 40 (Ifp = 7 A, Top(c) = 25 ℃) Parallel θ// Vertical θ⊥ Figure 4: Dimensional outline (unit: mm) 0.4 0.4 N.C. (no connection) LD cathode LD anode (Case) LD Glass window 1.0 MIN. 3.55±0.2 4.4 MAX. 2.0±0.2 1.0 1.2±0.1 1.3±0.2 6.5±0.5 2.4±0.1 0.2 MAX.0.4 MAX. 0.45±0.05 Lead 5.6 +0.01 -0.05 90°±2° Handling Precautions for L11854-307-05 1. Precautions for handling The LD (laser diode) may be damaged or its performance may deteriorate due to such factors as electrostatic discharge from the human body, surge voltages from measurement equipment, leakage voltages from soldering irons, and packing materials. As a countermeasure against static electricity, the device, operator, work place and measuring jigs must all be set at the same electric potential. In using LD, observe the following precautions: ∑To protect the device from static electricity charges which accumulate on the operator or the operator's clothes, use a wrist strap etc. to ground the operator's body via a high impedance resistor (1 MΩ). ∑A semiconductive sheet should be laid on both the work table and the floor in the work area. When soldering, use an electrically grounded soldering iron with an isolation resistance of more than 10 MΩ. ∑For containers for transportation and packing, use of antistatic material (material that minimizes the generation of static change when rubbed against or separated from itself or other similar materials). 2. Precautions for mounting (1)Lead forming To form the leads, hold the base of the leads securely and bend them so that no force is applied to the package. Lead forming should be done before soldering. (2)Cutting off the leads If leads are out when still at a high temperature, this may cause an electrical discontinuity. Always cut off the leads when they are at room temperature. Never cut off the leads immediately after they are soldered. Handling Precautions for L11854-307-05 1. Precautions for handling The LD (laser diode) may be damaged or its performance may deterio- rate due to such factors as electrostatic discharge from the human body, surge voltages from measurement equipment, leakage voltages from soldering irons, and packing materials. As a countermeasure against static electricity, the device, operator, work place and measuring jigs must all be set at the same electric potential. In using LD, observe the following precautions: ∑To protect the device from static electricity charges which accumulate on the operator or the operator's clothes, use a wrist strap etc. to ground the operator's body via a high impedance resistor (1 MΩ). ∑A semiconductive sheet should be laid on both the work table and the floor in the work area. When soldering, use an electrically grounded soldering iron with an isolation resistance of more than 10 MΩ. ∑For containers for transportation and packing, use of antistatic material (material that minimizes the generation of static change when rubbed against or separated from itself or other similar materials). 2. Precautions for mounting (1)Lead forming To form the leads, hold the base of the leads securely and bend them so that no force is applied to the package. Lead forming should be done before soldering. (2)Cutting off the leads If leads are out when still at a high temperature, this may cause an electrical discontinuity. Always cut off the leads when they are at room temperature. Never cut off the leads immediately after they are soldered. Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658, E-mail: info@hamamatsu.de United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777, E-mail: info@hamamatsu.co.uk North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 SE-164 40 Kista, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01, E-mail: info@hamamatsu.se HAMAMATSU PHOTONICS K.K. HAMAMATSU PHOTONICS K.K., Laser Group, Laser Business Promotion Group 1-8-3, Shinmiyakoda, Kita-ku, Hamamatsu City, Shizuoka, 431-2103, Japan, Telephone: (81)53-484-1301, Fax: (81)53-484-1302, E-mail: laser-g@lsr.hpk.co.jp www.hamamatsu.com