KTC200 FOSHAN | Alldatasheet

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Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 TO-92 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-92 Plastic Package. 放大特性好，与 KTA200 互补。 Excellent hFE linearity, complementary pair with KTA200. 用于普通放大及开关电路。 General amplifier and switching application. PIN1：Base PIN 2 ：Collector PIN 3 ：Emitter 放大及印章代码 / hFE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g hFE Classifications Symbol O Y hFE Range 70~140 120~240 1 2 3

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 60 V Collector to Emitter Voltage VCEO 45 V Emitter to Base Voltage V EBO 5.0 V Collector Current - Continuous I C 500 mA Emitter Current - Continuous I E -500 mA Collector Power Dissipation P C 625 mW Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector Cut-Off Current I CBO VCB=50V IE=0 0.1 μA Emitter Cut-Off Current I EBO VEB=5.0V IC=0 0.1 μA DC Current Gain hFE(1) V CE=2.0V IC=50mA 70 240 hFE(2) V CE=2.0V IC=200mA 25 Collector to Emitter Saturation Voltage VCE(sat) IC=100mA IB=10mA 0.25 V Base to Emitter Voltage V BE V CE=2.0V IC=200mA 1.0 V Transition Frequency f T VCE=6.0V IC=20mA 300 MHz Collector Capacitance C ob VCB=6.0V IE=0 f=1.0MHz 7.0 pF 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： C200：  为型号代码 Y :   为 h FE 分档代码 Note: BR: Company Code. C200: Product Type. Y:   h FE Classifications Symbol **: Lot No. Code,code change with Lot No. BR ** C200 Y

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-92 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 编带包装 / A M M O Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 Outer Box 箱 TO-92 3,000 1 120 10 30,000 328×230×42 小箱 480×346×235， 大箱 547×407×268 使用说明 / N o t i c e s