KBDDLM31.13-6D7E-25-24A4

KBDDLM31.13 AMSCO | Alldatasheet

Document overview

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Technical content

KB DDLM31.13 1 Version 1.3 | 2020-07-17 Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

KB DDLM31.13 SYNIOS ® S2222 This square package with just 2mm outline combines best performance with a small footprint. A centralized chip allows an easy integration in optical systems. The availability of different main colors and white points gives highest flexibility in various application areas. —Architecture / Garden Lighting (LED & Laser) —Electronic Equipment —Industrial Automation (Machine Controls, Light Barriers, Vision Controls) —Mood Lighting —Smart Home, Metering —Transportation, Plane, Ship —White Goods Features: —Package: white SMT package, colorless clear silicone resin —Chip technology: InGaN on Sapphire —Typ. Radiation: 120° (Lambertian emitter) —Color: λdom = 450 nm (● blue) —ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

KB DDLM31.13 2 Version 1.3 | 2020-07-17

Ordering Information

Type Luminous Flux 1) Ordering Code IF = 140 mA ΦV KB DDLM31.13-6D7E-25-24A4 5000 ... 10000 mlm Q65112A5716

KB DDLM31.13 3 Version 1.3 | 2020-07-17 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 110 °C Storage Temperature Tstg min. max. -40 °C 110 °C Junction Temperature Tj max. 125 °C Forward current TS = 25 °C IF min. max. 10 mA 200 mA Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C IFS max. 400 mA Reverse voltage 2) TS = 25 °C VR max. 5 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD 2 kV

KB DDLM31.13 4 Version 1.3 | 2020-07-17 Characteristics IF = 140 mA; TS = 25 °C Parameter Symbol Values Dominant Wavelength 3) IF = 140 mA λdom min. typ. max. 444 nm 450 nm 461 nm Viewing angle at 50% IV 2φ typ. 120 ° Forward Voltage 4) IF = 140 mA VF min. typ. max. 2.80 V 3.15 V 3.40 V Reverse current 2) VR = 5 V IR typ. max. 0.01 µA 10 µA Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

31 K / W

40 K / W

Electrical thermal resistance junction/solderpoint 5) with efficiency ηe = 55 % RthJS elec. typ. max.

14 K / W

18 K / W

KB DDLM31.13 5 Version 1.3 | 2020-07-17 Brightness Groups Group Luminous Flux 1) Luminous Flux 1) Luminous Intensity 6) IF = 140 mA IF = 140 mA IF = 140 mA min. max. typ. ΦV ΦV Iv 6D 5000 mlm 5600 mlm 1750 mcd 7D 5600 mlm 6300 mlm 1960 mcd 8D 6300 mlm 7100 mlm 2210 mcd 5E 7100 mlm 8000 mlm 2490 mcd 6E 8000 mlm 9000 mlm 2810 mcd 7E 9000 mlm 10000 mlm 3140 mcd Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) IF = 140 mA IF = 140 mA min. max. VF VF 24 2.80 V 3.00 V 64 3.00 V 3.20 V A4 3.20 V 3.40 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) IF = 140 mA IF = 140 mA min. max. λdom λdom 2 444 nm 449 nm 3 449 nm 453 nm 4 453 nm 457 nm 5 457 nm 461 nm

KB DDLM31.13 6 Version 1.3 | 2020-07-17 Group Name on Label Example: 5E-2-24 Brightness Wavelength Forward Voltage 5E 2 24

KB DDLM31.13 7 Version 1.3 | 2020-07-17 Relative Spectral Emission 6) Φrel = f (λ); IF = 140 mA; TS = 25 °C KB DDLM31.13 350 400 450 500 550 600 650 700 750 800 λ /n m 0.0 0.2 0.4 0.6 0.8 1.0Φrel :V λ :b lue Radiation Characteristics 6) Irel = f (ϕ); TS = 25 °C KB DDLM31.13 -100° -90° -80° -70° -60° -50° -40° -30° -20° ϕ / ° 0.0 0.2 0.4 0.6 0.8

1.0 Irel

:0 ° : 90°

KB DDLM31.13 8 Version 1.3 | 2020-07-17 Forward current 6) IF = f(VF); TS = 25 °C KB DDLM31.13 VF /V 100 120 140 160 180 200IF /m A Relative Luminous Flux 6), 7) Φv/Φv(140 mA) = f(IF); TS = 25 °C KB DDLM31.13 10 40 60 80 100 140 180 200 IF /m A 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 ΦV ΦV(140mA) Dominant Wavelength 6) λdom = f(IF); TS = 25 °C KB DDLM31.13 10 40 60 80 100 140 180 200 IF /m A 445 450 455 460λ dom /n m

KB DDLM31.13 9 Version 1.3 | 2020-07-17 Forward Voltage 6) ΔVF = VF - VF(25 °C) = f(Tj); IF = 140 mA KB DDLM31.13 -40- 20 02 04 06 08 0 100 120 Tj /° C -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3∆VF /V Relative Luminous Flux 6) Φv/Φv(25 °C) = f(Tj); IF = 140 mA KB DDLM31.13 -40- 20 02 04 06 08 0 100 120 Tj /° C 0.0 0.2 0.4 0.6 0.8 1.0 1.2Φv Φv(25°C) Dominant Wavelength 6) λdom = f(Tj); IF = 140 mA KB DDLM31.13 -40- 20 02 04 06 08 0 100 120 Tj/° C 445 450 455 460λ dom/n m

KB DDLM31.13 10 Version 1.3 | 2020-07-17 Max. Permissible Forward Current IF = f(T) 02 04 06 08 0 100 Ts /° C 100 120 140 160 180 200 220IF /m A KB DDLM31.13 :T s Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle 10-6 10-5 10-4 10-3 0.01 0.11 10 Pulse time / s 0.2 0.3 0.4 0.5IF /A TA =0 °C ... 103°C KB DDLM31.13 :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005 Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle 10-6 10-5 10-4 10-3 0.01 0.11 10 Pulse time / s 0.2 0.3 0.4 0.5IF /A TA = 110°C KB DDLM31.13 :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005

KB DDLM31.13 11 Version 1.3 | 2020-07-17 Dimensional Drawing 8) Further Information: Approximate Weight: 6.0 mg Package marking: Cathode

KB DDLM31.13 12 Version 1.3 | 2020-07-17 Electrical Internal Circuit Recommended Solder Pad 8) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

KB DDLM31.13 13 Version 1.3 | 2020-07-17 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

KB DDLM31.13 14 Version 1.3 | 2020-07-17 Taping 8)

KB DDLM31.13 15 Version 1.3 | 2020-07-17 Tape and Reel 9) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000

KB DDLM31.13 16 Version 1.3 | 2020-07-17 Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

KB DDLM31.13 17 Version 1.3 | 2020-07-17 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye ex- ists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy- ance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes

KB DDLM31.13 18 Version 1.3 | 2020-07-17 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi- nate the customer-specific request between OSRAM OS and buyer and/or customer.

KB DDLM31.13 19 Version 1.3 | 2020-07-17 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char- acteristics or damage the LED. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro- ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

KB DDLM31.13 20 Version 1.3 | 2020-07-17

Revision History

1.0 2019-12-15 Initial Version 1.1 2020-01-13 Brand 1.2 2020-04-24 Schematic Transportation Box Dimensions of Transportation Box 1.3 2020-07-17 Product Image

KB DDLM31.13 21 Version 1.3 | 2020-07-17 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.