HBTGFR421-KR SEOUL | Alldatasheet
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Technical content
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM Specification HBTGFR421-KR Customer ApprovalApprovalDrawn SSC Pb Free
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM [ Contents ] 1. Description 2. Absolute maximum ratings 3. Electro-Optical characteristics 4. Characteristic diagrams 5. Reliability result 6. Rank 7. Outline Dimension 8. Material 9. Reel Structure 10. Packing 11. Soldering profile 12. Precaution for Use
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM HBTGFR421-KR Cellular phone’s keypad lightning Information Boards
Features
Applications
- Small size suitable for compact appliances. - Surface-mounted chip LED device. - Pb-free and RoHS complaint component. - High brightness, High efficiency - Tape and Reel packing. - Increases the life time of battery. 1. Description HBTGFR421-KR
- 1.6 X 1.5 X 0.5 mm
- Untited, Diffused flat mold
- Wavelength : -. Red : 625 nm -. Green : 525 nm -. Blue : 472 nm
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM 2. Absolute maximum ratings 3. Electro-Optical Characteristics Green Blue Value ℃-40 ~ 100Tstg.Storage Temperature mW69PdPower Dissipation ℃-40 ~ 85Topr.Operating Temperature mA100IFM *1Peak Forward Current mA30IFForward Current Unit Red SymbolParameter *1 IFM conditions: Pulse width Tw≤ 1msec and Duty ratio≤1/10. *2 The luminous intensity IV is measured at the peak of the spati al pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] Tolerance : Iv ± 10%, λD ± 2nm, , VF ± 0.1V (Ta=25℃) (Ta=25℃) IF=10 ㎃Δλ Blue 30Green 477472465 IF=20 ㎃ Blue 855025 IF=10 ㎃ Blue 27022090Green VR=5VIR 3.33.02.7 IF=10 ㎃VF Blue 3.33.12.7Green R,G,B Red Green Red Red R/G/B Red color mcd 907050 IV Luminous Intensity*2 635625615 515 1.7 Min 535 2.3 Max 120 525 1.9 Typ ˚IF=30 ㎃ (total)2θ1/2 Viewing Angle*3 nmλdWavelength VForward Voltage nmSpectral Bandwidth ㎂Reverse Current UnitConditionSymbolParameter
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM Forward Current vs. Forward Voltage Relative Luminous Intensity vs. Forward Current Ta = 25o SpectrumForward Current vs. Ambient Temperature (per die) 4. Characteristic Diagrams -25 0 25 50 75 1000 Red Blue / Green Forward current IF(mA) Ambient temperature Ta( o 0.1 100 F orw ard V oltag e VF[V ] Forward Current IF[mA] R E D G R E E N B L U E 0 5 10 15 20 25 30 35 40 100 120 140 160 180 Relative Intensity IV[%] Forw ard Current IF[m A ] R ED G R EEN B LU E 300 400 500 600 700 8000.0 0.2 0.4 0.6 0.8 1.0 Intensity[a.u.] Wavelength [nm]
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM Radiation Diagram Ta = 25o 120 150 180
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM 5. Reliability Test 0/221 time 85℃, 85% 24hrs Reflow 3 times (Max 260℃ 10sec) Thermal shock 30 cycle Thermal resistance Test 0/22500 hrs10mA, @60℃,90% Operating at High temperature / High humidity 0/22500 hrs10mA, @85℃Operating at High temperature 0/22100 cycle-40~85℃ Shift (2hr/cycle)Thermal shock test 0/22500 hrs10mA, @25℃ Operating at Room temperature Number Of Damaged Duration / CycleTest ConditionsItem *Criterion Initial value ± 0.1VVF > Initial value * 0.5Iv OK MSL : 2a (30℃, 60% : 4 weeks)
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM 6. Rank IF = 10mA RANK 470~477 465~470 515~535615~6353.1~3.3 470~477 465~470 515~535615~6352.9~3.1 470~477 465~470 515~535615~6352.7~2.9 3.1~3.3 470~477 465~470 515~535615~6353.1~3.3 470~477 465~470 515~535615~6352.9~3.1 470~477 465~470 515~535615~6352.7~2.9 2.9~3.1 470~477 465~470 515~535615~6353.1~3.3 470~477 465~470 515~535615~6352.9~3.1 470~477 465~470 515~535615~6352.7~2.9 2.7~2.9 BLUEGREENREDBLUEGREENREDBLUEGREENRED Wd [nm] (IF = 20mA)VF [V]IV [mcd]
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM ±0.05 7. Outline Dimension Tolerance ±0.1, Unit : ㎜ 8. Material Au Plated Electrode EpoxyGoldInGaN / AlInGaPBT-Resin PCBMaterial EncapsulatewireChip (B,G/R)SubstrateItem [Recommended Solder Pattern] Cathode Red Green Blue Anode(Common)
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM (1) Quantity : 4000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 9. Reel Structure ±0.05 (2.75) 4.0 Label 180 ±0.2 -0+0.2 ±0.2 11.4 ±0.3 ±0.1 2.0 ±0.05 4.0 1.5 0.5±0.1 +0.1 1.75 0.2 8.03.5 ±0.05 0.05 0.2 0.05 ±0.05 0.1 ±0.05 1.73 1.75 0.7
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM 10. Packing Outer Box Structure ca b 7inch 245 220 142 SIZE (mm) Material : Paper(SW3B(B)) TYPE Aluminum Vinyl Bag Reel DESI PAK RANK: PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX XXX SEOUL SEMICONDUCTOR CO., LTD. RANK: PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX XXX SEOUL SEMICONDUCTOR CO., LTD. XXXXXX XXXXXX
1 SIDE RANK:
PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. XXXXXX a b c RoHS
2 SIDE
SEOUL SEMICONDUCTOR CO., LTD. #### ### ### ### HUMIDITY INDICATOR
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM 10 sec. Max.Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder 10 sec. Max.Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead-frame Solder (1) Lead Solder (2) Lead-Free Solder (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. 11. Soldering profile
서식번호 : SSC-QP-7-07-25 (Rev.0.0) Rev. 02Rev. 02 January 2012January 2012 WWW.SEOULSEMICON.COMWWW.SEOULSEMICON.COM 12. Precaution for Use (1) Storage LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is recommended. To avoid absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. * Shelf Life : 12 months at < 40ºC and 90%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. After opened and mounted the soldering shall be quickly. * Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or Stored at < 10% RH (3) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (4) In the case of change color of indicator on desiccant, components shall be dried 10-12hr at 60±5ºC. (5) When the LED is operating, the driving current should be determined after considering the maximum ambient temperature requirements. (6) When using multiple LEDs, It is recommended to connect a resistor on each LED. Otherwise, LEDs may vary due to variation in forward voltage of the LEDs. (7) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage (8) Any mechanical force or excessive vibration should be avoided during temperature cooling process to normal temperature after reflow. (9) Rapid cooling shall be avoided. (10) LED should not be placed on a flexible area on the PCB. (11) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (12) Anti radioactive ray design is not considered for the products. (13) Damage prevention from ESD or Surge. It is highly recommended to use the wrist-band or anti electrostatic gloves when handling the LED’s All devices, equipments and machines mush be properly grounded (14) The appearance and specifications of the product may be modified for improvement without notice.