IL4622

IL4685 NVE | Alldatasheet

Document overview

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Technical content

Features

• 40 Mbps transceiver
• Integrated ¼ watt, DC-to-DC convertor
• 3.3 V or 5 V bus supplies; both fully compatible and interoperable with 5 V bu ses
• 1/5 Unit Load; 160 node fanout
• Fully PROFIBUS compliant (IL4822)
• 2500 V RMS isolation voltage
• Up to 16.5 kV bus ESD protection
• Full failsafe
• Overcurrent and thermal shutdown protection
• −40 °C to 85 °C temperature range
• VDE 0884-17 certified; UL1577 registered
• EN 55032 CISPR 32 Class B compliant
• 0.3" True 8™ mm 16-pin SOIC package

Applications

• Factory automation
• Industrial control networks
• Medical instruments

Description

IL4xxx-Series Transceivers are high-speed, fully-isolated, differential bus transceivers with integrated DC-to -DC convertors to provide fully-isolated bus supplies f rom the 3.3 V controller supply. The IL4822 generates a 5 V bus supply; the IL46xx versions generate 3.3 V bus supplies. The 3.3 V versions can provide more current than 5 V bus supplies. Despite their 3.3 V bus supplies, IL46xx versions a re fully compatible and interoperable with 5 V buses. IL4x22 versions have full-duplex connections for RS-422 or RS-485 buses; the IL4685 has a half-duplex transceiver generally used with RS-485. The IL4822 is fully PROFIBUS compliant. The devices use NVE’s proven, patented* spintronic Giant Magnetoresistance (GMR) isolation technology and IsoLoop ® high-efficiency micro-scale isolation transformers. A unique ceramic/polymer composite barrier provides full isolation and virtually unlimited barrier life. Integrated shielding and DC-to-DC convertor frequency hopping minimize EMI. Parts are EN 55032 CISPR 32 Class B compliant with just a small amount of stitching capacitance. Current limiting and thermal shutdown features prot ect against bus short circuits and contention to preven t excessive power dissipation. DE D R RE A B IL4x22 VDD1A VDD2 Y Z /K44/K45 /K44 /K52 /K52/K45 /K41 /K42 /K49/K4C/K34/K36/K38/K35 /K56/K44/K44/K31/K41 /K56/K44/K44/K32/K41

RE R V (A−B) H Z X L H ≥ 200 mV L L ≤−200 mV L H Open IL4x22 Driver DE D V (Y−Z) L X Z H H ≥ 2 V H L ≤−2 V IL4685 VID (A-B) DE RE R D Mode Notes ≥ 200 mV L L H X Receive ≤−200mV L L L X Open L L H X A/B failsafe ≥ 1.5 V H L H H Drive R reads back D information ≤−1.5 V H L L L ≥ 1.5 V H H Z H R tri-state (no output) ≤−1.5 V H H Z L X L H Z X Disabled R tri-state; A/B failsafe

Absolute Maximum Ratings (1) Parameter Symbol Min. Typ. Max. Units Test Conditions Storage temperature TS −55 150 °C Junction temperature TJ −55 150 °C Voltage range at A or B bus pins −7 12 V Supply voltage VDD 1A, VDD 1B, VDD 2A, VDD 2B −0.5 6 V Digital input voltage −0.5 VDD + 0.5 V Digital output voltage −0.5 VDD + 1 V ESD (bus nodes) IL4685 or IL4 x22 configured as half -duplex ±16.5 kV IEC61000-4-2 IL4 x22 configured as full -duplex ±12 EFT (bus nodes) 4 kV IEC61000 -4-4 Level 4 Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Units Test Conditions DC -to -DC convertor input voltag e VDD 1A 3 3.3 3. 6 V Transceiver controller -side supply VDD 1B 3 3.3 5.5 V Transceiver bus -side supply voltage VDD 2B 3 3.3 3.5 V Ambient operating temperature Tmin ; T max −40 85 °C Junction temperature TJ −40 140 °C High -level digital input voltage VIH 2.4 VDD 1 V VDD 1 = 3.3 V Low -level digital input voltage VIL 0 0.8 V Differential input voltage (2) VID +12 / −7 V High -level output current (driver ) IOH 60 mA High-level digital output current (receiver ) IOH 8 mA Low -level output current (driver) IOL −60 mA Low-level digital output current (receiver) IOL −8 mA Digital input signal rise and fall times tIR , t IF DC Stable

IEC 60747-17 (VDE 0884-17):2021-10 (Basic Isolation; VDE File Number 5016933-4880-0001)

• Working Voltage (VIORM ) 600 VRMS (848 VPK ); basic insulation; pollution degree 2
• Isolation voltage (VISO ) 2500 VRMS
• Transient overvoltage (V IOTM ) 4000 VPK
• Surge rating 4000 V
• Each part tested at 1590 VPK for 1 second, 5 pC partial discharge limit
• Samples tested at 4000 VPK for 60 sec.; then 1358 VPK for 10 sec. with 5 pC partial discharge limit
• Working Voltage 600 V RMS Safety-Limiting Values Symbol Value Units Safety rating ambient temperature TS 180 °C Safety rating power (180°C) PS 270 mW Supply current safety rating (total of supplies) IS 54 mA UL 1577 (Component Recognition Program File Number E207481) Each part tested at 3000 V RMS (4240 VPK ) for 1 second; each lot sample tested at 2500 VRMS (3530 VPK ) for 1 minute IEC 60601-1 (medical systems)
• 1 x MOPP compliant under for medical systems (isola tion voltage ≥ 1.5 kV RMS ; creepage ≥ 4 mm). Compliant with IEC 60950-1 and IEC 62368-1 end equipment standards. Soldering Profile Per JEDEC J-STD-020C, MSL 1

1 VDD1 B Transceiver controller -side power supply input (3.3 V nominal). 2 GND 1 Input power supply ground (pin 2 is internally connected to pin 8) . 3 R Output data from bus . RE Read data enable. If RE is high, R = high impedance; has a 500 k Ω nominal internal pulldown. 5 DE Drive enable (has a 1 M Ω nominal internal pulldown). 6 D Data input to bus . 7 VDD1A DC -to -DC convertor input voltage (3.3 V nominal) ; bypass with 0. 1 µF. 8 GND 1 Input power supply ground (pin 8 is internally connected to pin 2) . 9 GND 2 Output power supply ground (pin 9 is internally connected to pin 15) . 10 VF Output-side rectifier output / regulator input; connect to a 0.1 µF/16 V external filter capacitor. 11 Y Non -inverting bus driver . 12 A Non -inverting bus receiver. 13 Z Inverting bus driver . 14 B Inverting bus receiver. 15 GND 2 Output power supply ground (pin 15 is internally connected to pin 9).

16 VDD2

DC-to-DC convertor output (5 V typical for IL4822; 3.3 V for IL4622); internally powers transceiver functions. B ypass with 10 µF ceramic. IL4685 Pin Connections 1 VDD1B Transceiver controller -side power supply input (3.3 V nominal). 2 GND 1 Input power supply ground (pin 2 is internally connected to pin 8). 3 R Output data from bus. RE Read data enable (if RE is high, R = high impedance). 5 DE Drive enable (has a 1 M Ω nominal internal pulldown). 6 D Data input to bus. 7 VDD1A DC -to -DC convertor input voltage (3.3 V nominal) ; bypass with 0. 1 µF . 8 GND 1 Input power supply ground (pin 8 is internally connected to pin 2). 9 GND 2 Output power supply ground (pin 9 is internally connected to pin 15). 10 VF Output-side rectifier output / regulator input; connect to a 0.1 µF/16 V external filter capacitor. 11 VDD2A DC -to -DC convertor output (3.3 V typical) ; bypass with 10 µF ceramic . 12 A Non -inverting bus line. 13 B Inverting bus line. 14 NC No internal connection. 15 GND 2 Output power supply ground (pin 15 is internally connected to pin 9).

16 VDD2B

Transceiver power supply input (connect to pin 11 to use DC -to -DC convertor). /K31 /K32 /K33 /K34 /K35 /K36 /K37 /K38 /K31/K36 /K31/K35 /K31/K34 /K31/K33 /K31/K32 /K31 /K31 /K31/K30 /K39 /K52/K45 /K56 /K44/K44/K32 /K52 /K44 /K42 /K5A /K44/K45 /K41 /K56/K46 /K56 /K44/K44/K31/K42 /K47/K4E/K44 /K31 /K47/K4E/K44 /K32 /K47/K4E/K44 /K32 /K59 /K56 /K44/K44/K31/K41 /K47/K4E/K44 /K31 /K31 /K32 /K33 /K34 /K35 /K36 /K37 /K38 /K31/K36 /K31/K35 /K31/K34 /K31/K33 /K31/K32 /K31 /K31 /K31/K30 /K39 /K52/K45 /K56 /K44/K44/K32/K42 /K52 /K44 /K4E/K43 /K42 /K44/K45 /K41 /K56/K46 /K56 /K44/K44/K31/K42 /K47/K4E/K44 /K31 /K47/K4E/K44 /K32 /K47/K4E/K44 /K32 /K56 /K44/K44/K32/K41 /K56 /K44/K44/K31/K41 /K47/K4E/K44 /K31

Tmin to Tmax unless otherwise stated Parameter Symbol Min. Typ. (5) Max. Units Test Conditions Output voltage VO VDD V IO = 0 Differential output voltage |V OD 1| VDD V IO = 0 Differential output voltage |V OD 2| 2.1 3 3.5 V RL = 60 Ω Differential output voltage |VOD 3| 1.9 3.5 V RL = 54 Ω Change in magnitude of differential output volta ge (3) Δ|V OD | ±0.2 V R L = 54 Ω or 100 Ω Common mode output voltage VOC 3 V RL = 54 Ω or 100 Ω Change in magnitude of common mode output voltage (3) Δ|V OC | ±0.2 V R L = 54 Ω or 100 Ω High level input current IIH 10 μA VI = 3.5 V Low level input current IIL −10 μA VI = 0.4 V Absolute | short -circuit output current | IOS 250 mA −7 V < VO < 12 V Transceiver Bus Receiver Tmin to T max and VDD2B = 3. 1 V to 3. 5 V unless otherwise stated Parameter Symbol Min. Typ. (5) Max. Units Test Conditions Positive-going input threshold voltage VIT + 0.2 V −7 V < V CM < 12 V Negative-going input threshold voltage VIT − −0.2 V −7 V < V CM < 12 V Input hysteresis voltage (V IT + − V IT − ) 28 mV VCM = 0 V, T = 25°C Differential bus input capacitance CD 9 12 pF High-level output voltage V OH VDD – 0.2 V DD V VID = 200 mV IOH = −20 μA Low-level output voltage V OL 0.2 V VID = −200 mV IOH = 20 μA High-impedance-state bus output current IOZ ±1 μA V O = 0.4 to (V DD 2−0.5) V Bus line input current I I 220 μA VI = 12 V −160 μA VI = −7 V Bus line input resistance RI 60 80 kΩ Transceiver Switching Sp ecific ation s Tmin to T max ; VDD1B = 3 V to 3.45 V Parameter Symbol Min. Typ. (5) Max. Units Test Conditions Data rate 40 Mbps RL = 54 Ω, C L = 50 pF Propagation delay (4) tPD 25 35 ns VO = −1.5 to 1.5 V, CL = 15 pF Pulse skew (5) t SK (P) 2 5 ns VO = −1.5 to 1.5 V, CL = 15 pF Skew l imit (6) tSK (LIM) 4 10 ns RL = 54 Ω, C L = 50 pF Output enable time to high level tPZH 17 30 ns CL = 15 pF Output enable time to low level tPZL 17 30 ns CL = 15 pF Output disable time from high level tPHZ 17 30 ns CL = 15 pF Output Disable Time From Low Level tPLZ 17 30 ns CL = 15 pF Common mode transient immunity (output logic high to logic low ) |CM H|,|CM L| 30 50 kV/ μs VCM = 1500 V DC tTRANSIENT = 25 ns

Transceiver Section Power Consumption Tmin to T max ; VDD1B = 3 V to 3.45 V unless otherwise specified Parameter Symbol Min. Typ. (5) Max. Units Test Conditions Controller-side Quiescent supply VDD 1B = 3.3 V VDD 1B = 5 V IDD 1B 1 1.7 4 mA No load (R T = ∞); Outputs Enabled; f IN = 0 Hz Bus -side quiescent supply current IDD 2B 4 6 Controller -side dynamic supply current IDD 1B 0.18 mA/Mbps Bus-side dynamic supply current I DD 2B 0.75 RT = ∞

0.55 RT = 60 Ω

Transceiver power dissipation IDD 1B x VDD 1B + IDD 2B x VDD 2B mW RT = ∞; f IN = 0 Hz 150 RT= 60Ω; f IN =40 Mbps; excludes RT power dissipati on Transceiver Field Immunity (7) VDD1B = 3.3 V Power frequency magnetic immunity HPF 1500 A/m 50 Hz / 60 Hz Pulse magnetic field immunity HPM 2000 A/m tp = 8 µs Damped oscillatory magnetic field HOSC 2000 A/m 0.1 Hz – 1 MHz Cross -axis immunity multiplier (8) KX 2.5 DC-to-DC Convertor Tmin to T max and V DD1A = 3.0 V to 3. 6 V unless otherwise stated Parameter Symbol Min. Typ. Max. Units Test Conditions Output voltage IL46xx IL48 22 VDD2A 4.5 3.3 3.45 5.5 V I DD2A < 65 mA IDD2A < 40 mA Output current (total available to internal transceiver and external load) IL46xx I DD2A-MAX mA

80 TJ < 85 °C

50 TJ < 85 °C

Short -circuit protection limited current 115 12 5 135 mA Input quiescent supply current IDD1AQ 200 240 mA IDD2A = 0 Input supply current IL46xx IL48 22 IDD1A 380 312 440 360 mA I DD2A = IDD2A-MAX Line regulation ΔVDD2A/ΔVDD1A 32 40 mV/V 25 °C 16 125 °C Load regulation ΔVDD2A /V DD2A 5 6 % I DD2A = 0 to IDD2A-MAX . Output voltage temperature coefficient (ΔVDD2A /V DD2A )/ ΔT 0.017 0.0 3 %/C IDD2 = 12% x IDD2A-MAX IDD2 = 60% x IDD2A-MAX Capacitive load CDD2A 1000 μF Output voltage ripple V DD2BRIPPLE mV P-P

20 MHz bandwidth;

IDD2A = IDD2A-MAX . 1 1 kHz bandwidth; I DD2A = IDD2A-MAX . Start-up time t SU 2 ms IDD2A = 0

6 IDD2A = IDD2A-MAX

Convertor frequency f OSC 105 113 120 MHz

Parameter Symbol Min. Typ. Max. Units Test Conditions DC-to-DC convertor Overcurrent threshold IDD 2A 120 mA Brownout threshold voltage V DD 2B 2.5 V Power -up

2.3 Power -down

Bus driver shutdown temperature Bus driver re-enable temperature T J 140 °C Junction Temperature 135 Isolation Specifications Parameter Symbol Min. Typ. Max. Units Test Conditions Creepage distance (external) 8.03 8.3 mm Per IEC 60601 Total barrier thickness (internal) 0.013 0.016 mm Barrier resistance RIO >10 14 Ω 500 V RMS Barrier capacitance CIO 7 pF f = 1 MHz Leakage current 0.2 μARMS 240 V RMS , 60 Hz Comparative tracking i ndex CTI ≥600 VRMS Per IEC 60112 Barrier life 44000 Years 100°C, 1000 V RMS , 60% CL activation energy Thermal Characteristics Parameter Symbol Min. Typ. Max. Units Test Conditions Junction–ambient thermal resistance θ JA 67 °C/W Double-sided PCB with thermal vias in free air Junction–case (top) thermal resistance θ JC 12 Junction–ambient thermal resistance θ JA 46 2s2p PCB with thermal vias per JESD51 with thermal vias in free air Junction–case (top) thermal resistance θ JC 9 Power dissipation PD 1.5 W Notes : 1. Absolute Maximum specifications mean the device will not be damaged if operated under these conditions. It does not guarantee performance. 2. Differential input/output voltage is measured at the noninverting terminal A with respect to the inverting terminal B. 3. Δ|V OD | and Δ|V OC | are the changes in magnitude of V OD and V OC , respectively, that occur when the input is changed from one logic state to the other. 4. Includes 10 ns read enable time. Maximum propagation delay is 25 ns after read assertion. 5. Pulse skew is defined as |t PLH – t PHL | of each channel. 6. Skew limit is the maximum propagation delay difference between any two devices at 25°C. 7. The relevant test and measurement methods are given in the “High Magnetic Immunity” section on p. 11. 8. External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than to “pin-to-pin” (see diagram on p. 14).

Figure 1. IL4xxx detailed block diagram. Frequency hopping reduces EMI peak amplitudes, and embedded magnetic shielding further reduces radiated EMI. A unique ceramic/polymer composite barrier provides full 2.5 kV isolation with virtually unlimited barrier life. out regulator with a precision bandgap voltage reference. A smooth output ramp-up with a minimum two millisecond startup allows the control electronics to start up before the bus is powered. and the output recovers when the fault is removed.

Optional External Regulation An external regulator can be connected to the VF pi n and used in addition to the parts’ internal low d rop-out regulator for voltages up to approximately 7.5 volts. The maximum output current decreases at higher regulator output voltages, but the output power capacity remains approximately 250 milliwatts. Transceiver Operation Receiver Features The receiver output “R” has tri-state capability vi a the active low RE input. Driver Features The driver features low propagation delay skew to m aximize bit width and minimize EMI. Drivers have tr i-state capability via the active-high DE input. True 3.3-volt Bus Operation IL46xx parts are guaranteed to provide the minimum RS-485 / RS-422 differential voltages with a 3.0-volt bus supply, providing true 3.3-volt bus operation with ample design margins. Deterministic Power Up and Brownout Detection IL46xx parts have circuitry to disable the transceiver bus until the driver-side voltage (VDD2B, norma lly provided by the DC-to- DC convertor) reaches approximately 2.5 volts on po wer-up. The transceiver is disabled when the voltag e drops below approximately 2.3 volts on power-down. This brownou t circuitry ensures the transceiver does not “crash ” the bus on power up, power down, or brownout, and eliminates the need fo r external power supply monitors. In addition, a patented refresh circuit maintains the correct transceiver output state with respect to data input (DC correctness). The refresh circuit ensures the bus outputs will follow the Function Table shown on Pag e 1 after power up. Hot Plug Operation Deterministic power-up allows IL46xx nodes to “hot plug” into the bus since the bus driver will be in a high-impedance state until the DC-to-DC convertor output is enough for the bus driver to operate. Unpowered Nodes The bus driver reverts to high impedance when VDD2 is not present so that unpowered nodes do not disturb bus operation. Full Fail-Safe The receiver is fully fail-safe, meaning it guarant ees a logic high state on “R” if the “A” and “B” bu s inputs are unconnected, shorted together, or connected to a terminated bus with all the transmitters disabled (terminated/undriven). Rigorous PROFIBUS Compatibility Unlike most other transceivers, IL4822 transceivers meet stringent PROFIBUS standards for maximum diff erential output voltage as well as other PROFIBUS requirements. Thermal Shutdown Internal DC-to-DC convertor thermal management circ uitry gradually limits the output voltage and power output to approximately 250 mW as the junction temperature increases to avo id thermal overload (see Figure 10). In addition, the bus driver is disabled when the driver die temperature exceeds approximately 150 °C, and re-enabled when the die temperature drops below approximately 135 °C. The r eceiver and DC-to-DC convertor sections continue to operate during thermal shutdown. Internal Connections Ground Connections There are two pins for each ground connection: pin 2 is internally connected to pin 8 and pin 15 is internally connected to pin 9. All four ground pins should be soldered to circuit board traces to maximize power dissipation.

connected to the DC-to-DC convertor in the IL4x22. Figure 2. Isolator model signal path. small magnetic field that changes the electron spin polarization of GMR resistors, which are configured as a Wheatstone bridge. version of the input signal. GMR is inherently high speed and low distortion. common-mode magnetic fields, further enhancing immu nity to external magnetic fields.

An IL46xx transceiver node can be operated at worst -case loading, data rate, and ambient temperature w ithout exceeding the maximum DC-to-DC convertor output current, maximum die temperature or package power rating. As shown in Figure 18, worst- case power consumption for a node such as that show n in Figure 20 is less that 1.2 watts. Junction-to-ambient thermal resistance is 46 °C/W with a 2s2p circuit board, so the temperatu re rise is 55 °C and the die temperature is within the 140 °C maximum at the 85 °C maximum ambient. If additional nodes are powered by the DC-to-DC con vertor or additional power is needed from the DC-to-DC convertor, however, care should be taken to ensure the die temperature does not exceed its 140 °C maximum operating temper ature, and that the total power dissipation does not exceed the 1.5 watt pack age maximum. The following sections summarize some thermal management considerations in these situations. Board Layout If possible, use a double sided, double buried powe r plane (“2s2p”) board to maximize thermal performa nce. Thermal vias should be used between the power plane and the board surfa ces. All four IC ground pins should be connected, with wide traces to help cool the leadframe. Use Low-Power, Fractional-Load Transceivers Transceivers such as the NVE IL3685P are fractional load to minimize the drive current required by transmitting nodes and, if powered by the IL46xx, uses less bus power than oth er transceivers. Avoid Termination Resistors with Shorter Bus Cables Termination resistors minimize reflections, which c an be important for long cable lengths. However, these resistors significantly increase output drive current and may not be necess ary with short bus cables. Full Duplex Uses Less Power Full-duplex RS-422 buses have only one transmitter per bus and therefore only need one termination resistor, typically 120 Ω. Half-duplex RS-485 networks with long cables, howev er, are generally terminated on both ends because either end can receive data. This doubles the power dissipated in the term ination resistors. No External “Fail-Safe” Resistors The transceivers are designed to be “full fail-safe ,” so “fail-safe” pull-up and pull-down bias resist ors are generally unnecessary and use power. Minimize Data Rate The transceiver draws more power at higher frequenc y, so the data rate should not be higher than neces sary to minimize transceiver power. Limit Transmission Time The transceivers use less power receiving than tran smitting, and much less if there are termination resistors. Average power dissipation can be reduced considerably by disablin g the driver (DE = LOW) when not transmitting data.

Creepage distances are often critical in isolated circuits. In addition to meeting JEDEC standards, NV E isolator packages have unique creepage specifications. Standard pad librar ies often extend under the package, compromising cr eepage and clearance. Similarly, ground planes, if used, should be spaced to avoid compromising clearance. Package drawings and recommended pad layouts are included in this datasheet. Inherently Low EMI Electromagnetic compatibility is regulated by inter national standards such as IEC 61000-4-x and CISPR 32. Although system- level performance depends on board design and layou t, these components incorporate features to reduce radiated EMI. The DC-to-DC convertor oscillator operates above 88 MHz, where emission limits are higher since there is less risk of interference with common commercial radio and television broadca sting. Frequency-hopping technology dramatically reduces p eak EMI, and synchronous rectification and PWM control are avoided, resulting in inherently low EMI. This inherently low EMI eliminates the need for shi elding or external mitigation components such as ferrite beads. The parts are fully EN 55032 CISPR 32 Class B compliant with no EMI mitigation compo nents and only 12 pF of input-to-output stitching capacitance. The capacita nce can be created in a four-layer PCB by extending the GND1 and GND2 ground planes into the PCB isolation area. External stitching capacitor components are generally not r ecommended due to parasitic inductance above one gigahertz. See Fig. 23 for a t ypical schematic, and Application Bulletin AB-29 for a recommended PCB layout. High Magnetic Immunity These parts are fully compliant with IEC 61000-6-1 and IEC 61000-6-2 magnetic immunity standards. The IsoLoop Isolator’s Wheatstone bridge configurat ion and differential magnetic field signaling ensur e excellent EM immunity. Immunity to external magnetic fields is even higher if the field direction is “end-to-end” ( rather than to “pin- to-pin”) as shown at right.

20 Mbps

40 Mbps

60 Termination

Figure 15. Total power dissipation (VDD1A = VDD1B = 3.3 V; V DD2A connected to V DD2B). Figure 16. IL46xx bus-side supply current budget. Figure 13. Typical transceiver bus-side supply current (I DD2 ) versus operating speed. Figure 14. Typ. transceiver bus-side supply current (I DD2 ) vs. aggregate termination resistance.

Although they have 3.3-volt bus supplies, IL46xx tr ansceivers can drive five-volt or 3.3-volt nodes. Figure 27. A typical IL4685 node driving a 5-volt-powered node.

IL4x22 transceivers can create full-duplex RS-422 n etworks where one node broadcasts and multiple nodes can receive. Figure 28. A full-duplex multi-drop RS-422 network.

Figure 31. Medical system operator interface.

The IL4622-01 Evaluation Board provides a complete isolated RS-485 or RS-422 node using the IL4622. jumpered to “Z”). Each board has a place for a bus termination resistor. Figure 32. IL4622-01 Evaluation Board (actual size).

0.049 (1.24) 0.051 (1.30) 0.017 (0.43)* 0.022 (0.56) 0.292 (7.42)* 0.299 (7.59) 0.007 (0.18)* 0.010 (0.25) 0.260 (6.60)* 0.280 (7.11) 0.033 (0.85)* 0.043 (1.10) 0.007 (0.2) 0.013 (0.3) Pin 1 identified by either an indent or a marked dot 0.08 (2.0) 0.10 (2.5) 0.397 (10.08) 0.413 (10.49) 0.394 (10.00) 0.419 (10.64) 0.092 (2.34) 0.105 (2.67) 0.004 (0.1) 0.012 (0.3) 0.016 (0.4) 0.050 (1.3) NOTE: Pin spacing is a BASIC dimension; tolerances do not accumulate 0.013 (0.3) 0.020 (0.5) Dimensions in inches (mm); scale = approx. 5X *Specified for True 8™ package to guarantee 8 mm creepage per IEC 60601. 0.050 (1.27) 0.449 (11.40) 0.020 (0.51)

16 PLCS

0.317 (8.05) Dimensions in inches (mm); scale = approx. 5X

Part Number Bus Duplex Bus Supply Bulk Packaging RoHS? IL4622E RS -422 / RS -485 Full 3 V Tubes (50 pcs.) RoHS IL4685E RS -485 Half 3 V IL4 822E RS -422 / RS -485 Full 5 V IL46 22 E-TR 7 RS -422 / RS -485 Full 3 V 7-inch reels (up to 450 pcs.) IL46 85 E-TR 7 RS -485 Half 3 V IL4 822E -TR 7 RS -422 / RS -485 Full 5 V IL46 22 E-TR 13 RS -422 / RS -485 Full 3 V 13-inch reels (up to 1500 pcs.) IL4685E -TR13 RS -485 Half 3 V IL4 822E -TR 13 RS -422 / RS -485 Full 5 V IL4622 RS -422 / RS -485 Full 3 V Tubes (50 pcs.) SnPb finish (non-RoHS; Special Order) IL4685 RS -485 Half 3 V IL4 822 RS -422 / RS -485 Full 5 V IL46 22 -TR 7 RS -422 / RS -485 Full 3 V 7-inch reels (up to 450 pcs.) IL46 85 -TR 7 RS -485 Half 3 V IL4 822 -TR 7 RS -422 / RS -485 Full 5 V IL46 22 -TR 13 RS -422 / RS -485 Full 3 V 13-inch reels (up to 1500 pcs.) IL4685 -TR13 RS -485 Half 3 V IL4 822 -TR 13 RS -422 / RS -485 Full 5 V

Revision History

Sept. 2023 Changes

• Clarified IL4x22 bus driver output voltage (p. 2).
• Added CISPR 32 Class B compliance and stitching capacitor recommendation (p. 14).
• Added recommended basic circuit (Fig. 23). ISB-DS-001-IL4xxx-RevD Sept. 2022 Changes
• VDE 0884-17 approval (p. 4).
• Increased VDE Working Voltage to 600 V RMS based on VDE testing (p. 4).
• Added IEC 60601-1 medical systems and equipment-lev el standards compliance (p. 4).
• Eliminated startup current specification with soft-start on lots 22xxxx and higher (p. 7).
• Replaced DC-to-DC convertor “Start-up” paragraph with soft start-up description (p. 9).
• Changed typical performance graphs with the addition of soft-start (Figs. 19-22).
• Added medical system application (Fig. 30). ISB-DS-001-IL4xxx-RevC Sept. 2021 Changes
• Added 5-volt version (IL4822).
• Clarified IL4 685 truth tabl e.
• Added VF vs. output current typical performance gra ph.
• Added description of external regulator option. ISB-DS-001-IL46xx-RevB July 2020 Changes
• Description of internal DC-to-DC convertor thermal circuitry (p. 10) and graph (Figure 10). Added start -up current s pecification (p. 7) and typical graph (Figure 1 5). SB-DS-001-IL46xx-RevA July 2020 Changes
• Initial release.
• Table corrections and final specifications (pp. 3 – 8).
• Changed IL4622 pinout (p. 5).
• Specification notes (p. 8).
• Added electrical fast transient (EFT) specification per IEC61000-4-4 for bus nodes (p. 3).
• Added overcurrent protection to DC-to-DC convertor detailed block diagram (Fig. 3).
• Added Shutdown Specifications table (p. 7).
• Added detailed block diagram (Fig. 1) and GMR isola tor diagram (Fig. 2).
• More details on power up, hot plug, brownout detect ion, and unpowered nodes (p. 10).
• Added and finalized performance graphs (pp. 14 – 16 ).
• Added 120 Ω aggregate termination resistance (common for RS-422) to performance graphs. Added RS -422 application diagram (Figure 21).

The information and data provided in datasheets shall define the specification of the product as agreed between NVE and its customer, unless NVE and customer have explicitly agreed otherwise in writing. All specifications are based on NVE test protocols. In no event however, shall an agreement be valid in which the NVE product is deemed to offer functions and qualities beyond those described in the datasheet. Limited Warranty and Liability Information in this document is believed to be accurate and reliable. However, NVE does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. 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