KBP005G FUJI | Alldatasheet
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Technical content
1.5 AMP GLASS PASSIVATED
¢ Surge overload rating to 40 Amperes peak ¢ Ideal for printed circuit board a . . ; a Outline Drawin | ¢ Reliable low cost construction utilizing molded 9 plastic technique results in inexpensive product OO a © UL recognized: File #E106441 KBP-G im [Min | Max * UL recognized 94V-0 plastic material A , - ee en SLO ae
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Hi Mechanical Data 8 [356 [+08 . + y+ jay [& [27 [oe © Case: Molded plastic WU tic w|i | 142 | Leads: Tin plated copper mal Y | Bate 19) K oso | 1.10 e Leads solderable per MIL-STD-202, | 4 tp ass Paes] Method 208 i | 3" Nominal © Weight: 0.05 ounce, 1.52 grams Gale wm an aap] Dimensions in inches and (millimeters} i Maximum Ratings & Characteristics ®@ Ratings at 25° C ambient temperature unless otherwise specified © Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% [ oo 'KBP | KBP | KBP | KBP | KBP | KBP |] KBP | Qiite | | ee 7 00sG | O1G | 02G | 04G | 06G | 08G | 106 |_ Maximum Recurrent Peak Reverse Voltage | Verw 50 100 200 | 400 600 800 1000 Maximum RMS Voltage Vems | 35 | 70 | 140 | 280 | 420 | Maximum DC Blocking Voltage Voc 60 | 100 | 200 | 400 | 600 | 800 | 1000 | V | Maximum Average Forward @TA=75°C] | 15 A | Output Current _ — | Peak Forward Surge Current | | 8.3 ms Single Half-Sine-Wave Irs 40 A | Superimposed On Rated Load ot _ Maximum DC Forward Voltage Drop per Element Ve 14 | Maximum DC Reverse Current At Rated@ Ta = 25°C | Ir | 5 ) a DC Blocking Voltage per Element _@ Ta = 125°C I 500 |__? t Rating for Fusing (t < 8.3ms) Pt | 7 ee 66 Typical Junction Capacitance Per Element * Cc | 20 Typical Thermal Resistance ** | Revntyc) | ee Operating Temperature Range Z | T _ -55 to +150 Storage Temperature Range | tste | -55 to +150 lc} Notes: * Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC * Thermal resistance junction to case Collmer Semiconductor, Inc.