COMH-SDID KONTRON | Alldatasheet
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COM-HPC®/Server Size D with Intel® XEON® D-2700 / D-2800 SOC processors * High-end server-grade platform * 8x LAN Ports: versatile configurations up to 100G * High-speed connectivity 32x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0 * Up to 1 TByte NVMe SSD onboard * Industrial grade versions COMh-sdID (E2)
www.jumptec.com Technical Information COMPLIANCE COM-HPC®/Server, Size D DIMENSIONS 160 mm x 160 mm CPU (SoC) Intel Xeon® D-2700 / D-2800 Processor Series For details see table “CPU variants” given below CHIPSET - MAIN MEMORY 4x DDR4 DIMM sockets for up to 128GB LRDIMM ETHERNET CONTROLLER Intel® I226-LM/IT Intel® 2x Quad 25GbE LAN integrated in SoC ETHERNET 1x 1/2.5 Gb Ethernet 8x Ethernet ports supporting versatile configurations: 100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE STORAGE 2x SATA 6Gb/s FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 32x PCIe Gen4 (2 x16, 4 x8, 8 x4) 16x PCIe Gen3 (2 x8, 4 x4, 8 x2) USB 4x USB 3.0 / USB 2.0 SERIAL 2x serial interface (RX/TX only) OTHER FEATURES SPI, eSPI, SMB, Staged Watchdog, RTC SPECIAL FEATURES TPM 2.0 FEATURES ON REQUEST NVMe SSD, 1x PCIe Gen3 for BMC instead of 4th USB3.0 POWER MANAGEMENT ACPI 6.0 POWER SUPPLY 12V DC BIOS AMI UEFI OPERATING SYSTEM Linux. Windows 10/11, Windows Server 2022 TEMPERATURE Commercial temperature: 0 °C to +60 °C operating, -30 °C to +80 °C non-operating Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) SUPPORTED MODULES COMh-sdID xxxxx commercial grade COMh-sdID E2 xxxxx industrial grade COMh-sdID (E2)
www.kontron.com3 www.jumptec.com CPU Variants CPU STD /on request CORES TDP, W IOTG eT emp DDR4 1DPC (MT/s) Ethernet mode QAT BASE FREQ (GHZ) ALL CORE TURBO (GHZ) D-2796TE yes 20 118 Yes Yes 2933 100G DISABLED 2 2,4 D-2896TER on request 20 110 Yes Yes 2933 100G DISABLED 2 2,5 D-2775TE yes 16 100 Yes Yes 2933 100G DISABLED 2 2,4 D-2752TER yes 12 77 Yes Yes 2667 50G DISABLED 1,8 2,1 D-2733NT on request 8 80 Yes No 2667 50G 50G 2,1 2,6 D-2712T on request 4 65 Yes No 2667 50G DISABLED 1,9 2,4 D-2899NT on request 22 135 No No 3200 100G 100G 2,2 2,8 D-2798NX on request 20 126 No No 2933 100G 100G Inline 2,1 2,6 D-2796NT yes 20 120 No No 2933 100G 100G 2 2,5 D-2798NT on request 20 125 No No 3200 100G 100G 2,1 2,6 D-2896NT on request 20 120 No No 2933 100G 100G 2 2,6 D-2786NTE on request 18 118 No Yes 2933 100G 100G 2,1 2,5 D-2777NX on request 16 116 No No 2667 100G 100G Inline 2,2 2,7 D-2776NT on request 16 117 No No 2933 100G 100G 2,1 2,6 D-2876NT on request 16 100 No No 2933 100G 50G 2 2,5 D-2766NT on request 14 97 No No 2667 100G 50G 2 2,5 D-2753NT on request 12 87 No No 2667 100G 50G 2 2,5 D-2752NTE on request 12 84 No Yes 2667 50G 50G 1,9 2,3 D-2757NX on request 12 107 No No 2667 50G 50G Inline 2,5 3 D-2745NX on request 10 96 No No 2667 50G 50G Inline 2,4 2,9 D-2843NT on request 10 80 No No 2667 50G 50G 2 2,6 D-2832NT on request 8 70 No No 2667 50G 50G 2,1 2,6 D-2799 on request 20 129 No No 3200 DISABLED DISABLED 2,4 2,6 D-2779 on request 16 126 No No 3200 DISABLED DISABLED 2,5 2,8 D-2738 on request 8 88 No No 2933 DISABLED DISABLED 2,5 3 Note: DTR applies to these processors. See user guide for further information COMh-sdID (E2)
www.jumptec.com W/Ğϯ͘Ϭ ηϬͲϭϱ ;'ƌŽƵƉϬͿ ZĞĐŽǀĞƌLJ /K^ ƚƌů ŚĂŶŶĞů ŚĂŶŶĞů ŚĂŶŶĞů ŚĂŶŶĞů W/Ğdžϭ ĨŽƌD 'W/K ^W/ Wǁƌƚƌů ^LJƐDŐŵƚ 'W/K ƚƌů DŐŵƚ hZd ηϬ͕ηϭ Ğ^W/ ϯdžh^ϯ͘Ϭ /ŶƚĞůΠyĞŽŶΠͲϮϳϬϬͬͲϮϴϬϬWƌŽĐĞƐƐŽƌ ŵďĞĚĚĞĚŽŶƚƌŽůůĞƌ ŽŶŶĞĐƚŽƌ KƉƚŝŽŶ^ƚĂŶĚĂƌĚ ĐŽŵƉŽŶĞŶƚ &Eϭ WZKD tĂƚĐŚĚŽŐ /Ϯ 'W/KƵĨĨĞƌ /K^ &ůĂƐŚ dWD Zϰ/DD^ŽĐŬĞƚ DĂdžϯϮϬϬDdͬƐ Zϰ/DD^ŽĐŬĞƚ DĂdžϯϮϬϬDdͬƐ ϭdžh^ϯ͘Ϭ W/Ğdžϭ W/Ğdžϭ ŝϮϮϲ ^dϬ 24x HSIO (PCIe Gen3, SATA3, USB3.0) EsDĞ ^dϭ W/Ğϰ͘Ϭ ηϭϲͲϯϭ ;'ƌŽƵƉϭͿ W/Ğϰ͘Ϭ ηϯϮͲϰϳ ;'ƌŽƵƉϮͿ Zϰ/DD^ŽĐŬĞƚ DĂdžϯϮϬϬDdͬƐ Zϰ/DD^ŽĐŬĞƚ DĂdžϯϮϬϬDdͬƐ WŽǁĞƌ ^ĞƋƵĞŶĐŝŶŐ 32x PCIe Gen4 Ğ^W/'^W/ COM-HPC® connector J2 – Pin-out Server ϰdž ŵĂdžϮϱ'ď ϰdž ŵĂdžϮϱ'ď KDͲ,WΠĐŽŶŶĞĐƚŽƌ:ϭ– WŝŶͲŽƵƚ^ĞƌǀĞƌ HSIO #0 - #15 HSIO #17, #19 HSIO #18 HSIO #16 HSIO #20 - #23 Block Diagram Variants PART NO. CPU 1/2.5 GbE SOC-LAN DIMM NVMe OP. TEMPERATURE HSD01-0000-96-2 D-2796NT I226-LM 8x LAN ports 4 no 0 °C to +60 °C HSD01-0000-76-2 D-2776NT I226-LM 8x LAN ports 4 no 0 °C to +60 °C HSD01-0000-53-2 D-2753NT I226-LM 8x LAN ports 4 no 0 °C to +60 °C HSD02-0000-96-1 D-2796TE I226-IT 8x LAN ports 4 no -40 °C to +80 °C HSD02-0000-75-1 D-2775TE I226-IT 8x LAN ports 4 no -40 °C to +80 °C HSD02-0000-52-1 D-2752TER I226-IT 8x LAN ports 4 no -40 °C to +80 °C Please contact your sales representative for other CPU versions or LAN configurations Please contact tech support for custom UEFI firmware COMh-sdID (E2)
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Tel.: + 49 991 37024-0 contact@jumptec.de www.jumptec.com Copyright © 2025 JUMPtec. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate;however, no responsibility is assumed for inaccuracies. JUMPtec and the JUMPtec logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.Specifications are subject to change without notice. COMh-sdID (E2)-20250205 - bmy Carrier Cooling ARTICLE PART NO. DESCRIPTION COM-HPC/SERVER EVAL-CARRIER HST01-0000-10-0 Eval-Carrier with 10-mm stack-up connector ARTICLE PART NO. DESCRIPTION COMh-sdID (E2) HSP THREADED HSD01-0000-99-0 COMh-sdID (E2) heatspreader theaded COMh-sdID (E2) HSP THROUGH HOLE HSD01-0000-99-1 COMh-sdID (E2) heatspreader through hole COMh SIZE D ACTIVE UNI COOLER (W/O HSP) HSD99-0000-99-0 COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm) COMh SIZE D PASSIVE UNI COOLER (W/O HSP) HSD99-0000-99-1 COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm) COOLING COMh-sdID (E2): ADAPTER HSD01-0000-99-A Cooling Solution for COMh-sdID (E2), adapter for a standard LGA115x cooling solution. T o be used with HSD01-0000-99-B & HSD01-0000-99-C COOLING COMh-sdID (E2): BACKPLATE HSD01-0000-99-B Cooling Solution for COMh-sdID (E2), backplate T o be used with HSD01-0000-99-A & HSD01-0000-99-C COOLING COMh-sdID (E2): COOLER HSD01-0000-99-C Cooling Solution for COMh-sdID (E2), LGA115x cooler T o be used with HSD01-0000-99-A & HSD01-0000-99-B PART NO. DESCRIPTION SIZE ECC/NON-ECC OP. TEMPERATURE 97100-0832-SDID DDR4-3200 RDIMM 8 GByte ECC 0 °C to +60 °C 97100-1632-SDID DDR4-3200 RDIMM 16 GByte ECC 0 °C to +60 °C 97100-3232-SDID DDR4-3200 RDIMM 32 GByte ECC 0 °C to +60 °C 97100-6432-SDID DDR4-3200 RDIMM 64 GByte ECC 0 °C to +60 °C 97101-0832-SDID DDR4-3200 RDIMM 8 GByte ECC -40 °C to +85 °C 97101-1632-SDID DDR4-3200 RDIMM 16 GByte ECC -40 °C to +85 °C 97101-3232-SDID DDR4-3200 RDIMM 32 GByte ECC -40 °C to +85 °C 97101-6432-SDID DDR4-3200 RDIMM 64 GByte ECC -40 °C to +85 °C 97102-1232-SDID DDR4-3200 LRDIMM 128 GByte ECC 0 °C to +60 °C 97103-1232-SDID DDR4-3200 LRDIMM 128 GByte ECC -40 °C to +85 °C Memory COMh-sdID (E2)