KTD2058 FOSHAN | Alldatasheet

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Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 TO-220F 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-220F Plastic Package. 饱和压降低，与 KTB1366 互补。 Low saturation voltage, complementary to KTB1366. 用于一般放大。 General Purpose Application. PIN1：Base PIN 2 ：Collector PIN 3 ：Emitter 放大及印章代码 / h FE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g hFE Classifications Symbol O Y hFE Range 60~120 100~200 1 2 3

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 60 V Collector to Emitter Voltage VCEO 60 V Emitter to Base Voltage V EBO 7.0 V Collector Current - Continuous I C 3.0 A Base Current IB 0.5 A Collector Power Dissipation PC 2.0 W Collector Power Dissipation P C(Tc=25 )℃ 25 W Junction Temperature Tj 150 ℃ Storage Temperature Range Tsag -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector-Emitter Breakdown Voltage VCEO I C=50mA IB=0 60 V Collector Cut-Off Current I CBO VCB=60V IE=0 100 μA Emitter Cut-Off Current I EBO VEB=7.0V IC=0 100 μA DC Current Gain h FE V CE=5.0V IC=500mA 60 200 Collector to Emitter Saturation Voltage VCE(sat) IC=2.0A IB=200mA 0.25 1.0 V Base-Emitter Voltage V BE V CE=5.0V IC=500mA 0.7 1.0 V Transition Frequency f T VCE=5.0V IC=500mA 3.0 MHz Collector output capacitance C ob VCB=10V IE=0 f=1.0MHz 35 pF Turn-On Time t on I B1=-IB2=0.2A 0.65 μS Storage Time t stg I B1=-IB2=0.2A 1.3 μS Fall Time t f I B1=-IB2=0.2A 0.65 μS 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： D2058：  为型号代码 Note: BR: Company Code. D2058: Product Type. O: h FE Classifications Symbol. **: Lot No. Code, code change with Lot No. D2058 ** O BR

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-220F 200 10 2,000 5 10,000 135×190 237×172×102 560×245×195 套管包装 / T U B E Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 TO-220F 50 20 1,000 5 5,000 532×31.4×5.5 555×164×50 575×290×180 使用说明 / N o t i c e s