H5AN4G4NAFR

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Rev. 1.3 / Mar.2016 1 4Gb DDR4 SDRAM 4Gb DDR4 SDRAM Lead-Free&Halogen-Free (RoHS Compliant) H5AN4G4NAFR-xxC H5AN4G8NAFR-xxC H5AN4G6NAFR-xxC * SK hynix reserves the right to change products or specifications without notice.

Rev. 1.3 / Mar.2016 2

Revision History

Revision No. History Draft Date Remark 0.1 Initial Release Dec. 2014 1.0 IDD Specification update Feb. 2015 1.1 Updated IDD specification (x16) Nov.2015

1.2 Updated JEDEC Specification

Changed Ordering Frequency Changed Speed Bin : 2666Mbps CL19(VK) Dec.2015 1.3 Updated 2133Mbps (tCK(min) : 0.938ns->0.937ns) Updated JEDEC Specification Mar.2016

Rev. 1.3 / Mar.2016 3

Description

The H5AN4G4NAFR-xxC, H5AN4G8NAFR-xxC and H5AN4G6NAFR-xxC are a 4Gb CMOS Double Data Rate IV (DDR4) Synchronous DRAM, ideally suited for the main memory applications which requires large mem- ory density and high bandwidth. SK hynix 4Gb DDR4 SDRAMs offer fully synchronous operations refer- enced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth. Device Features and Ordering Information

FEATURES

• VDD=VDDQ=1.2V +/- 0.06V
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• On chip DLL align DQ, DQS and DQS transition with CK  transition
• DM masks write data-in at the both rising and falling  edges of the data strobe
• All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
• Programmable CAS latency 9, 11, 12, 13, 14, 15, 16, 17, 18, 19 and 20
• Programmable additive latency 0, CL-1, and CL-2  supported (x4/x8 only)
• Programmable CAS Write latency (CWL) = 9, 10, 11, 12, 14, 16, 18
• Programmable burst length 4/8 with both nibble  sequential and interleave mode
• BL switch on the fly
• 16banks
• Average Refresh Cycle (Tcase of 0 oC~ 95 oC) - 7.8 µs at 0oC ~ 85 oC - 3.9 µs at 85oC ~ 95 oC
• JEDEC standard 78ball FBGA(x4/x8), 96ball FBGA(x16)
• Driver strength selected by MRS
• Dynamic On Die Termination supported
• Two Termination States such as RTT_PARK and RTT_NOM switchable by ODT pin
• Asynchronous RESET pin supported
• ZQ calibration supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• 8 bit pre-fetch
• This product in compliance with the RoHS directive.
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• Maximum Power Saving Mode is supported
• TCAR(Temperature Controlled Auto Refresh) mode is supported
• LP ASR(Low Power Auto Self Refresh) mode is sup- ported
• Fine Granularity Refresh is supported
• Per DRAM Addressability is supported
• Geardown Mode(1/2 rate, 1/4 rate) is supported
• Programable Preamble for read and write is supported
• Self Refresh Abort is supported
• CA parity (Command/Address Parity) mode is sup- ported
• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
• DBI(Data Bus Inversion) is supported(x8)

Rev. 1.3 / Mar.2016 4

ORDERING INFORMATION

• xx means Speed Bin Grade OPERATING FREQUENCY *SK hynix DRAM devices support optional downbinning to CL17, CL15, CL13 and CL11. SPD setting is programmed to match. Part No. Configuration Package H5AN4G4NAFR-*xxc 1G x 4 78ball FBGA H5AN4G8NAFR-*xxC 512M x 8 H5AN4G6NAFR-*xxC 256M x 16 96ball FBGA MT/s Grade tCK (ns) CAS Latency (tCK) tRCD (ns) tRP (ns) tRAS (ns) tRC (ns) CL-tRCD-tRP DDR4-1600 -PB 1.25 11 13.75 (13.50)* 13.75 (13.50)* 35 48.75 (48.50)* 11-11-11 DDR4-1866 -RD 1.071 13 13.92 (13.50)* 13.92 (13.50)* 34 47.92 (47.50)* 13-13-13 DDR4-2133 -TF 0.937 15 14.06 (13.50)* 14.06 (13.50)* 33 47.06 (46.50)* 15-15-15 DDR4-2400 -UH 0.833 17 14.16 (13.75)* 14.16 (13.75)* 32 46.16 (45.75)* 17-17-17 DDR4-2666 -VK 0.75 19 14.25 (13.75)* 14.25 (13.75)* 32 46.25 (45.75)* 19-19-19

Rev. 1.3 / Mar.2016 5 Package Ballout/Mechanical Dimension x4 Package Ball out (Top view): 78ball FBGA Package 1 2 3 4 5 6 7 8 9 A VDD VSSQ NC DM_n, DBI_n VSSQ VSS A B VPP VDDQ DQS_c DQ1 VDDQ ZQ B C VDDQ DQ0 DQS_t VDD VSS VDDQ C D VSSQ NC DQ2 DQ3 NC VSSQ D E VSS VDDQ NC NC VDDQ VSS E F VDD NC ODT CK_t CK_c VDD F G VSS NC CKE CS_n NC TEN G H VDD WE_n A14 ACT_n CAS_n A15 RAS_n A16 VSS H J VREFCA BG0 A10 AP A12 BC_n BG1 VDD J K VSS BA0 A4 A3 BA1 VSS K L RESET_n A6 A0 A1 A5 ALERT_n L M VDD A8 A2 A9 A7 VPP M N VSS A11 PAR NC A13 VDD N 1 2 3 4 5 6 7 8 9

Rev. 1.3 / Mar.2016 6 x8 Package Ball out (Top view): 78ball FBGA Package 1 2 3 4 5 6 7 8 9 A VDD VSSQ TDQS_c DM_n/DBI_n TDQS_t VSSQ VSS A B VPP VDDQ DQS_c DQ1 VDDQ ZQ B C VDDQ DQ0 DQS_t VDD VSS VDDQ C D VSSQ DQ4 DQ2 DQ3 DQ5 VSSQ D E VSS VDDQ DQ6 DQ7 VDDQ VSS E F VDD NC ODT CK_t CK_c VDD F G VSS NC CKE CS_n NC TEN G H VDD WE_n A14 ACT_n CAS_n A15 RAS_n A16 VSS H J VREFCA BG0 A10 AP A12 BC_n BG1 VDD J K VSS BA0 A4 A3 BA1 VSS K L RESET_n A6 A0 A1 A5 ALERT_n L M VDD A8 A2 A9 A7 VPP M N VSS A11 PAR NC A13 VDD N 1 2 3 4 5 6 7 8 9

Rev. 1.3 / Mar.2016 7 x16 Package Ball out (Top view): 96ball FBGA Package 1 2 3 4 5 6 7 8 9 A VDDQ VSSQ DQU0 DQSU_c VSSQ VDDQ A B VPP VSS VDD DQSU_t DQU1 VDD B C VDDQ DQU4 DQU2 DQU3 DQU5 VSSQ C D VDD VSSQ DQU6 DQU7 VSSQ VDDQ D E VSS DMU_n/ DBIU_n VSSQ DML_n/ DBIL_n VSSQ VSS E F VSSQ VDDQ DQSL_c DQL1 VDDQ ZQ F G VDDQ DQL0 DQSL_t VDD VSS VDDQ G H VSSQ DQL4 DQL2 DQL3 DQL5 VSSQ H J VDD VDDQ DQL6 DQL7 VDDQ VDD J K VSS CKE ODT CK_t CK_c VSS K L VDD WE_n A14 ACT_n CS_n RAS_n A16 VDD L M VREFCA BG0 A10/AP A12 BC_n CAS_n A15 VSS M N VSS BA0 A4 A3 BA1 TEN N P RESET_n A6 A0 A1 A5 ALERT_n P R VDD A8 A2 A9 A7 VPP R T VSS A11 PAR NC A13 VDD T 1 2 3 4 5 6 7 8 9

Rev. 1.3 / Mar.2016 6 Pin Functional Description Symbol Type Function CK_t, CK_c Input Clock: CK_t and CK_c are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK_t and negative edge of CK_c. CKE, (CKE1) Input Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power- Down and Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any bank). CKE is asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable during the power on and initialization sequence, they must be maintained during all operations (including Self-Refresh). CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK_c, ODT and CKE, are disabled during power-down. Input buffers, excluding CKE, are disabled during Self-Refresh. CS_n, (CS1_n) Input Chip Select: All commands are masked when CS_n is registered HIGH. CS_n provides for external Rank selection on systems with multiple Ranks. CS_n is considered part of the command code. C0,C1,C2 Input Chip ID: Chip ID is only used for 3DS for 2,4,8high stack via TSV to select each slice of stacked compnent. Chip ID is considered part of the command code. ODT, (ODT1) Input On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR4 SDRAM. When enabled, ODT is only applied to each DQ, DQS_t, DQS_c and DM_n/DBI_n/TDQS_t,NU/TDQS_c (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x8 configurations. For x16 configuration ODT is applied to each DQ, DQSU_c, DQSU_t, DQSL_t, DQSL_c, DMU_n, and DML_n signal. The ODT pin will be ignored if MR1 is programmed to disable RTT_NOM. ACT_n Input Activation Command Input: ACT_n defines the Activation command being entered along with CS_n. The input into RAS_n/A16, CAS_n/A15 and WE_n/A14 will be considered as Row Address A16, A15 and A14. RAS_n/A16, CAS_n/A15, WE_n/A14 Input Command Inputs RAS_n/A16, CAS_n/A15 and WE_n/A14 (along with CS_n) define the command being entered. Those pins have multi function. For example, for activation with ACT_n Low, those are Addressing like A16,A15 and A14 but for non-activation com- mand with ACT_n High, those are Command pins for Read, Write and other command defined in command truth table. DM_n/DBI_n/ TDQS_t, (DMU_n/DBIU_n), (DML_n/DBIL_n) Input/ Output Input Data Mask and Data Bus Inversion: DM_n is an input mask signal for write data. Input data is masked when DM_n is sampled LOW coincident with that input data during a Write access. DM_n is sampled on both edges of DQS. DM is muxed with DBI function by Mode Register A10,A11,A12 setting in MR5. For x8 device, the function of DM or TDQS is enabled by Mode Register A11 setting in MR1. DBI_n is an input/output identif- ing wherther to store/output the true or inverted data. If DBI_n is LOW, the data will be stored/output after inversion inside the DDR4 SDRAM and not inverted if DBI_n is HIGH. TDQS is only supported in x8. BG0 - BG1 Input Bank Group Inputs: BG0 - BG1 define to which bank group an Active, Read, Write or Pre- charge command is being applied. BG0 also detemines which mode register is to be accessed during a MRS cycle. x4/8 have BG0 and BG1 but x16 has only BG0. BA0 - BA1 Input Bank Address Inputs: BA0 - BA1 define to which bank an Active, Read, Write or Pre- charge command is being applied. Bank address also determines if the mode register or extended mode register is to be accessed during a MRS cycle.

Rev. 1.3 / Mar.2016 7 A0 - A17 Input Address Inputs: Provied the row address for ACTIVATE Commands and the column address for Read/Write commands th select one location out of the memory array in the respective bank. (A10/AP, A12/BC_n, RAS_n/A16, CAS_n/A15 and WE_n/A14 have addi- tional functions, see other rows. The address inputs also provide the op-code during Mode Register Set commands. A17 is only defined for the x4 configration. A10 / AP Input Auto-precharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be performed to the accessed bank after the Read/Write opera- tion. (HIGH: Autoprecharge; LOW: no Autoprecharge).A10 is sampled during a Pre- charge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank addresses. A12 / BC_n Input Burst Chop: A12 / BC_n is sampled during Read and Write commands to determine if burst chop (on-the-fly) will be performed. (HIGH, no burst chop; LOW: burst chopped). See command truth table for details. RESET_n Input Active Low Asynchronous Reset: Reset is active whenRESET_n is LOW, and inactive when RESET_n is HIGH. RESET_n must be HIGH during normal operation. RESET_n is a CMOS rail to rail signal with DC high and low at 80% and 20% of V DD. DQ Input / Output Data Input/ Output: Bi-directional data bus. If CRC is enabled via Mode register then CRC code is added at the end of Data Burst. Any DQ from DQ0~DQ3 may indicate the internal Vref level during test via Mode Register Setting MR4 A4=High. During this mode, RTT value should be set to Hi-Z. Refer to vendor specific datasheets to determine which DQ is used. DQS_t, DQS_c, DQSU_t, DQSU_c, DQSL_t, DQSL_c Input / Output Data Strobe: output with read data, input with write data. Edge-aligned with read data, centered in write data. For x16, DQSL corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobe DQS_t, DQSL_t, and DQSU_t are paired with differential signals DQS_c, DQSL_c, and DQSU_c, respectively, to provide differential pair signaling to the system during reads and writes. DDR4 SDRAM supports differential data strobe only and does not support single-ended. TDQS_t, TDQS_c Output Termination Data Strobe: TDQS_t/TDQS_c is applicable for x8 DRAMs only. When enabled via Mode Register A11 = 1 in MR1, the DRAM will enable the same termination resistance function on TDQS_t/TDQS_c that is applied to DQS_t/DQS_c. When disabled via mode register A11 = 0 in MR1, DM/DBI/TDQS will provide the data mask function or Data Bus Inversion depending on MR5; A11, 12, 10 and TDQS_c is not used. x4/x16 DRAMs must disable the TDQS function via mode register A11 = 0 in MR1. PAR Input Command and Address Parity Input : DDR4 Supports Even Parity check in DRAMswith MR setting. Once it’s enabled via Register in MR5, then DRAM calculates Parity with ACT_n, RAS_n/A16, CAS_n/A15, WE_n/A14, BG0-BG1, BA0-BA1, A17-A, and C0-C2(3DS devices). Input parity should maintain at the rising edge of the clock and at the same time with command & address with CS_n LOW. ALERT_n Output Alert: It has multi functions such as CRC error flag, Command and Address Parity error flag as Output signal. If there is error in CRC, then Alert_n goes LOW for the period time interval and goes back HIGH. If there is error in Command Address Parity Check, then Alert_n goes LOW for relatively long period until on going DRAM internal recovery trans- action to complete. During Connectivity Test mode, this pin works as input. Using this signal or not is dependent on system. In case of not connected as Signal, ALERT_n Pin must be bounded to VDD on board. Symbol Type Function

Rev. 1.3 / Mar.2016 8 TEN Input Connectivity Test Mode Enable: Required on x16 devices and optional input on x4/x8 with densities equal to or greater than 8Gb. HIGH in this pin will enable Connectivity Test Mode operation along with other pins. It is a CMOS rail to rail signal with AC high and low at 80% and 20% of VDD. Using this signal or not is dependent on System. This pin may be DRAM internally pulled low through a weak pull-down resistor to VSS. NC No Connect: No internal elec trical connection is present. VDDQ Supply DQ Power Supply: 1.2 V +/- 0.06 V VSSQ Supply DQ Ground VDD Supply Power Supply: 1.2 V +/- 0.06 V VSS Supply Ground Vpp Supply DRAM Activation Power Supply: 2.5V (2.375V min , 2.75 max) VREFCA Supply Reference voltage for CA ZQ Supply Reference Pin for ZQ calibration Note: Input only pins (BG0-BG-1, BA0-BA1, A0-A17, ACT_n, RAS_n,/A16, CAS_n/A15, WE_n/A14, CS_n, CKE, ODT, and RESET_n) do not supply termination. Symbol Type Function

Rev. 1.3 / Mar.2016 11 ROW AND COLUMN ADDRESS TABLE 4Gb Configuration 1Gb x 4 512Mb x 8 256Mb x 16 Bank Address # of Bank Groups 4 4 2 BG Address BG0~BG1 BG0~BG1 BG0 Bank Address in a BG BA0~BA1 BA0~BA1 BA0~BA1 Row Address A0~A15 A0~A14 A0~A14 Column Address A0~ A9 A0~ A9 A0~ A9 Page size 512B 1 KB 2 KB

Rev. 1.3 / Mar.2016 20 Absolute Maximum Ratings Absolute Maximum DC Ratings NOTE : 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indi- cated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard. 3. VDD and VDDQ must be within 300 mV of each other at all times;and VREFCA must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less than 500 mV; VREFCA may be equal to or less than 300 mV 4. VPP must be equal or greater than VDD/VDDQ at all times 5. Overshoot area above 1.5V is specified in DDR4 Device Operation. DRAM Component Operating Temperature Range Absolute Maximum DC Ratings Symbol Parameter Rating Units NOTE VDD Voltage on VDD pin relative to Vss -0.3 ~ 1.5 V 1,3 VDDQ Voltage on VDDQ pin relative to Vss -0.3 ~ 1.5 V 1,3 VPP Voltage on VPP pin relative to Vss -0.3 ~ 3.0 V 4 VIN, VOUT Voltage on any pin except VREFCA relative to Vss -0.3 ~ 1.5 V 1,3,5 TSTG Storage Temperature -55 to +100 °C 1,2 Temperature Range Symbol Parameter Rating Units Notes TOPER Normal Operating Temperature Range 0 to 85 oC 1,2 Extended Temperature Range 85 to 95 oC1 , 3 Notes: 1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measure- ment conditions, please refer to the JEDEC document JESD51-2. 2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. Dur- ing operation, the DRAM case temperature must be maintained between 0 - 85oC under all operating conditions. 3. Some applications require operation of the DRAM in the Extended Temperature Range between 85oC and 95oC case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply: a. Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs. It is also possible to specify a component with 1X refresh (tREFI to 7.8µs) in the Extended Temperature Range. Please refer to the DIMM SPD for option availability b. If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto Self-Refresh mode (MR2 A6 = 1b and MR2 A7 = 0b).

Rev. 1.3 / Mar.2016 21 AC & DC Operating Conditions Recommended DC Operating Conditions NOTE: 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together. 3. DC bandwidth is limited to 20MHz. Recommended DC Operating Conditions Symbol Parameter Rating Unit NOTEMin. Typ. Max. VDD Supply Voltage 1.14 1.2 1.26 V 1,2,3 VDDQ Supply Voltage for Output 1.14 1.2 1.26 V 1,2,3 VPP Supply Voltage for DRAM Activating 2.375 2.5 2.75 V 3

Rev. 1.3 / Mar.2016 50 IDD and IDDQ Specification Parameters and Test Conditions IDD, IPP and IDDQ Measurement Conditions In this chapter, IDD, IPP and IDDQ measurement conditions such as test load and patterns are defined. Figure shows the setup and test load for IDD, IPP and IDDQ measurements.

• IDD currents (such as IDD0, IDD0A, IDD1, IDD1A, IDD2N, IDD2NA, IDD2NL, IDD2NT, IDD2P, IDD2Q, IDD3N, IDD3NA, IDD3P, IDD4R, IDD4RA, IDD4W, IDD4WA, IDD5B, IDD5F2, IDD5F4, IDD6N, IDD6E, IDD6R, IDD6A, IDD7 and IDD8) are measured as time-averaged currents with all VDD balls of the DDR4 SDRAM under test tied together. Any IPP or IDDQ current is not included in IDD currents.
• IPP currents have the same definition as IDD exce pt that the current on the VPP supply is measured.
• IDDQ currents (such as IDDQ2NT and IDDQ4R) ar e measured as time-averaged currents with all VDDQ balls of the DDR4 SDRAM under test tied together. Any IDD current is not included in IDDQ cur- rents. Attention: IDDQ values cannot be directly used to calculate IO power of the DDR4 SDRAM. They can be used to support correlation of simulated IO power to actual IO power as outlined in Figure 2. In DRAM module application, IDDQ cannot be measured separately since VDD and VDDQ are using one merged-power layer in Module PCB. For IDD, IPP and IDDQ measurements, the following definitions apply:
• “0” and “LOW” is defined as VIN <= VILAC(max).
• “1” and “HIGH” is defined as VIN >= VIHAC(min).
• “MID-LEVEL” is defined as inputs are VREF = VDD / 2.
• Timings used for IDD, IPP and IDDQ Measurement-Loop Patterns are provided in Table 1.
• Basic IDD, IPP and IDDQ Measurement Conditions are described in Table 2.
• Detailed IDD, IPP and IDDQ Measurement-Loop Pa tterns are described in Table 3 through Table 11.
• IDD Measurements are done after properly initializi ng the DDR4 SDRAM. This includes but is not lim- ited to setting  RON = RZQ/7 (34 Ohm in MR1);  RTT_NOM = RZQ/6 (40 Ohm in MR1); RTT_WR = RZQ/2 (120 Ohm in MR2); RTT_PARK = Disable; Qoff = 0B (Output Buffer enabled) in MR1; TDQS_t disabled in MR1; CRC disabled in MR2; CA parity feature disabled in MR5; Gear down mode disabled in MR3 Read/Write DBI disabled in MR5; DM disabled in MR5
• Attention: The IDD, IPP and IDDQ Measurement-Loop Patterns need to be executed at least one time before actual IDD or IDDQ measurement is started.
• Define D = {CS_n, ACT_n, RAS_n, CAS_n, WE_n } := {HIGH, LOW, LOW, LOW, LOW} ; apply BG/BA changes when directed.
• Define D# = {CS_n, ACT_n, RAS_n, CAS_n, WE_n } := {HIGH, HIGH, HIGH, HIGH, HIGH} ; apply invert of BG/BA changes when directed above.

Rev. 1.3 / Mar.2016 52 Table 1 -Timings used for IDD, IPP and IDDQ Measurement-Loop Patterns Symbol DDR4-1600 DDR4-1866 DDR4-2133 DDR4-2400 Unit 11-11-11 13-13-13 15-15-15 17-17-17 tCK 1.25 1.071 0.937 0.833 ns CL 11 13 15 17 nCK CWL 11 12 14 17 nCK nRCD 11 13 15 17 nCK nRC 39 45 51 56 nCK nRAS 28 32 36 39 nCK nRP 11 13 15 17 nCK nFAW x4 16 16 16 16 nCK x8 20 22 23 26 nCK x16 28 28 32 36 nCK nRRDS x4 4 4 4 4 nCK x8 4 4 4 4 nCK x16 5 5 6 7 nCK nRRDL x4 5 5 6 6 nCK x8 5 5 6 6 nCK x16 6 6 7 8 nCK tCCD_S 4 4 4 4 nCK tCCD_L 5 5 6 6 nCK tWTR_S 2 3 3 3 nCK tWTR_L 6 7 8 9 nCK nRFC 2Gb 128 150 171 193 nCK nRFC 4Gb 208 243 278 313 nCK nRFC 8Gb 280 327 374 421 nCK nRFC 16Gb TBD TBD TBD TBD nCK

Rev. 1.3 / Mar.2016 53 Table 2 -Basic IDD, IPP and IDDQ Measurement Conditions Symbol Description IDD0 Operating One Bank Active-Precharge Current (AL=0) CKE: High; External clock: On; tCK, nRC, nRAS, CL: see Table 1; BL: 81; AL: 0; CS_n: High between ACT and PRE; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 3; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,... (see Table 3); Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 3 IDD0A Operating One Bank Active-Precharge Current (AL=CL-1) AL = CL-1, Other conditions: see IDD0 IPP0 Operating One Bank Active-Precharge IPP Current Same condition with IDD0 IDD1 Operating One Bank Active-Read-Precharge Current (AL=0) CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: see Table 1; BL: 81; AL: 0; CS_n: High between ACT, RD and PRE; Command, Address, Bank Group Address, Bank Address Inputs, Data IO: partially toggling according to Table 4; DM_n: stable at 1; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,... (see Table 4); Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 4 IDD1A Operating One Bank Active-Read-Precharge Current (AL=CL-1) AL = CL-1, Other conditions: see IDD1 IPP1 Operating One Bank Active-Read-Precharge IPP Current Same condition with IDD1 IDD2N Precharge Standby Current (AL=0) CKE: High; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 5; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 5 IDD2NA Precharge Standby Current (AL=CL-1) AL = CL-1, Other conditions: see IDD2N IPP2N Precharge Standby IPP Current Same condition with IDD2N IDD2NT Precharge Standby ODT Current CKE: High; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 6; Data IO: VSSQ; DM_n: stable at 1; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: toggling according to Table 6; Pattern Details: see Table 6 IDDQ2NT (Optional) Precharge Standby ODT IDDQ Current Same definition like for IDD2NT, however measuring IDDQ current instead of IDD current IDD2NL Precharge Standby Current with CAL enabled Same definition like for IDD2N, CAL enabled3 IDD2NG Precharge Standby Current with Gear Down mode enabled Same definition like for IDD2N, Gear Down mode enabled3 IDD2ND Precharge Standby Current with DLL disabled Same definition like for IDD2N, DLL disabled3

Rev. 1.3 / Mar.2016 54 IDD2N_par Precharge Standby Current with CA parity enabled Same definition like for IDD2N, CA parity enabled3 IDD2P Precharge Power-Down Current CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: stable at 0; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0 IPP2P Precharge Power-Down IPP Current Same condition with IDD2P IDD2Q Precharge Quiet Standby Current CKE: High; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: stable at 0; Data IO: VDDQ; DM_n: stable at 1;Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0 IDD3N Active Standby Current CKE: High; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 5; Data IO: VDDQ; DM_n: stable at 1;Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 5 IDD3NA Active Standby Current (AL=CL-1) AL = CL-1, Other conditions: see IDD3N IPP3N Active Standby IPP Current Same condition with IDD3N IDD3P Active Power-Down Current CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: stable at 1; Command, Address, Bank Group Address, Bank Address Inputs: stable at 0; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0 IPP3P Active Power-Down IPP Current Same condition with IDD3P IDD4R Operating Burst Read Current CKE: High; External clock: On; tCK, CL: see Table 1; BL: 82; AL: 0; CS_n: High between RD; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 7; Data IO: seamless read data burst with different data between one burst and the next one according to Table 7; DM_n: stable at 1; Bank Activity: all banks open, RD commands cycling through banks: 0,0,1,1,2,2,... (see Table 7); Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 7 IDD4RA Operating Burst Read Current (AL=CL-1) AL = CL-1, Other conditions: see IDD4R IDD4RB Operating Burst Read Current with Read DBI Read DBI enabled3, Other conditions: see IDD4R IPP4R Operating Burst Read IPP Current Same condition with IDD4R IDDQ4R (Optional) Operating Burst Read IDDQ Current Same definition like for IDD4R, however measuring IDDQ current instead of IDD current IDDQ4RB (Optional) Operating Burst Read IDDQ Current with Read DBI Same definition like for IDD4RB, however measuring IDDQ current instead of IDD current

Rev. 1.3 / Mar.2016 55 IDD4W Operating Burst Write Current CKE: High; External clock: On; tCK, CL: see Table 1; BL: 81; AL: 0; CS_n: High between WR; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 8; Data IO: seamless write data burst with different data between one burst and the next one according to Table 8; DM_n: stable at 1; Bank Activity: all banks open, WR commands cycling through banks: 0,0,1,1,2,2,... (see Table 8); Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at HIGH; Pattern Details: see Table 8 IDD4WA Operating Burst Write Current (AL=CL-1) AL = CL-1, Other conditions: see IDD4W IDD4WB Operating Burst Write Current with Write DBI Write DBI enabled3, Other conditions: see IDD4W IDD4WC Operating Burst Write Current with Write CRC Write CRC enabled3, Other conditions: see IDD4W IDD4W_par Operating Burst Write Current with CA Parity CA Parity enabled3, Other conditions: see IDD4W IPP4W Operating Burst Write IPP Current Same condition with IDD4W IDD5B Burst Refresh Current (1X REF) CKE: High; External clock: On; tCK, CL, nRFC: see Table 1; BL: 81; AL: 0; CS_n: High between REF; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 9; Data IO: VDDQ; DM_n: stable at 1; Bank Activity: REF command every nRFC (see Table 9); Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 9 IPP5B Burst Refresh Write IPP Current (1X REF) Same condition with IDD5B IDD5F2 Burst Refresh Current (2X REF) tRFC=tRFC_x2, Other conditions: see IDD5B IPP5F2 Burst Refresh Write IPP Current (2X REF) Same condition with IDD5F2 IDD5F4 Burst Refresh Current (4X REF) tRFC=tRFC_x4, Other conditions: see IDD5B IPP5F4 Burst Refresh Write IPP Current (4X REF) Same condition with IDD5F4 IDD6N Self Refresh Current: Normal Temperature Range TCASE: 0 - 85°C; Low Power Array Self Refresh (LP ASR) : Normal4; CKE: Low; External clock: Off; CK_t and CK_c#: LOW; CL: see Table 1; BL: 81; AL: 0; CS_n#, Command, Address, Bank Group Address, Bank Address, Data IO: High; DM_n: stable at 1; Bank Activity: Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: MID-LEVEL IPP6N Self Refresh IPP Current: Normal Temperature Range Same condition with IDD6N IDD6E Self-Refresh Current: Extended Temperature Range) TCASE: 0 - 95°C; Low Power Array Self Refresh (LP ASR) : Extended4; CKE: Low; External clock: Off; CK_t and CK_c: LOW; CL: see Table 1; BL: 81; AL: 0; CS_n, Command, Address, Bank Group Address, Bank Address, Data IO: High; DM_n:stable at 1; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: MID-LEVEL IPP6E Self Refresh IPP Current: Extended Temperature Range Same condition with IDD6E

Rev. 1.3 / Mar.2016 56 IDD6R Self-Refresh Current: Reduced Temperature Range TCASE: 0 - TBD (~35-45)°C; Low Power Array Self Refresh (LP ASR) : Reduced4; CKE: Low; External clock: Off; CK_t and CK_c#: LOW; CL: see Table 1; BL: 81; AL: 0; CS_n#, Command, Address, Bank Group Address, Bank Address, Data IO: High; DM_n:stable at 1; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: MID-LEVEL IPP6R Self Refresh IPP Current: Reduced Temperature Range Same condition with IDD6R IDD6A Auto Self-Refresh Current TCASE: 0 - 95°C; Low Power Array Self Refresh (LP ASR) : Auto4; CKE: Low; External clock: Off; CK_t and CK_c#: LOW; CL: see Table 1; BL: 81; AL: 0; CS_n#, Command, Address, Bank Group Address, Bank Address, Data IO: High; DM_n:stable at 1; Bank Activity: Auto Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: MID-LEVEL IPP6A Auto Self-Refresh IPP Current Same condition with IDD6A IDD7 Operating Bank Interleave Read Current CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, nRRD, nFAW, CL: see Table 1; BL: 81; AL: CL-1; CS_n: High between ACT and RDA; Command, Address, Bank Group Address, Bank Address Inputs: partially toggling according to Table 10; Data IO: read data bursts with different data between one burst and the next one according to Table 10; DM_n: stable at 1; Bank Activity: two times interleaved cycling through banks (0, 1, ...7) with different addressing, see Table 10; Output Buffer and RTT: Enabled in Mode Registers2; ODT Signal: stable at 0; Pattern Details: see Table 10 IPP7 Operating Bank Interleave Read IPP Current Same condition with IDD7 IDD8 Maximum Power Down Current TBD IPP8 Maximum Power Down IPP Current Same condition with IDD8

Rev. 1.3 / Mar.2016 57 NOTE : 1. Burst Length: BL8 fixed by MRS: set MR0 [A1:0=00]. 2. Output Buffer Enable - set MR1 [A12 = 0] : Qoff = Output buffer enabled - set MR1 [A2:1 = 00] : Output Driver Impedance Control = RZQ/7 RTT_Nom enable - set MR1 [A10:8 = 011] : RTT_NOM = RZQ/6 RTT_WR enable - set MR2 [A10:9 = 01] : RTT_WR = RZQ/2 RTT_PARK disable - set MR5 [A8:6 = 000] 3. CAL enabled : set MR4 [A8:6 = 001] : 1600MT/s 010] : 1866MT/s, 2133MT/s 011] : 2400MT/s Gear Down mode enabled :set MR3 [A3 = 1] : 1/4 Rate DLL disabled : set MR1 [A0 = 0] CA parity enabled :set MR5 [A2:0 = 001] : 1600MT/s,1866MT/s, 2133MT/s 010] : 2400MT/s Read DBI enabled : set MR5 [A12 = 1] Write DBI enabled : set :MR5 [A11 = 1] 4. Low Power Array Self Refresh (LP ASR) : set MR2 [A7:6 = 00] : Normal 01] : Reduced Temperature range 10] : Extended Temperature range 11] : Auto Self Refresh 5. IDD2NG should be measured after sync pulse(NOP) input.

Rev. 1.3 / Mar.2016 58 Table 3 - IDD0, IDD0A and IPP0 Measurement-Loop Pattern1 NOTE: 1 .DQS_t, DQS_c are VDDQ. 2. BG1 is don’t care for x16 device 3. C[2:0] are used only for 3DS device 4. DQ signals are VDDQ. CK_t /CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/ A16 CAS_n/ A15 WE_n/ A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 ACT 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 - 1,2 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 - 3,4 D_#, D_# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 - nRAS PRE 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 - 1 1*nRC repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 1 instead 2 2*nRC repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 3*nRC repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 4*nRC repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 5 5*nRC repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 2 instead 6 6*nRC repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 7 7*nRC repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 0 instead 8 8*nRC repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 9 9*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 1 instead 10 10*nRC repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 2 instead 11 11*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 3 instead 12 12*nRC repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 1 instead 13 13*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 2 instead 14 14*nRC repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 3 instead 15 15*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 59 Table 4 - IDD1, IDD1A and IPP1 Measurement-Loop Patterna) NOTE: 1. DQS_t, DQS_c are used according to RD Commands, otherwise VDDQ 2. BG1 is don’t care for x16 device 3. C[2:0] are used only for 3DS device 4.Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are VDDQ. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 ACT 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 - 1, 2 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 - 3, 4 D#, D# 1 1 1 1 1 0 0 3b 3 0 0 0 7 F 0 - nRCD -AL RD 0 1 1 0 1 0 0 0 0 0 0 0 0 0 0 D0=00, D1=FF D2=FF, D3=00 D4=FF, D5=00 D6=00, D7=FF nRAS PRE 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 - 1 1*nRC + 0 ACT 0 0 0 1 1 0 0 1 1 0 0 0 0 0 0 - 1*nRC + 1, 2 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 - 1*nRC + 3, 4 D#, D# 1 1 1 1 1 0 0 3b 3 0 0 0 7 F 0 - 1*nRC + nRCD - AL RD 0 1 1 0 1 0 0 1 1 0 0 0 0 0 0 D0=FF, D1=00 D2=00, D3=FF D4=00, D5=FF D6=FF, D7=00 1*nRC + nRAS PRE 0 1 0 1 0 0 0 1 1 0 0 0 0 0 0 - 2 2*nRC repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 3*nRC repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 4*nRC repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 5 5*nRC repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 2 instead 6 6*nRC repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 8 7*nRC repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 0 instead 9 9*nRC repeat Sub-Loop 1, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 10 10*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 1 instead 11 11*nRC repeat Sub-Loop 1, use BG[1:0]2 = 2, BA[1:0] = 2 instead 12 12*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 3 instead 13 13*nRC repeat Sub-Loop 1, use BG[1:0]2 = 2, BA[1:0] = 1 instead 14 14*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 2 instead 15 15*nRC repeat Sub-Loop 1, use BG[1:0]2 = 2, BA[1:0] = 3 instead 16 16*nRC repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 60 Table 5 - IDD2N, IDD2NA, IDD2NL, IDD2NG, IDD2ND, IDD2N_par, IPP2,IDD3N, IDD3NA and IDD3P Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are VDDQ. 2. BG1 is don’t care for x16 device 3. C[2:0] are used only for 3DS device 4. DQ signals are VDDQ. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

1 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

2 D#,

1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 0

3 D#,

1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 0 1 4-7 repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 1 instead 2 8-11 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 12-15 repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 16-19 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 5 20-23 repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 2 instead 6 24-27 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 7 28-31 repeat Sub-Loop 0, use BG[1:0]2 = 1, BA[1:0] = 0 instead 8 32-35 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 0 instead 9 36-39 repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 1 instead 10 40-43 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 2 instead 11 44-47 repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 3 instead 12 48-51 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 1 instead 13 52-55 repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 2 instead 14 56-59 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 3 instead 15 60-63 repeat Sub-Loop 0, use BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 61 Table 6 - IDD2NT and IDDQ2NT Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are VDDQ. 2. BG1 is don’t care for x16 device 3. C[2:0] are used only for 3DS device 4. DQ signals are VDDQ. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

1 D, D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

2 D#, D# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 -

3 D#, D# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 -

1 4-7 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 1, BA[1:0] = 1 instead 2 8-11 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 0, BA[1:0] = 2 instead 3 12-15 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 1, BA[1:0] = 3 instead 4 16-19 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 0, BA[1:0] = 1 instead 5 20-23 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 1, BA[1:0] = 2 instead 6 24-27 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 0, BA[1:0] = 3 instead 7 28-31 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 1, BA[1:0] = 0 instead 8 32-35 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 9 36-39 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 3, BA[1:0] = 1 instead 10 40-43 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 2, BA[1:0] = 2 instead 11 44-47 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 3, BA[1:0] = 3 instead 12 48-51 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 2, BA[1:0] = 1 instead 13 52-55 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 3, BA[1:0] = 2 instead 14 56-59 repeat Sub-Loop 0, but ODT = 0 and BG[1:0]2 = 2, BA[1:0] = 3 instead 15 60-63 repeat Sub-Loop 0, but ODT = 1 and BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 62 Table 7 - IDD4R, IDDR4RA, IDD4RB and IDDQ4R Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are used according to RD Commands, otherwise VDDQ. 2. BG1 is don’t care for x16 device 3. C[2:0] are used only for 3DS device 4. Burst Sequence driven on each DQ signal by Read Command. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 RD 0 1 1 0 1 0 0 0 0 0 0 0 0 0 0 D0=00, D1=FF D2=FF, D3=00 D4=FF, D5=00 D6=00, D7=FF

1 D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

2,3 D#, D# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 - 1 4 RD 0 1 1 0 1 0 0 1 1 0 0 0 7 F 0 D0=FF, D1=00 D2=00, D3=FF D4=00, D5=FF D6=FF, D7=00

5 D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

6,7 D#, D# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 - 2 8-11 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 12-15 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 16-19 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 5 20-23 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 2 instead 6 24-27 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 7 28-31 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 0 instead 8 32-35 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 9 36-39 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 1 instead 10 40-43 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 2 instead 11 44-47 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 3 instead 12 48-51 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 1 instead 13 52-55 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 2 instead 14 56-59 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 3 instead 15 60-63 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 63 Table 8 - IDD4W, IDD4WA, IDD4WB and IDD4W_par Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are used according to WR Commands, otherwise VDDQ. 2. BG1 is don’t care for x16 device 3. C[2:0] are used only for 3DS device 4. Burst Sequence driven on each DQ signal by Write Command. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 WR 0 1 1 0 1 1 0 0 0 0 0 0 0 0 0 D0=00, D1=FF D2=FF, D3=00 D4=FF, D5=00 D6=00, D7=FF

1 D 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 -

2,3 D#, D# 1 1 1 1 1 1 0 32 3 0 0 0 7 F 0 - 1 4 WR 0 1 1 0 1 1 0 1 1 0 0 0 7 F 0 D0=FF, D1=00 D2=00, D3=FF D4=00, D5=FF D6=FF, D7=00

5 D 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 -

6,7 D#, D# 1 1 1 1 1 1 0 32 3 0 0 0 7 F 0 - 2 8-11 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 12-15 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 16-19 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 5 20-23 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 2 instead 6 24-27 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 7 28-31 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 0 instead 8 32-35 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 9 36-39 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 1 instead 10 40-43 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 2 instead 11 44-47 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 3 instead 12 48-51 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 1 instead 13 52-55 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 2 instead 14 56-59 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 3 instead 15 60-63 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 64 Table 9 - IDD4WC Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are VDDQ. 2. BG1 is don’t care for x16 device. 3. C[2:0] are used only for 3DS device. 4. Burst Sequence driven on each DQ signal by Write Command. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]c BG[1:0]b BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Datad toggling Static High 0 0 WR 0 1 1 0 1 1 0 0 0 0 0 0 0 0 0 D0=00, D1=FF D2=FF, D3=00 D4=FF, D5=00 D6=00, D7=FF D8=CRC 1,2 D, D 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 - 3,4 D#, D# 1 1 1 1 1 1 0 32 3 0 0 0 7 F 0 -

5 WR 0 1 1 0 1 1 0 1 1 0 0 0 7 F 0 D0=FF, D1=00

D2=00, D3=FF D4=00, D5=FF D6=FF, D7=00 D8=CRC 6,7 D, D 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 - 8,9 D#, D# 1 1 1 1 1 1 0 32 3 0 0 0 7 F 0 - 2 10-14 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 15-19 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 20-24 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 5 25-29 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 2 instead 6 30-34 repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 7 35-39 repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 0 instead 8 40-44 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 9 45-49 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 1 instead 10 50-54 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 2 instead 11 55-59 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 3 instead 12 60-64 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 1 instead 13 65-69 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 2 instead 14 70-74 repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 3 instead 15 75-79 repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 0 instead

Rev. 1.3 / Mar.2016 65 Table 10 - IDD5B Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are VDDQ. 2. BG1 is don’t care for x16 device. 3. C[2:0] are used only for 3DS device. 4. DQ signals are VDDQ. CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 REF 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 - 1 1 D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

2 D 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

4 D#, D# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 -

4-7 repeat pattern 1...4, use BG[1:0]2 = 1, BA[1:0] = 1 instead 8-11 repeat pattern 1...4, use BG[1:0]2 = 0, BA[1:0] = 2 instead 12-15 repeat pattern 1...4, use BG[1:0]2 = 1, BA[1:0] = 3 instead 16-19 repeat pattern 1...4, use BG[1:0]2 = 0, BA[1:0] = 1 instead 20-23 repeat pattern 1...4, use BG[1:0]2 = 1, BA[1:0] = 2 instead 24-27 repeat pattern 1...4, use BG[1:0]2 = 0, BA[1:0] = 3 instead 28-31 repeat pattern 1...4, use BG[1:0]2 = 1, BA[1:0] = 0 instead 32-35 repeat pattern 1...4, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 36-39 repeat pattern 1...4, use BG[1:0]2 = 3, BA[1:0] = 1 instead 40-43 repeat pattern 1...4, use BG[1:0]2 = 2, BA[1:0] = 2 instead 44-47 repeat pattern 1...4, use BG[1:0]2 = 3, BA[1:0] = 3 instead 48-51 repeat pattern 1...4, use BG[1:0]2 = 2, BA[1:0] = 1 instead 52-55 repeat pattern 1...4, use BG[1:0]2 = 3, BA[1:0] = 2 instead 56-59 repeat pattern 1...4, use BG[1:0]2 = 2, BA[1:0] = 3 instead 60-63 repeat pattern 1...4, use BG[1:0]2 = 3, BA[1:0] = 0 instead 2 64 ... nRFC - 1 repeat Sub-Loop 1, Truncate, if necessary

Rev. 1.3 / Mar.2016 66 Table 11 - IDD7 Measurement-Loop Pattern1 NOTE : 1. DQS_t, DQS_c are VDDQ. 2. BG1 is don’t care for x16 device. 3. C[2:0] are used only for 3DS device. 4. Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are VDDQ CK_t, CK_c CKE Sub-Loop Cycle Number Command CS_n ACT_n RAS_n/A16 CAS_n/A15 WE_n/A14 ODT C[2:0]3 BG[1:0]2 BA[1:0] A12/BC_n A[17,13,11] A[10]/AP A[9:7] A[6:3] A[2:0] Data4 toggling Static High 0 0 ACT 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 -

1 RDA 0 1 1 0 1 0 0 0 0 0 1 0 0 0 D0=00, D1=FF

D2=FF, D3=00 D4=FF, D5=00 D6=00, D7=FF

3 D# 1 1 1 1 1 0 0 32 3 0 0 0 7 F 0 -

1 nRRD ACT 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 - nRRD + 1 RDA 0 1 1 0 1 0 1 1 0 0 1 0 0 0 D0=FF, D1=00 D2=00, D3=FF D4=00, D5=FF D6=FF, D7=00 2 2*nRRD repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 2 instead 3 3*nRRD repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 3 instead 4 4*nRRD repeat pattern 2 ... 3 until nFAW - 1, if nFAW > 4*nRRD. Truncate if necessary 5 nFAW repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 1 instead 6 nFAW + nRRD repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 2 instead 7 nFAW + 2*nRRD repeat Sub-Loop 0, use BG[1:0]2 = 0, BA[1:0] = 3 instead 8 nFAW + 3*nRRD repeat Sub-Loop 1, use BG[1:0]2 = 1, BA[1:0] = 0 instead 9 nFAW + 4*nRRD repeat Sub-Loop 4 10 2*nFAW repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 0 instead For x4 and x8 only 11 2*nFAW + nRRD repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 1 instead 12 2*nFAW + 2*nRRD repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 2 instead 13 2*nFAW + 3*nRRD repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 3 instead 14 2*nFAW + 4*nRRD repeat Sub-Loop 4 15 3*nFAW repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 1 instead 16 3*nFAW + nRRD repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 2 instead 17 3*nFAW + 2*nRRD repeat Sub-Loop 0, use BG[1:0]2 = 2, BA[1:0] = 3 instead 18 3*nFAW + 3*nRRD repeat Sub-Loop 1, use BG[1:0]2 = 3, BA[1:0] = 0 instead 19 3*nFAW + 4*nRRD repeat Sub-Loop 4 20 4*nFAW repeat pattern 2 ... 3 until nRC - 1, if nRC > 4*nFAW. Truncate if necessary

Rev. 1.3 / Mar.2016 31 IDD Specifications IDD and IPP values are for full operating range of voltage and temperature unless otherwise noted. IDD and IPP values are for full operating range of voltage and temperature unless otherwise noted. IDD and IDDQ Specification NOTE : 1. Users should refer to the DRAM supplier data sheet and/or the DIMM SPD to determine if DDR4 SDRAM devices support the follow- ing options or requirements referred to in this material. Symbol 2133 2400 Unit NOTE x4 x8 x16 x4 x8 x16 IDD0 28 30 41 32 32 44 mA IDD0A 28 30 41 33 33 45 mA IDD1 36 40 56 42 42 59 mA IDD1A 37 40 56 43 43 60 mA IDD2N 17 17 17 18 18 18 mA IDD2NA 19 19 19 21 21 21 mA IDD2NT 21 21 21 23 23 23 mA IDD2NL 13 13 13 14 14 14 mA IDD2NG 17 17 17 19 19 19 mA IDD2ND 16 16 16 17 17 17 mA IDD2N_par 18 18 18 19 19 19 mA IDD2P 12 12 12 13 13 13 mA IDD2Q 17 17 17 18 18 18 mA IDD3N 34 34 34 37 37 37 mA IDD3NA 35 35 35 38 38 38 mA IDD3P 28 28 28 30 30 30 mA IDD4R 78 101 162 113 113 181 mA IDD4RA 80 103 165 115 115 184 mA IDD4RB 81 102 163 114 114 182 mA IDD4W 79 108 173 121 121 194 mA IDD4WA 82 111 178 124 124 198 mA IDD4WB 82 108 173 120 121 194 mA IDD4WC 72 96 154 108 108 173 mA IDD4W_par 91 119 190 136 136 218 mA IDD5B 182 182 182 182 182 182 mA IDD5F2 200 200 200 200 200 200 mA IDD5F4 150 150 150 150 150 150 mA IDD6N 12 12 12 12 12 12 mA IDD6E 1 16 16 16 16 16 16 mA IDD6R 888888m A IDD6A 21 22 22 22 22 22 mA IDD7 126 135 181 150 139 188 mA IDD8 777777m A

Rev. 1.3 / Mar.2016 32 IPP Specification NOTE : 1.Users should refer to the DRAM supplier data sheet and/or the DIMM SPD to determine if DDR4 SDRAM devices support the follow- ing options or requirements referred to in this material. IDD6 Specification NOTE : 1. Some IDD currents are higher for x16 organization due to larger page-size architecture. 2. Max. values for IDD currents considering worst case conditions of process, temperature and voltage. 3. Applicable for MR2 settings A6=0 and A7=0. 4. Supplier data sheets include a max value for IDD6. 5. Applicable for MR2 settings A6=0 and A7=1. IDD6E is only specified for devices which support the Extended Temperature Range feature. 6. Refer to the supplier data sheet for the value specification method (e.g. max, typical) for IDD6E and IDD6A 7. Applicable for MR2 settings A6=1 and A7=0. IDD6A is only specified for devices which support the Auto Self Refresh feature. 8. Applicable for MR2 settings MR2 [A7:A6 = 01] : Reduced Temperature range. IDD6R is verified by design and characterization, and may not be subject to production test Symbol 2133 2400 Unit NOTE x4 x8 x16 x4 x8 x16 IPP6E Symbol Temperature Range 2133 2400 Unit NOTE x4 x8 x16 x4 x8 x16 IDD6N 0 - 85 oC 1 21 21 21 21 21 2 m A 3 , 4 IDD6E 0 - 95 oC 1 61 61 61 61 61 6 m A 4 , 5 , 6 IDD6R 0 - 45oC 888888 m A 4 , 6 , 8 IDD6A 0 - 45oC 2 12 22 22 22 22 2 m A 4 , 6 , 7

Rev. 1.3 / Mar.2016 31 Input/Output Capacitance NOTE : 1. This parameter is not subject to production test. It is verified by design and characterization. The silicon only capacitance is vali- dated by de-embedding the package L & C parasitic. The capacitance is measured with VDD, VDDQ, VSS, VSSQ applied with all other signal pins floating. Measurement procedure tbd. 2. DQ, DM_n, DQS_T, DQS_C, TDQS_T, TDQS_C. Although the DM, TDQS_T and TDQS_C pins have different functions, the loading matches DQ and DQS 3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here 4. Absolute value CK_T-CK_C 5. Absolute value of CIO(DQS_T)-CIO(DQS_C) 6. CI applies to ODT, CS_n, CKE, A0-A17, BA0-BA1, BG0-BG1, RAS_n/A16, CAS_n/A15, WE_n/A14, ACT_n and PAR. 7. CDI CTRL applies to ODT, CS_n and CKE 8. CDI_CTRL = CI(CTRL)-0.5*(CI(CLK_T)+CI(CLK_C)) 9. CDI_ADD_ CMD applies to, A0-A17, BA0-BA1, BG0-BG1,RAS_n/A16, CAS_n/A15, WE_n/A14, ACT_n and PAR. 10. CDI_ADD_CMD = CI(ADD_CMD)-0.5*(CI(CLK_T)+CI(CLK_C)) 11. CDIO = CIO(DQ,DM)-0.5*(CIO(DQS_T)+CIO(DQS_C)) 12. Maximum external load capacitance on ZQ pin: tbd pF. 13. TEN pis may be DRAM internally pulled low through a weak pull-down resistor to VSS. In this case CTEN might not be valid and system shall verify TEN signal with Vendor specific information. Silicon pad I/O Capacitance Symbol Parameter DDR4- 1600,1866,2133 DDR4-2400,2666 Unit NOTE min max min max CIO Input/output capacitance 0.55 1.4 0.55 1.15 pF 1,2,3 CDIO Input/output capacitance delta -0.1 0.1 -0.1 0.1 pF 1,2,3,11 CDDQS Input/output capacitance delta DQS_t and DQS_c 0.05 0.05 pF 1,2,3,5 CCK Input capacitance, CK_t and CK_c 0.2 0.8 0.2 0.7 pF 1,3 CDCK Input capacitance delta CK_t and CK_c 0.05 0.05 pF 1,3,4 CI Input capacitance (CTRL, ADD, CMD pins only) 0.2 0.8 0.2 0.7 pF 1,3,6 CDI_ CTRL Input capacitance delta (All CTRL pins only) -0.1 0.1 -0.1 0.1 pF 1,3,7,8 CDI_ ADD_CMD Input capacitance delta (All ADD/CMD pins only) -0.1 0.1 -0.1 0.1 pF 1,2,9,10 CALERT Input/output capacitance of ALERT 0.5 1.5 0.5 1.5 pF 1,3 CZQ Input/output capacitance of ZQ 0.5 2.3 0.5 2.3 pF 1,3,12 CTEN Input capacitance of TEN 0.2 2.3 0.2 2.3 pF 1,3,13

Rev. 1.3 / Mar.2016 33 DRAM package electrical specifications (x4/x8) Symbol Parameter DDR4- 1600,1866 DDR4- 2133,2400 DDR4-2666 Unit NOTE min max min max min max ZIO Input/output Zpkg 45 85 45 85 TBD TBD  1,2,4,5,10,11 TDIO Input/output Pkg Delay 14 42 14 42 TBD TBD ps 1,3,4,5,11 LIO Input/output Lpkg - 3.3 - 3.3 TBD TBD nH 11,12 CIO Input/output Cpkg - 0.78 - 0.78 TBD TBD pF 11,13 ZIO DQS DQS_t, DQS_c Zpkg 45 85 45 85 TBD TBD  1,2,5,10,11 TdIO DQS DQS_t, DQS_c Pkg Delay 14 42 14 42 TBD TBD ps 1,3,5,10,11 LIO DQS DQS Lpkg - 3.3 - 3.3 TBD TBD nH 11,12 CIO DQS DQS Cpkg - 0.78 - 0.78 TBD TBD pF 11,13 DZDIO DQS Delta Zpkg DQS_t, DQS_c - 10 - 10 TBD TBD  1,2,5,7,10 DTdDIO DQS Delta Delay DQS_t, DQS_c - 5 - 5 TBD TBD ps 1,3,5,7,10 ZI CTRL Input- CTRL pins Zpkg 50 90 50 90 TBD TBD  1,2,5,9,10,11 TdI CTRL Input- CTRL pins Pkg Delay 14 42 14 42 TBD TBD ps 1,3,5,9,10,11 LI CTRL Input CTRL Lpkg - 3.4 - 3.4 TBD TBD nH 11,12 CI CTRL Input CTRL Cpkg - 0.7 - 0.7 TBD TBD pF 11,13 ZIADD CMD Input- CMD ADD pins Zpkg 50 90 50 90 TBD TBD  1,2,5,8,10,11 TdIADD CMD Input- CMD ADD pins Pkg Delay 14 45 14 45 TBD TBD ps 1,3,5,8,10,11 LI ADD CMD Input CMD ADD Lpkg - 3.6 - 3.6 TBD TBD nH 11,12 CI ADD CMD Input CMD ADD Cpkg - 0.74 0- 0.74 TBD TBD pF 11,13 ZCK CLK_t & CLK_c Zpkg 50 90 50 90 TBD TBD  1,2,5,10,11 TdCK CLK_t & CLK_c Pkg Delay 14 42 14 42 TBD TBD ps 1,3,5,10,11 LI CLK Input CLK Lpkg - 3.4 - 3.4 TBD TBD nH 11,12 CI CLK Input CLK Cpkg - 0.7 - 0.7 TBD TBD pF 11,13 DZDLK Delta Zpkg CLK_t & CLK_c - 10 - 10 TBD TBD  1,2,5,6,10 DTdLK Delta Delay CLK_t & CLK_c - 5 - 5 TBD TBD ps 1,3,5,6,10 ZO ZQ ZQ Zpkg 40 100 40 100 TBD TBD  1,2,5,10,11 TdO ZQ ZQ Delay 20 90 20 90 TBD TBD ps 1,3,5,10,11 ZO ALERT ALERT Zpkg 40 100 40 100 TBD TBD  1,2,5,10,11 TdO ALERT ALERT Delay 20 55 20 55 TBD TBD ps 1,3,5,10,11

Rev. 1.3 / Mar.2016 34 NOTE : 1. This parameter is not subject to production test. It is verified by design and characterization. The package parasitic( L & C) are val- idated using package only samples. The capacitance is measured with VDD, VDDQ, VSS, VSSQ shorted with all other signal pins floating. The inductance is measured with VDD, VDDQ, VSS and VSSQ shorted and all other signal pins shorted at the die side(not pin). Measurement procedure tbd 2. Package only impedance (Zpkg) is calculated based on the Lpkg and Cpkg total for a given pin where: 3. Package only delay(Tpkg) is calculated based on Lpkg and Cpkg total for a given pin where: 4. Z & Td IO applies to DQ, DM, TDQS_T and TDQS_C 5. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here 6. Absolute value of ZCK_t-ZCK_c for impedance(Z) or absolute value of TdCK_t-TdCK_c for delay(Td). 7. Absolute value of ZIO(DQS_t)-ZIO(DQS_c) for impedance(Z) or absolute value of TdIO(DQS_t)-TdIO(DQS_c) for delay(Td) 8. ZI & Td ADD CMD applies to A0-A13, ACT_n, BA0-BA1, BG0-BG1, RAS_n/A16, CAS_n/A15, WE_n/A14 and PAR. 9. ZI & Td CTRL applies to ODT, CS_n and CKE 10. This table applies to monolithic X4 and X8 devices. 11. Package implementations shall meet spec if the Zpkg and Pkg Delay fall within the ranges shown, and the maximum Lpkg and Cpkg do not exceed the maximum values shown. 12. It is assumed that Lpkg can be approximated as Lpkg = Zo*Td. 13. It is assumed that Cpkg can be approximated as Cpkg = Td/Zo. Zpkg(total per pin) = Lpkg/Cpkg Tdpkg(total per pin) = LpkgCpkg

Rev. 1.3 / Mar.2016 36 DRAM package electrical specifications (x16) Symbol Parameter DDR4- 1600,1866 DDR4- 2133,2400 DDR4-2666 Unit NOTE min max min max min max ZIO Input/output Zpkg 45 85 45 85 TBD TBD  1 TDIO Input/output Pkg Delay 14 45 14 45 TBD TBD ps 1 LIO Input/output Lpkg - 3.4 - 3.4 TBD TBD nH 1,2 CIO Input/output Cpkg - 0.82 - 0.82 TBD TBD pF 1,3 ZIO DQS DQS_t, DQS_c Zpkg 45 85 45 85 TBD TBD  1 TdIO DQS DQS_t, DQS_c Pkg Delay 14 45 14 45 TBD TBD ps 1 LIO DQS DQS Lpkg - 3.4 - 3.4 TBD TBD nH 1,2 CIO DQS DQS Cpkg - 0.82 - 0.82 TBD TBD pF 1,3 DZDIO DQS Delta Zpkg DQSU_t, DQSU_c - 10 - 10 TBD TBD  - Delta Zpkg DQSL_t, DQSL_c - 10 - 10 TBD TBD  - DTdDIO DQS Delta Delay DQSU_t, DQSU_c - 5 - 5 TBD TBD ps - Delta Delay DQSL_t, DQSL_c - 5 - 5 TBD TBD ps - ZI CTRL Input- CTRL pins Zpkg 50 90 50 90 TBD TBD  1 TdI CTRL Input- CTRL pins Pkg Delay 14 42 14 42 TBD TBD ps 1 LI CTRL Input CTRL Lpkg - 3.4 - 3.4 TBD TBD nH 1,2 CI CTRL Input CTRL Cpkg - 0.7 - 0.7 TBD TBD pF 1,3 ZIADD CMD Input- CMD ADD pins Zpkg 50 90 50 90 TBD TBD  1 TdIADD CMD Input- CMD ADD pins Pkg Delay 14 52 14 52 TBD TBD ps 1 LI ADD CMD Input CMD ADD Lpkg - 3.9 - 3.9 TBD TBD nH 1,2 CI ADD CMD Input CMD ADD Cpkg - 0.86 - 0.86 TBD TBD pF 1,3 ZCK CLK_t & CLK_c Zpkg 50 90 50 90 TBD TBD  1 TdCK CLK_t & CLK_c Pkg Delay 14 42 14 42 TBD TBD ps 1 LI CLK Input CLK Lpkg - 3.4 - 3.4 TBD TBD nH 1,2 CI CLK Input CLK Cpkg - 0.7 - 0.7 TBD TBD pF 1,3 DZDLK Delta Zpkg CLK_t & CLK_c - 10 - 10 TBD TBD  - DTdLK Delta Delay CLK_t & CLK_c - 5 - 5 TBD TBD ps - ZO ZQ ZQ Zpkg 40 100 40 100 TBD TBD  - TdO ZQ ZQ Delay 20 90 20 90 TBD TBD ps - ZO ALERT ALERT Zpkg 40 100 40 100 TBD TBD  - TdO ALERT ALERT Delay 20 55 20 55 TBD TBD ps -

Rev. 1.3 / Mar.2016 37 NOTE : 1. Package implementations shall meet spec if the Zpkg and Pkg Delay fall within the ranges shown, and the maximum Lpkg and Cpkg do not exceed the maximum values shown. 2. It is assumed that Lpkg can be approximated as Lpkg = Zo*Td. 3. It is assumed that Cpkg can be approximated as Cpkg = Td/Zo.

Rev. 1.3 / Mar.2016 44 Standard Speed Bins DDR4-1600 Speed Bins and Operations Speed Bin DDR4-1600K Unit NOTECL-nRCD-nRP 11-11-11 Parameter Symbol min max Internal read command to first data tAA 13.7513 (13.50)5,11 18.00 ns 11 Internal read command to first data with read DBI enabled tAA_DBI tAA(min) + 2nCK tAA(max) +2nCK ns 11 ACT to internal read or write delay time tRCD 13.75 PRE command period tRP 13.75 ACT to PRE command period tRAS 35 9 x tREFI ns 11 ACT to ACT or REF command period tRC 48.75 Normal Read DBI CWL = 9 CL = 9 CL = 11 tCK(AVG) 1.5 1.6 ns 1,2,3,4,10 ,13 CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,4,10 CWL = 9,11 CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,4 CL = 11 CL = 13 tCK(AVG) 1.25 <1.5 ns 1,2,3,4 CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3 Supported CL Settings 9,11,12 nCK 12,13 Supported CL Settings with read DBI 11,13,14 nCK 12 Supported CWL Settings 9,11 nCK

Rev. 1.3 / Mar.2016 45 DDR4-1866 Speed Bins and Operations Speed Bin DDR4-1866M Unit NOTECL-nRCD-nRP 13-13-13 Parameter Symbol min max Internal read command to first data tAA 13.9213 (13.50)5,11 18.00 ns 11 Internal read command to first data with read DBI enabled tAA_DBI tAA(min) + 2nCK tAA(max) +2nCK ns 11 ACT to internal read or write delay time tRCD 13.92 PRE command period tRP 13.92 ACT to PRE command period tRAS 34 9 x tREFI ns 11 ACT to ACT or REF command period tRC 47.92 Normal Read DBI CWL = 9 CL = 9 CL = 11 tCK(AVG) 1.5 1.6 ns 1,2,3,4,10 ,11 CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,4,10 CWL = 9,11 CL = 10 CL = 12 tCK(AVG) Reserved ns 4 CL = 11 CL = 13 tCK(AVG) 1.25 <1.5 ns 1,2,3,4,6 CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,6 CWL = 10,12 CL = 12 CL = 14 tCK(AVG) Reserved ns 1,2,3,4 CL = 13 CL = 15 tCK(AVG) 1.071 <1.25 ns 1,2,3,4 CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3 Supported CL Settings 9,11,12,13,14 nCK 12,13 Supported CL Settings with read DBI 11,13,14 ,15,16 nCK 13 Supported CWL Settings 9,10,11,12 nCK

Rev. 1.3 / Mar.2016 46 DDR4-2133 Speed Bins and Operations Speed Bin DDR4-2133P Unit NOTECL-nRCD-nRP 15-15-15 Parameter Symbol min max Internal read command to first data tAA 14.0613 (13.50)5,11 18.00 ns 11 Internal read command to first data with read DBI enabled tAA_DBI tAA(min)+3nCK tAA(max)+3nCK ns 11 ACT to internal read or write delay time tRCD 14.06 PRE command period tRP 14.06 ACT to PRE command period tRAS 33 9 x tREFI ns 11 ACT to ACT or REF command period tRC 47.06 Normal Read DBI CWL = 9 CL = 9 CL = 11 tCK(AVG) 1.5 1.6 ns 1,2,3,4,10, CL = 10 CL = 12 tCK(AVG) Reserved ns 1,2,3,10 CWL = 9,11 CL = 11 CL = 13 tCK(AVG) 1.25 <1.5 ns 1,2,3,4,7 CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,7 CWL = 10,12 CL = 13 CL = 15 tCK(AVG) 1.071 <1.25 ns 1,2,3,4,7 CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3,7 CWL = 11,14 CL = 14 CL = 17 tCK(AVG) Reserved ns 1,2,3,4 CL = 15 CL = 18 tCK(AVG) 0.937 <1.071 ns 1,2,3,4 CL = 16 CL = 19 tCK(AVG) 0.937 <1.071 ns 1,2,3 Supported CL Settings 9,11,12,13,14,15,16 nCK 12,13 Supported CL Settings with read DBI 11,13,14,15,16,18,19 nCK Supported CWL Settings 9,10,11,12,14 nCK

Rev. 1.3 / Mar.2016 47 DDR4-2400 Speed Bins and Operations Speed Bin DDR4-2400T Unit NOTECL-nRCD-nRP 17-17-17 Parameter Symbol min max Internal read command to first data tAA 14.16 (13.75)5,11 18.00 ns 11 Internal read command to first data with read DBI enabled tAA_DBI tAA(min)+3nCK tAA(max)+3nCK ns 11 ACT to internal read or write delay time tRCD 14.16 PRE command period tRP 14.16 ACT to PRE command period tRAS 32 9 x tREFI ns 11 ACT to ACT or REF command period tRC 46.16 Normal Read DBI CWL = 9 CL = 9 CL = 11 tCK(AVG) Reserved ns 1,2,3,4,10 CL = 10 CL = 12 tCK(AVG) 1.5 1.6 ns 1,2,3,4,10 CWL = 9,11 CL = 10 CL = 12 tCK(AVG) Reserved ns 4 CL = 11 CL = 13 tCK(AVG) 1.25 <1.5 ns 1,2,3,4,8 CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,8 CWL = 10,12 CL = 12 CL = 14 tCK(AVG) Reserved ns 4 CL = 13 CL = 15 tCK(AVG) 1.071 <1.25 ns 1,2,3,4,8 CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3,8 CWL = 11,14 CL = 14 CL = 17 tCK(AVG) Reserved ns 4 CL = 15 CL = 18 tCK(AVG) 0.937 <1.071 ns 1,2,3,4,8 CL = 16 CL = 19 tCK(AVG) 0.937 <1.071 ns 1,2,3,8 CWL = 12,16 CL = 15 CL = 18 tCK(AVG) Reserved ns 1,2,3,4 CL = 16 CL = 19 tCK(AVG) Reserved ns 1,2,3,4 CL = 17 CL = 20 tCK(AVG) 0.833 <0.937 ns CL = 18 CL = 21 tCK(AVG) 0.833 <0.937 ns 1,2,3 Supported CL Settings 10,11,12,13,14,15,16,17,18 nCK 12 Supported CL Settings with read DBI 12,14,16,18,19,20,21 nCK Supported CWL Settings 9,10,11,12,14,16 nCK

Rev. 1.3 / Mar.2016 48 DDR4-2666 Speed Bins and Operations Speed Bin DDR4-2666V Unit NOTECL-nRCD-nRP 19-19-19 Parameter Symbol min max Internal read command to first data tAA 14.2513 (13.75)5,11 18.00 ns 11 Internal read command to first data with read DBI enabled tAA_DBI tAA(min)+3nCK tAA(max)+3nCK ns 11 ACT to internal read or write delay time tRCD 14.2513 PRE command period tRP 14.2513 ACT to PRE command period tRAS 32 9 x tREFI ns 11 ACT to ACT or REF command period tRC 46.25 Normal Read DBI CWL = 9 CL = 9 CL = 11 tCK(AVG) Reserved ns 1,2,3,4,10 CL = 10 CL = 12 tCK(AVG) 1.5 1.6 ns 1,2,3,10 CWL = 9,11 CL = 10 CL = 12 tCK(AVG) Reserved ns 4 CL = 11 CL = 13 tCK(AVG) 1.25 <1.5 ns 1,2,3,4,9 CL = 12 CL = 14 tCK(AVG) 1.25 <1.5 ns 1,2,3,9 CWL = 10,12 CL = 12 CL = 14 tCK(AVG) Reserved ns 4 CL = 13 CL = 15 tCK(AVG) 1.071 <1.25 ns 1,2,3,4,9 CL = 14 CL = 16 tCK(AVG) 1.071 <1.25 ns 1,2,3,9 CWL = 11,14 CL = 14 CL = 17 tCK(AVG) Reserved ns 4 CL = 15 CL = 18 tCK(AVG) 0.937 <1.071 ns 1,2,3,4,9 CL = 16 CL = 19 tCK(AVG) 0.937 <1.071 ns 1,2,3,9 CWL = 12,16 CL = 15 CL = 18 tCK(AVG) Reserved ns 4 CL = 16 CL = 19 tCK(AVG) Reserved ns 1,2,3,4,9 CL = 17 CL = 20 tCK(AVG) 0.833 <0.937 ns 1,2,3,4,9 CL = 18 CL = 21 tCK(AVG) 0.833 <0.937 ns 1,2,3 CWL = 14,18 CL = 17 CL = 20 tCK(AVG) Reserved ns 1,2,3,4 CL = 18 CL = 21 tCK(AVG) Reserved ns 1,2,3,4 CL = 19 CL = 22 tCK(AVG) 0.75 <0.833 ns 1,2,3,4 CL = 20 CL = 23 tCK(AVG) 0.75 <0.833 ns 1,2,3 Supported CL Settings 10,11,12,13,14,15,16,17,18,19,20 nCK 12 Supported CL Settings with read DBI 12,13,14,15,17,18,19,20,21,22,23 nCK Supported CWL Settings 9,10,11,12,14,16,18 nCK

Rev. 1.3 / Mar.2016 49 Speed Bin Table Notes Absolute Specification - VDDQ = VDD = 1.20V +/- 0.06 V - The values defined with above-mentioned table are DLL ON case. - DDR4-1600, 1866, 2133 and 2400 Speed Bin Tables are valid only when Geardown Mode is disabled. 1. The CL setting and CWL setting result in tCK(avg).MIN and tCK(avg).MAX requirements. When making a selection of tCK(avg), bo th need to be fulfilled: Requirements from CL setting as well as require - ments from CWL setting. 2. tCK(avg).MIN limits: Since CAS Latency is not purely analog - data and strobe output are synchronized by the DLL - all possible intermedia te frequencies may not be guaran teed. An application should use CL [nCK] = tAA [ns] / tCK(avg) [ns], rounding up to the next ‘Supported CL’, where tAA = 12.5ns and tCK(avg) = 1.3 ns should only be used for CL = 10 calculation. 3. tCK(avg).MAX limits: Calculate tCK(avg) = tAA.MAX / CL SELECTED and round the resulting tCK(avg) is tCK(avg).MAX corresponding to CL SELECTED. 4. ‘Reserved’ settings are not allowed. User must program a different value. 5. 'Optional' settings allow certain de vices in the industry to support this setting, however, it is not a mandatory feature. Refer to supplier's data sheet and/or the DIMM SPD information if and how this setting is supported. 6. Any DDR4-1866 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 7. Any DDR4-2133 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 8. Any DDR4-2400 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 9. Any DDR4-2666 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to Production Tests but verified by Design/Characterization. 10. DDR4-1600 AC timing apply if DRAM operat es at lower than 1600 MT/s data rate. 11. Parameters apply from tCK(avg)min to tCK(avg)max at all standard JEDEC clock period values as stated in the Speed Bin Tables. 12. CL number in parentheses, it means that these numbers are optional. 13. DDR4 SDRAM supports CL=9 as long as a system meets tAA(min). 14. Each speed bin lists the timing requirements that need to be supported in order for a given DRAM to be JEDEC compliant. JEDEC complianc e does not require support for all speed bins within a given speed. JEDEC compliance requires meeting the parameters for a least one of the listed speed bins.

Rev. 1.3 / Mar.2016 44 Package Dimensions Package Dimension(x4/8): 78Ball Fine Pitch Ball Grid Array Outline 7.500 0.100 11.000 0.100 98 7 321 A B C D E F G H J K L M N 0.550 0.100 2.100 0.100 0.800 X 8 = 6.400 0.800 A1 BALL MARK 1.600 0.800 X 12 = 9.600 0.800 1.600 78x0.450 0.050 0.700 0.100 TOP BOTTOM A1 INDEX MARK SIDE VIEW 0.340 0.050 1.100 0.100

Rev. 1.3 / Mar.2016 45 Package Dimension(x16): 96Ball Fine Pitch Ball Grid Array Outline 7.500 0.100 13.000 0.100 98 7 21 A B C D E F G H J K L M N 0.550 0.100 0.800 X 8 = 6.4000.800 1.600 0.800 X 15 = 12.000 0.800 1.600 96x0.450 0.050 0.500 0.100 TOP VIEW BOTTOM VIEW SIDE VIEW A1 BALL MARK3 P R T 2.100 0.100 A1 INDEX MARK 0.340 0.050 1.100 0.100