KSD526 FOSHAN | Alldatasheet

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Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 TO-220 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-220 Plastic Package. 与 KSB596 互补。 Complementary pair with KSB596. 用于一般功率放大。 Power amplifier applications. PIN1：Base PIN 2 ：Collector PIN 3 ：Emitter 放大及印章代码 / h FE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g hFE Classifications Symbol R O Y hFE Range 40～80 70 ～140 120 ～240 3 2 1

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 80 V Collector to Emitter Voltage VCEO 80 V Emitter to Base Voltage V EBO 5.0 V Collector Current - Continuous I C 4.0 A Base Current - Continuous I B 0.4 A Collector Power Dissipation P C(TC=25 )℃ 30 W Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector to Emitter Breakdown Voltage VCEO I C=50mA IB=0 80 V Emitter to Base Breakdown Voltage V EBO I E=10mA IC=0 5.0 V Collector Cut-Off Current I CBO VCB=80V IE=0 30 μA Emitter Cut-Off Current I EBO VEB=5.0V IC=0 100 μA DC Current Gain hFE(1) V CE=5.0V IC=500mA 40 240 hFE(2) V CE=5.0V IC=3.0A 15 50 Collector to Emitter Saturation Voltage VCE(sat) IC=3.0A IB=0.3A 0.45 1.5 V Base to Emitter On Voltage V BE(on) VCE=5.0V IC=3.0A 1.0 1.5 V Transition Frequency f T V CE=5.0V IC=0.5A 3.0 8.0 MHz Collector Output Capacitance C ob VCB=10V IE=0 f=1.0MHz 90 pF 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： D526：  为型号代码 Y :   为 h FE 分档代码 Note: BR:   Company Code D526: Product Type. Y:  h FE Classifications Symbol **:  Lot No. Code, code change with Lot No. BR ** D526 Y

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp.:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-220/F 200 10 2,000 5 10,000 135×190 237×172×102 560×245×195 套管包装 / T U B E Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 TO-220/F 50 20 1,000 5 5,000 532×31.4×5.5 555×164×50 575×290×180 使用说明 / N o t i c e s