GP2S60

GP2S60_05 SHARP | Alldatasheet

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Sheet No.: D3-A02101EN Date Oct. 3. 2005 © SHARP Corporation Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. GP2S60 SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Refl ective Photointerrupter ■Description GP2S60 is a compact-package, phototransistor out- put, refl ective photointerrupter, with emitter and detector facing the same direction in a molding that provides non- contact sensing. The compact package series is a result of unique technology, combing transfer and injection molding, that also blocks visible light to minimize false detection. This photointerrupter can be ordered in different CTR ranks, and has a thin, leadless (T&R) package, suitable for refl ow soldering. ■Features 1. Refl ective with Phototransistor Output 2. Highlights :

• Compact Size
• Surface Mount Type (SMT), reflow soldering, with gullwing leads
• Tape and Reel (T&R) 1 000 pcs per reel 3. Key Parameters :
• Optimal Sensing Distance : 0.7mm
• Package : 4 ×3×1.7mm
• Visible light cut resin to prevent 4. Lead free and RoHS directive compliant ■Agency approvals/Compliance 1. Compliant with RoHS directive ■Applications 1. Detection of object presence or motion. 2. Any application, which production is migrating to 100% surface mount components. 3. Example : printer, optical storage

Sheet No.: D3-A02101EN GP2S60 ■Internal Connection Diagram Collector Emitter Cathode Anode Top view Detector center Emitter center Opaque resin molding portion Pattern for directional Distinction (NC) (0.7) (0.65) 1.7 1.1 0.4 (0.57)(0.57) (0.63) (0.7) 2.7 3.2 (1.8) (0.55) Plating area Top view ■Outline Dimensions (Unit : mm) Product mass : approx. 0.01g

• Unspecifi ed tolerance : ±0.15mm.
• Dimensions in parenthesis are shown for reference.
• Dimensions on the outline drawing is the maximum value excluding burr.
• The dimensions shown do not include burr. Burr's dimension : 0.15mm MAX. Plating material : Au Country of origin Japan

Sheet No.: D3-A02101EN GP2S60 ■Absolute Maximum Ratings ■Electro-optical Characteristics (Ta=25˚C) Parameter Symbol Rating Unit Input Forward current I F 50 mA Reverse voltage V R 6V Power dissipation P D 75 mW Output Collector-emitter voltage VCEO 35 V Emitter-collector voltage VECO 6V Collector current I C 20 mA Collector power dissipation P C 75 mW Total power dissipation P tot 100 mW Operating temperature T opr −25 to +85 ˚C Storage temperature T stg −40 to +100 ˚C ∗1Soldering temperature T sol 260 ˚C ∗1 For 5s or less (Ta=25˚C) Parameter Symbol Condition MIN. TYP. MAX. Unit Input Forward voltage V F IF=20mA − 1.2 1.4 V Reverse current I R VR=6V −− 10 μA Output Collector dark current I CEO VCE=20V − 1 100 nA Transfer charac- teristics ∗2 Collector Current I C IF=4mA, VCE=2V 40 85 130 μA ∗3 Leak current I LEAK IF=4mA, VCE=2V −− 500 nA Response time Rise time t r VCE=2V , IC=100μA, RL=1kΩ, d=1mm − 20 100 μsFall time t f − 20 100 ∗2 The condition and arrangement of the refl ective object are shown below. The rank splitting of collector current (I C) shall be executed according to the table below. Rank Collector current, IC [μA] (IF=4mA, VCE=2V) A 40 to 80 B 65 to 130 ∗3 Without refl ective object.

• Test Condition and Arrangement for Collector Current d=1mm glass plate Aluminum evaporation

Sheet No.: D3-A02101EN GP2S60 ■Model Line-up Please contact a local SHARP sales representative to see the actial status of the produiction. Model No. Rank I C(μA) Conditions GP2S60 A or B 40 to 130 I F=4mA VCE=2V Ta=25˚C GP2S60A A 40 to 80 GP2S60B B 65 to 130

Sheet No.: D3-A02101EN GP2S60 Fig.5 Collector Current vs. Collector-Emitter Voltage Fig.6 Relative Collector Current vs. Ambient Temperature Fig.3 Forward Current vs. Forward Voltage Fig.4 Collector Current vs. Forward Current Forward current IF (mA) 100 0 0.5 1 1.5 2 2.5 3 Forward voltage VF (V) Ta=75˚C 50˚C 25˚C 0˚C −25˚C 1 0 100 200 300 400 500 600 700 0 5 10 15 20 Forward current I F (mA) Collector current IC (μA) VCE=2V Ta=25C Collector current IC (μA) 100 200 300 400 500 600 02468 1 0 Collector-emitter voltage VCE (V) IF=15mA 10mA 7mA 4mA 2mA Ta=25˚C −25 VCE=2V IF=4mA 100 120 02 5 5 0 7 5 Relative collector current (%) Ambient temperature Ta (˚C) Fig.1 Forward Current vs. Ambient Temperature Fig.2 Collector Power Dissipation vs. Ambient Temperature Power dissipation P (mW) Ambient temperature Ta (˚C) 100 120 Ptot −25 0 100 7550 8525 P,PC Forward current IF (mA) 25 0 100 7550 8525 Ambient temperature Ta (˚C)

Sheet No.: D3-A02101EN GP2S60 Fig.7 Collector Dark Current vs. Ambient Temperature Fig.8 Response Time vs. Load Resistance Fig.9 Test Circuit for Response Time Fig.10 Relative Collector Current vs. Distance Fig.11 Spectral Sensitivity Collector dark current ICEO (A) 10−10 10−6 10−7 10−8 10−9 0 25 50 75 100 Ambient temperature Ta (˚C) VCE=20V 10% Input OutputInput Output 90%tstd VCC RD RL tftr Reflector Plate Response time (μs) 100 1 000 0.1 1 1 000 10 100 Load resistance RL (kΩ) VCE=2V IC=100μA Ta=25˚C tf ts td tr Relative sensitivity (%) 100 600 700 800 900 1 000 1 100 1 200 Wavelength λ (nm) Ta=25˚C L Al evaporation glass 100 V CE=2V IF=4mA Ta=25˚C Relative collector current (%) Distance between sensor and Aluminum evaporation glass L (mm) Fig.12 Detecting Position Characteristics (1) 100 64203 5 1−3 −1−2 Relative collector current (%) OMS card moving distance (mm) VCE=2V IF=4mA d=1mm 1mmd OMS test card Sensor− +

Sheet No.: D3-A02101EN GP2S60 Fig.13 Detecting Position Characteristics (2) Sensor 100 64203 5 1−3 −1−2 Relative collector current (%) OMS card moving distance (mm) VCE=2V IF=4mA d=1mm 1mm d OMS test card − + Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

Sheet No.: D3-A02101EN GP2S60 ■Design Considerations

• Design guide 1) Regarding to prevention of malfunction To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Distance characteristic The distance between the photointerrupter and the object to be detected shall be determined the distance by referencing Fig.10 "Relative collector current vs. distance". 3) For wiring on a mounting PCB To avoid possibility for short, please do not apply pattern wiring on the back side of the device. 4) Regarding to mounting this product There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc. Please use this product after well confi rmation of conditions in your production line. This product is not designed against irradiation and incorporates non-coherent IRED.
• Degradation In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.
• Parts This product is assembled using the below parts.
• Light detector (qty. : 1) Category Material Maximum Sensitivity wavelength (nm) Sensitivity wavelength (nm) Response time (μs) Phototransister Silicon (Si) 930 700 to 1 200 20
• Light emitter (qty. : 1) Category Material Maximum light emitting wavelength (nm) I/O Frequency (MHz) Infrared emitting diode (non-coherent) Gallium arsenide (GaAs) 950 0.3
• Material Case PCB Lead frame plating Epoxy resin Black polyphenylene sulfi de Glass epoxy resin Au plating

Sheet No.: D3-A02101EN GP2S60

• Recommended pattern 2−0.65 2−1 2−1 (Unit : mm) area : Please do not apply the pattern wiring to avoid the possibility of short circuit. 2−1.7 2−0.65 2−0.45 Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB and housing main body, the reliability will be deteriorated. Please check the proper amount of solder in advance not to have solder leakage into terminal wiring pattern between PCB and housing main body.

Sheet No.: D3-A02101EN GP2S60 ■Manufacturing Guidelines

• Storage and management after open Storage condition Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging. Treatment after opening the moisture-proof package After opening, you should mount the products while keeping them on the condition of 5 to 25 ˚C and 70%RH or less in humidity within 4 days. After opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30 ˚C and 70%RH or less in humidity. Baking before mounting When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted within one time. Recommended condition : 125˚C, 16 to 24 hours ∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fi x temporarily the products to substrate.

Sheet No.: D3-A02101EN GP2S60

• Soldering Method Refl ow Soldering: Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please solder within one time. Other notice Please take care not to let any external force exert on lead pins. Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions.
• Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : Do not execute ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. MAX 240˚C MAX 160˚C 200˚C 25˚C 1 to 4˚C/s MAX120s MAX10s MAX60s MAX90s 1 to 4˚C/s 1 to 4˚C/s

Sheet No.: D3-A02101EN GP2S60

• Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).

Sheet No.: D3-A02101EN GP2S60 ■Package specifi cation

• Tape and Reel package Package materials Carrier tape : PS (with anti-static material) Cover tape : PET (three layer system) Reel : PS Package method 2 000 pcs of products shall be packaged in a reel. One reed with silicagel is endased in aluminum laminated bag. After sealing up the bag, it encased in one case (5 bags/case). Carrier tape structure and Dimensions Reel structure and Dimensions F K E D I J B H A C H L G 5˚MAX. Dimensions List (Unit : mm) A 8±0.3 B 3.5±0.05 C 1.75±0.1 D 4±0.1 E 2±0.1 G φ1.55±0.05 H 3.6±0.1 I 0.3±0.05 J 1.25±0.1 K 2.2±0.1 L φ1.1±0.1 F 4±0.1 a c e g f b d Dimensions List (Unit : mm) a 180 b 9±1 c 60+0.5 d φ13±0.2 e φ21±0.8 f 11.4±1 g 2+0.3

Sheet No.: D3-A02101EN GP2S60 Direction of product insertion [Packing : 2 000pcs/reel] Storage method Storage conditions should follow the condition shown below. Storage temperature : 5 to 30˚C Storage hunidity : 70%RH or less Pull-out direction

Sheet No.: D3-A02101EN GP2S60 ■Important Notices

• The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
• Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifi cations, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
• Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Offi ce automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffi c signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
• If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
• This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
• Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [H146]