HB1701 SEOUL | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 12
Technical content
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com Specification Checked by Approved by HB1701 CUSTOMER SUPPLIER Drawn by Approved by
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com
CONTENTS
- Description 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Electro-optical characteristic diagram 5. Rank 6. Material 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com HB1701
Features
Applications
- Description HB1701
- Cellular phone’s keypad lightning
- Other decoration lighting - Small size suitable for compact appliances - Surface-mounted and leadless chip LED device - High brightness, wide variety of colors are available - Tape and Reel packing - Increases the life time of battery
- 2.1 X 0.6 X 0.88 mm
- Inner Lens type
- Wavelength : 465 nm
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com 2. Absolute maximum ratings 3. Electro-Optical Characteristics *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10 (Ta=25℃) (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 64 mW Forward Current IF 20 mA Peak Forward Current IFM *1 50 mA Reverse Voltage VR 5 V Operation Temperature Topr. -35 ~ 85 ℃ Storage Temperature Tstg. -40 ~ 100 ℃ Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF =5 ㎃ 2.75 3.05 3.15 V Reverse Current IR VR =5V - - 10 ㎂ Luminous Intensity*2 IV IF =5 ㎃ 11 17 27 mcd Wavelength λd IF =5 ㎃ 460 465 470 nm Spectral Bandwidth Δλ IF =5 ㎃ - 25 - nm Viewing Angle*3 2θ1/2 IF =5 ㎃ - 150 - ˚ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λd ±2 nm, VF ±0.1 V)
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com 4. Electro-Optical characteristic Diagram Forward Current vs. Forward Voltage Relative Luminous Intensity vs Forward Current Ambient Temperature vs. Allowable Forward Current Radiation Diagram 0 5 10 15 20 25 30 100 150 200 250 300 350 400 Relative Intensity IV [%] Forward Current IF [mA] 120 150 180 Forward Current IF(mA) Forward Voltage VF(V) 0 2 04 06 08 0 1 0 0 Forward current IF(mA) Ambient temperature Ta( o
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com Spectrum 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0Intensity[a.u.] Wavelength [nm]
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com VF [V] IV [mcd] λD [nm] BIN at IF =5[mA] at IF =5[mA] at IF =5[mA] 5. Rank 6.Metarial Item PCB Chip wire Encapsulate Electrode Material BT-Resin InGaN Gold Epoxy Au
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com 7.Outline Dimension ( Tolerance: ±0.1, Unit: mm ) 0.5 2.1 0.6 0.3 0.5 0.48 0.88 0.3 0.4±0.03 Cathode Anode [Recommended Solder Pattern] Hole PCB 0.4 1.3 0.8 1.0
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com 8. Packing (1) Quantity: 3,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Tolerance: ±0.2, Unit: ㎜ 4.0 2.0 4.0 2.3 1.25 1.75 8.0 (2.75) 3.5 0.7 1.30 0.2
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com Reel Packing Structure a b c RoHS a b SEOUL SEMICONDUCTOR CO.,LTD DATE : c Acriche Semiconductor EcoLight TUV MADE IN KOREA Q'YT : 30,000EA LOT NO : CODE : PART : HB1701 CHIP LED 1422457inch 220 Outer Box *Material: Paper(SW3B(B)) SIZE(mm)TYPE Aluminum Vinyl Bag SSC PART NUMBER: HB1701 QUANTITY : 3000 Reel RANK: HB1701 SSC PART NUMBER: HB1701 QUANTITY : 3000 HB1701 RANK:
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com 9 . Soldering Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead-frame Solder (1) Lead Solder (2) Lead-Free Solder (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev.02Rev.02 December 2010 December 2010 www.seoulsemicon.comwww.seoulsemicon.com 10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : Max 30ºC Humidity : Max 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.