GM5BW97330A

Sharp Corporation

LED DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP

Manufacturer: Sharp Corporation

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gach Doc. No. DG-089015B SH ARP ISSUED October 27, 2008 LED DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION | Technical | Literatures ag FwT7 LED Product name Chip LED | ee GM5BW97330A | Model No. ya T RASH BET N{ABRAR LED Bea Beitres j AEs eB ep | es ‘The content of this technical literature is subject to change or revision without notice. i

H | SHARP CORPORATION Model No. GMSBW973304 i Doc. No. DG-089015B Page 1/ 21 | a & FyT LED Product name Chip LED wb @ Model No. GM5BW97330A O ARATEILMO SH HESICRONBE BEN TOET OT, RUM MCISHEACERICCRIC, ARMNTRAOABE Sekt CAT CHL IRL ASIST EL LIFES O AMAOCRRIRL TE, ABATE IRO CARALE PEEL EERRS RU FOREREE TET. 7283. BEATA ABRAEHE PR ALO FE MIASTRL LAMA OBA, HSISUT OPE RGEML IE AGRO SAAT SRSICELT, MHSTOREAL EEA. CE D AMBRIRRILL THO ARIAT S BA CMS MLCT i “TES OAR MNES] TSHR i “CVPBHE «AV HEE “REL ARES, LILO FRR CH TLORT ILOILO MAT BSI, THEMICLAT SAEREE TRE. © BE REFICBL CR MERE RATEABLE S PHO il CANRE BEN SBAISCH OO Hs 1B fEBLURAEMO KIS Ix — TBH OT RRO WSC S GL ATL LAO REBECCA TAU LE CABLE C BPEL. [ SBA GE, TIS, BES) ORPLABRSHICD DSI =k | SHEE HAMAR ARLE -sHRSRE S © RE RESIS VCH TH MERE REED WBLEN SU TO FRRICISC RISES LT PSL. [PR EMRE OEE “] @ LRD.Q.OOWF BAT SD BBO GSAS HARABOE CORBET» | O AMRICDECAHAE ROBY ELES BRIM ATED E COMMIS ET LIBRA BLET. | © These technical iteratures sheets inciude materials protected under the copyright of Sharp Corporation ("Shap"). SC i Please do not reproduce or cause anyone to reproduce them without Sharp's consent. | | © When using this product, please observe the absolute maximum ratings and the instructions for use in these technical literatures | sheets, as well as the precautions mentioned below. Sharp assumes no responsibilty for any damage resulting from use of the | product which does not comply with the absolute maximum ratings and the instructions included in these technical literatures sheets, and the precautions mentioned below. | (Precautions) (1)This products is designed for use in the following application areas; | * OA equipment »%* Audio visual equipment + Home appliance | % Telecommunication equipment (Terminal) - * Measuring equipment | * Tooling machines * Computers { Ff the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2)Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) | * Traffic signals %* Gas leakage sensor breakers * Rescue and security equipment I * Other safety equipment | | (3)Please do not use this product for equipment which requires extremely high reliability and safety in function and precision, such as ; | + Space equipment + Telecommunication equipment (for trunk lines) % Nuclear power control equipment * Medical equipment i (4)Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above i three paragraphs. © _Please contact and consult with a Sharp sales representative for any questions about this product. _ | The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GM5BW973304 Doc. No. DG-089015B Page 2/ 21 | GM5BW9733L1A fk fit GM5BW9733LA Technical Literatures @3GAGH Application ARATERUS, BEMIS InGaN BH LED FoF + RE RIACRBLE BEF YT LED, GM5BW9733L1A [SiFENET TOBE, BA RTARR AT HERI TET These technical iteratures apply to light erritting dode Model No. GMSBW97330A. [White LED composed of an InGaN blue LED chip and yellow phosphor] This product is designed for various kinds of general indication devices. | SAREE CHEM bo Ald, SALES I there is a difference between Engish description and Japanese description, Japanese description has priority. 1 HE RUSHE Ratings and characteristics..cnucmnsnmenneenesnnensnmmmnminnmmnnnenemnenennannress 3 1.1 BI ATEM Absolute maximum ratings .nennninunnaraenmnemmmmmnmeennnrnnnenennnnnann S 1.2 BRM RUE Electro-optical characteristics .numnmnnnnenennmnnnumnmmnnennnnes &

1.3 DUDE rank table wacnnemnnnneneenmnnnemsnuntiauennsineinennennnnnnnenerinenmrnnmnmananeneenee D

1.6 HEARHBPR Derating Curve .nmmnmneumnnnninininnnnnnnennnnnnmnnannmmmnnnnnnnnnnnnnne 8 1.7 SFRE BQ (BABB). Characteristics Diagram (TYP. )aessensensnnennmennuemertanrneuenmennennnnnennne D 2TGRUARBS HABE External dimensions and equivalent circtiit.cvemannenannnennnne B

3.1 BRERA E LU BUERA (Test items and test conditions nmnnnnnnnnnnaninannnsnnee9 |

3.2 HERESY TEREX Failure criteria weemenenmninnenninnnsinisusnsnnnnnunmnnnmnennnnnnnnannee 1 i

4 BUBIKH Quality leVelmmnmennennennnnnnsnnimntanannnanenemnnnmumemernmenmnrmeinnnmniee | Y |

41 JEFRBAS Applied standard. eocsocnnnunnnnannennnnennnnnncnninininaniennnneal

43 RBS MUR AYE ALA Inspection items and defect criteria mnmcnnennnnnmemnennee | 1

5 FABIA Supplement..cccenesneeenmsnmernmennennnrsnstnsesinetnsnnnesenenmrmarnannsmananasennanenseenets 1 { SAFE ID Tapingnnnnnsennnnnimnenemnnmnenninnninnsnninnnnnnninmnmnmnnnmenuannnnnannss |

5.2 DAIL(Y—IL) Label (on reel) snmnmnsmmnnmnnninmnnninnnnnnninninnenianmnmnnmnenmenmnenrl® —”

5.3 SUE Packing ervrnuinnnmnsnnunninnmnennninnmmniinninninnnnnninnnmimnnmnmnnnnnnnmmmnnnne |

5.4 Se BH OSES AIR Information on environmental impact substances... IT

6 EFBEO SER Precautions wnsnnmmmnnmmmmnnmneninininnnnninnnannnsinnannnmenneeenmennees 1B

6.1 —ARRUAT EEF LOIER General handling.nemnmnnmnnimnnnnnnnnmnnmmnmnmnnnennmnnnnnne dB 6.2 IEATEATITISDUYT Soldering. weermnnnnnennnnnatessesntananinnnennnennnannnctnestinimasnetsenses 20 6.3 HEBIS OUT Cleaning mnnmnnnnennnnnnnnen LI DIGV—-IUEBEM TWEE A. : 6.4E3/AILIZDUT Recommended pick and place nozzle£5—! FYIV—INEBEN TFA. The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Model No. GM5BW9733C]A Doc. No. DG-089015B Page 3/ 21 1 34} BU RE Ratings and characteristics : 1.4 #83RAIEH Absolute maximum ratings (To=25 °C) AB aS ce % fe Bir _Parameter Symbol _| Rating _ Unit HARK re . Ip mA Forward current SREBIE BD it (Note 2) IRMESEIEIZE (Note 3) [bo] oso mas *o_ Fu Va v Reverse voltage Operating temperature Storage temperature Soldering temperature (Note 1) 1 RFHTVORMETT. Rating per one chip. (Note 2) Fa— FHI, VLAHE 01 ms Duty ratio= 1/10, Pulse width = 0.1 ms. i i (Note 3) Sy STABLE CAL ET. ORR BERL TT PSL.) ‘The operating current value follows the derating curve. (Refer to Page6) | (Note 4) FRLED 7 8/47 SU RU RRS BRIE THVET | COTS RTE 7 — AE To CEL THIET. 4 —Z BABE SOL Td, 8A THRU ASHER SIAL T BEL | The LED package is designed so that heat would be radiated from the lead The range of operating temperature is prescribed by case temperature, Case temperature (Refer to Page8, External dimensions and equivalent circuit) | (Note 5) RFR SOR RAARE, IE TC ORIALLET (BL, A TRUSS EIK ) HEAREAPOL TIL, 1GRESIRFEL. Do not exceed specified temperature range under any packing concition. : (Except when baking and soldering) Refer to Page 16, for recommended storage conditions. (Note 6) CCIE 295°C LFS BLA, BA GOW LIF OSA TEC THB T Pal \\o YO RS0RESLT PAL j Each terminal must be soldered with the soldering iron (under 30) within 3 seconds. | Solder tip temperature: under 295°C. ‘As for the reflow soldering profile, please refer to Page 20. ‘The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Model No. GMS5BW9733LA Doc. No. DG-089015B Page 4/ 21

12 BRMRUIEWISTE Electro-optical characteristics

(Te=25 °C) ETE) RS att Bir 1,= 20 mA/1 chip ‘orward voltage . (turn on each chip) HEBE(Note 2) 1 Luminous intensity v =20 mA/1 chip Chromaticity coordinates . Va= 4 V/1 chip PRR a (turn on each chip) (Note 1) SIAR CORBETT (After 20 ms drive, HREERE+01V) NEA3 RFOMMBL SYS O1V WATCH GEIRELO1V) « This is Forward voltage, when each chip tums on . (After 20 ms drive, Tolerance: -+0.1V) “The forward voltage of three chips in the product is within 0.1V (Tolerance: =+01V). (Note 2) EG&G #ti! MODEL 550 (RADIOMETER/ PHOTOMETER SYSTEM) |S CialGE. | (After 20 ms chive) (IREERE 15%) HES TSS HEY DRESILT TAL. Measured by EG&G MODEL 550 (Radiometer/ Photometer system) | (After 20 ms crive) (Tolerance: = 15%) | This is Luminous intensity, when three chips tums on simultaneously. Refer to Page5, Luminous intensity rank table. | (Note 3) FURIE F BY MCPD-2000 [=CHRIGE, (After 20 ms drive) (PUTER: x,y: £0.02) | ESL DRILSHESILT Pal. | Measured by Otsuka electronics MODEL MCPD-2000 \\ (After 20 ms crive)(Tolerance:, y: $0.02) This is Chromaticity Coordinate, when three chips tums on simultaneously. Refer to Page, Chromaticity rank table. : | (Note 4) PIAWOS HE CHY . FHECSHVEEAW Values inside parentheses are indicated only for reference, and are not guaranteed i The content of this technical literature is subject to change or revision without notice. i

SHARP CORPORATION Model No, GM5BW973301A Doc. No. DG-089015B Page 5/ 21 13 52-93% Rank table

1.3.1 SESEHRE Lineup Model

0.40 — : - 0.99 osnfinnsnafaonnnfnnns] MBEBECLuminous Intensity) 64068 fa ono yma fmm sn 4 : : H 52-7(Rank) C.D, E, F ; z f ? eee cl t MLE(Chromaticity) (0.338, 0.956) Ler neesegneten 0.36 frmseneninnemnfuaennasednenene] — 579(RanK) ey F — A Le bicolor Temperature) 008 1 WHE (Luminous Intensity) §.80ed foes ee afee 4. . 5y2(Renk) B,C, D. E i 4 i Hl APP i i Lae a a no 0.90 | LEB BIEICotr Tenmerawr) 700 aaa ET 0128 beter LO ee ee ee ne ee anaes nn nnn A es ee z a ee 0.24 powermt Ragen eg nnn] MBBEChromaiy) (0288, 0.202) fy fonnnnn nnn . . ponent pr oreo Sot Rank) a, B rs ar nn nn] tO aes) TIBOR mn mm 0.22 - 1.3.23$H5Y9 Chromaticity Rank (To=25 °C) |

39 SEE itt att |

Rank Luminous intensity Unit Condition c 55 - 6.0 F od 3 REE es ee (turn on 3 chips simultanecusy) (BH BRE Tolerance: +15%) j 1.3.3 &HE5Y2 Chromaticity Rank i (To=25 °C) | rok | ox | oy | x | y [ox [| vy [ x Ty | | (20 mA/chip, To=25 °C) (3 3-F EAE tum on 3 chips simultaneously) (RIE H BIZ Tolerance: -+0.02) 1 The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Mode! No. GMS5BW97330]A Dos. No. DG-0890158 Page 6/ 21 1.4 {E3RHHR Derating Curve ameaiemee RUIN | Forward Ourrent Derating Curve Peak Pulsed Forward Current Derating Curve 70 120 60 2 100 a) ae 0 | z 5 a BS 60 # E 30 BS Li | a NG es 4 a tt et LEA in -ELETTTLIN WELLL -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 “80 p—-RIBE Te (0) 80 yA iB To ’O) f Case Temperature Case Temperature i Fa—F4 hb — SN een | Peak Pulsed Forward Current vs. Duty Ratio Power Dissipation Derating Curve (Te=25 °C) 350 | 120 if Ci aan © os eh soo [i ft |

3 TINS ELE LAL |

0 A ° J

1/100 1/10 1 40-20 0 20 40 80 80 100120 a—Fait 30 2A Te CO) | Duty Ratio Case Temperature (Note ‘IESE, SBIR, F374 LU FP RRETL CET | “The gachs of Forward Current Derating Curve, Peak Pulsed Forward Current Derating Curve’, and ‘Peak Pulsed | Forward Current vs. Duty Ratio’ are applied to 1 chip-operation. | (Note JEFeHR EME LOF 7 RR RKTRSe TL CHET | (21 Fy FRONT OBEN ET ) Power Dissipation Derating Curve is applied to 3 chip-operations; however 1 chip has operational mit of Forward i Current Derating Curve. | ‘The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Mode! No. GM5SBW973301A Doc. No. DG-0890158 Page 7/ 21 1.5 ‘RPEBQ E2218) Characteristics Diagram (TYP.) Ase — NTE HH — TAREE | Relative Luminous intensity ve. Forward Currant Relotive Luminous Intensity vs. Case Temperature (Te=25 °C) (r= 20 mA / chip) i we EEE Lu SEE wi Se zi 1h all “tH ee ee Ot 1 10 100 40 -20 0 20 «40 60 80 = 100 MUTE ie (mA) 17~AiBIE Te (CC) Forward Current Ceue Temperature HOUR — WORE tt . IRE — 7—2iB RIE Forword Current vs, Forward Voltage Forward Voltage vs, Case Temperature (To=28 °C) (IF = 20 mA / chip) 100 -aiagn pe SE Ss a ES 3 g Pee can aa <3 ee se es ee eso aS | 2.2 27 3.2 37 -40 -20 0 20 40 60 80 100 | WBE Ve (Vv) 7 ~ZiBIE Te (°C) Forward Voltage Case Temperature ; SARAH — ITER SRB — 7A IEE i Chromaticity coordinates vs. Forward Current Chromaticity coordinates vs. Case Temperature (lp= 20 mA / chip) (lp= 20 mA / chip) | 0.01 r 7 0.02 TT TT | > E p 30mA 2 999 (I : | ne ee ee BT ee \\ 0.01 = = 0.02 = - Ax bx (Note) ' MABISAECHY (RHE CIOVELA. Characteristic data shown here is for reference purpose only. (Not guaranteed data) ‘The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GM5BW973301A | Doo. No. DG-089015B Page 9/ 21 | 3 4B #8 tt Reliability | MEO OL TIL, FEAL RET SEOLLET. : The relabilty of product shal satisfy the items listed below.

3.1 BEAR RURBAH Test items and test conditions |

({B 887K HE Confidence level: 90 %) ust MOR OR fF SRB | BEERS | rep No. Test items Test conditions Samples | Defective | (4) |

1 REY 1DIVEER | -40 °C (30 min) to +100 °C (30 min), 20 10

Temperature cycle 100 cycles BRBERTHE 2 | Temperature humidity | Tstg = +60 °C, RH = 90%, Time = 1 000 h 22 10 | storage SERABIR °C, Timez | 3 | sigh tempercture ctorage | TStE=*100°C, Time=1 000 h 22 ow temperature storage To= +40 °C, I=25 mA /chip, Time = 1 000 h | ste ROE | 1 FyFO RBC, 3 FIT ATES | steady state operating ane 22 life Rating: chip 3 chip~operations MELEE: 15 000 m/s” 7 LATE 0.5 ms, | eesaxv2am . & A: X-Y- ZA | Labial x:3 in | Acceleration: 15 000 m/s*, Pulse width: 0.5 ms, To = +25 °C } Direction: X, Y and Z, 3 trials in each direction | NRIE : 200 m/s*, } FARR: 100~2 000 Hz 1481 49) | To =+25 °C . RBA: X-Y-Z AA 7 | TARR | a4 4 20 Vibration Acceleration: 200 m/s* | Frequency: 100 to 2 000 Hz (round-trip) 4 min To = #25 °C | Direction: X, Y and Z . | 4 trials in each direction | SATIRE | com natOYIIAT AT SRIRICEY 20], 20 a eat ering | 2 trials, under the reflow condition mentioned in Page20.

0 CH mia | Hee |

(SATA IT@ EE : 245-25°C | n ‘ \\kAfE/25Y9 A: M7105/ ESR-250 1 <7 : ste " 20 ATURE | (praia selbst exit 68) rapny Solder temperature: 245:£5 °C, Solder time: 5:3 s i Solder/ Flux: M705/ ESR 250 (SENJU METAL INDUSTRY CO., LTD) 1 : After exposed to 150°C for 1 hour | ‘The content of this technical literature is subject to change or revision without notice. | Pe | a

. SHARP CORPORATION Model No. GM5SBW9733L1A Doc. No. DG-089015B Page 10/ 21 3.2 #4) Failure criteria

3.2.1 SAEAITEORIEHITE EH Solderability failure criteria

FILA TERM VOVULITISATIZAMTLYTHSIE. Accepted if solder should be applied at 90% or more of each solder judgment area. — Iq a I Al : iZ OS SI | a, | (All WZ N) - Lot — | Ban srton ofthe lead (SAAHEIELUT: . YEU BRIFEBEY £03 mm OFZ, SRP ROR (BPR Solder judgment area: Side and bottom of the lead, excluding the area within 0.3 mm from bent portion (Shaded portion in the figure) B22EOWOMEA EIA Failure criteria for the other reliability tests ERE RS RHEE Parameter Symbol Failure criteria | BRE Vp > USL X 1.2 | Forward Voltage oe [ze fe | pone | Reverse current 3 HEE \\ Iv < #00 x 0.5, Iv > #0 RNIE x 2.0 Luminous intensity v lv ¢ Initial value X 0.5, Iv > Initial value x 20 | (Note RIERA BRM RUE EOIICRLICAHS BLE» Measuring conditions shall accord with the paragraph mentioned about the | electro-optical characteristics. (Note 2) USL (SAB LERIESRLET. : USL stands for Upper Specification Limit. i ‘The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GM5BW97330]A_ . Doc, No. DG-089015B Page 11/ 21

4 RE K# Quality level

4.1 SFA Applied standard

4.2. #ENATZ Sampling inspection SSE BE AY «7K S-4 A single normal sampling plan, level S-4

43 AIBA RUZ AHI SEE Inspection items and defect criteria

° Inspection items Defect criteria Classification ABT RKBLEWVDO No radiation No light emitting

2 BLE BEOKLE CLEO :

Radiation color Different from the specified color BRA ARRBICRBEN TST EL ym | Meer defect

3 F-ELF — | SkET SLO

Taping Not conforming to the inserted direction shown in | the technical literatures Ve RU ly DHHS HEL THIELE OD | Ste - Electro-optical | ASF) in Not satisfied with specified values for V,, and ly. \\ characteristics | mentioned in Paged. | ote ME TAEBELTIVEED | ete | eReR) | External dimensions ’ esa . Not satisfied with specified dimensions in Page8. | HE 04mm ERASRM- +A Rid BAR | More than 0.4 mm in diameter of foreign | Minor defect | substances, scratches, and bubbles. IMR TROBEBA SHEN Appearance Resin burr which is over dimension tolerance. i 0.4 mm SA SAME FR | Resin crack and terminal crack, which are over | 0.4 mm | i The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Model No. GM5BW9733L]A Doo. No. DG-089015B Page 12/ 21 5 #23218 Supplements .

51 FELT Taping

5.1.1 F—FHARBU Gt ik (BAB) Shape and dimensions of tape (Ref.) Po De IPin Mork a ee wz A, —— | 1 [Was oat A 1 | 3 AICI ae ee y eB Estea TH [mm] te Parameter Symbol | _Dimension [mm] Remarks: __| lien | A ‘Length | * AEOIBO R ABER IURAB = 37 Measured at inside bottom square corner Pocket (embossed) | Width 7 CyF leete[ [| Be 15 YAR Diameter 7 i Sprockethole | Eye } | BME L05 mm/10 FoF Pitch Accumulated error +0.5 mm/ 10 pitch | F—T iD SEVARO BLETCO RYAN 175 SBRE | Sprocket hole position . Dimension from the edge of the tape to | the center of the sprocket hole | LURARO PDEBYIARD Ply |

20 RRM

URAL naan F | Pocket position Dimension at the extension of the center j F 35 lines of the pocket to the center line of | the sprocket hole H « 1B W, DN-F-F Width ' Cover tape Thickness| o4 AUF F—TF |_width ° Carrier tape Be La | F—FEMDSAN—F—-TFLOE FTE 28 COTK Overall thickness of the taping ° Including the thickness of cover and carrier tape | ‘The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Model No. GM5SBW9733C]A | | Doc. No. DG-089015B Page 13/ 21 5.1.2U—ILIBKRU TK (BAB) Shape and dimensions of reel (Ref.) ae may a pew —— Ce ce lb EE | OS | i a ae we ee WA “ —<— Hy SAR Label a oe Pa Parameter Symbol | Dimension [mm] Remarks Diameter | Fl Thickness lange | BIS YL OA A Ww HRM POBLTS | Clearance between the flanges Dimension measured close to the core | mee | External diameter | - - c 13 WT Spindle hole diameter +i Width : Depth i HAS ORR JSVIO AMES BE Oy beRRLEDAILER BBC : Materials: Described on reel i The content of this technical literature is subject to change or revision without notice. Se _ ne 2

SHARP CORPORATION Model No. GMSBW9733D]A Doc, No. DG-089015B Page 14/ 21 5.1.3F—-EL THR Taping technical specification YET ASHORE : SIS C0806 Leader tape: JIS standard C0806 compliant | sleHLA —> Feeding direction | T_O_S\\yo_ 9 ODN) OO 60 NO i Too oe) welbtoe ord | lL. 2a Me uineS YF (Zea) i Empty LEDs inside Leader (Empty) | 40mm. E 400mm ILE MIN. 40mm MIN. 400mm F—TRMIAE OAN~10N (8 =0~10°) yy igig Gover tape separation Cover Tape F F=0,1°1.0 N(8=10" or less) amend F—TIEVRE 5 mm/s Tape speed: 5 mm/s FFRUAR VP FAT — Forward Carrier Tape (D7 —PHBIP BABE: SE 30 mm LEE CT —FEBITSE, DAFF MMS CEM BYET. | ‘Tape strength against bending: The radius of curvature should be more than 30 mm. | . Fit is bent at less than 30 mm, the cover may peel off. (QF FORE 1 ILA COD FF RUE FFF OME SHVE A | Joint of the tape: No joint of cover tape or carrier tape in one reel. i (9) RCE: BEARUE 2 000 1-11 | Quantity: 2 000 pes. per reel (standard) | - QB: 90 me hn BV ORS- SED | Product mass: Approx. 30 mg (One produet/ TYP.) | @tOtH | Others: OM AAUABICET SMRO BHT EOCLET | There is no continuous empty pockets except leader and trailer part : QREIBIL, J—JABEBBO OME CHEE. The quantity of the products lacking should be less than 0.1% of total product quantity. OWEN TT SWHISSLU RAN CARAICHKC LS Products should be easily taken out. i OQMROAN—F—-FAOHRRECE, ; Products should not be attached to the cover tape when it peeled off. | The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GMSBW9733D)A : Doc. No. DG-089015B Page 15/ 21

5.2 GXIL(Y—IL) Label (on reel)

YJUTIE EAU 0-3 IK (DAV €) HUE DSI LEREILET | EIAJC-3 compliant bar codes (format e) are labeled on each reel. (2275 Bample) SHARP CORPORATION PART No. emsewo7ss0A | bine QUANTITY 2.000 - BE Product quantity CO) ° : | — EIAJ 0-3 4\\—a—F = TT 1 EIAU C~3 Bar codes LOT No, MIO8A01/ RANK O-A | ~ SUM E/ 549. (BIAJ C-3) MADE IN PHILIPPINES | tg] Production country (Py RANZOLT LOT Number) MI 08 A 01 DOO® : © ABRETIBRES (VIL 7S RED | Production plant code (to be indicated alphabetically) | @ SEF GEER? i | Year of production (the last two figures of the year) | © 4E8BA (1 Ad ABC ICED | Month of production (to be indicated alphabetically with January corresponding to A) @ 4A O1~31) Date of production (01 to 31) (SLY IBANIDWT Rerk) ' RANK O-A: O3t8SY7 | Luminous intensity rank | ND | i The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GMSBW973301A Doc. No. DG-089015B Page 16/ 21 5.3 3% Packing 5.3.1 [4H Moisture proof packing RAOMEARU REPORT Stet), PIS Wy ILS RARE TO TUET - In order to avoid the absorption of humidity while transport and storage, the devices are packed in moisture proof aluminum bags. PuEnyd aA Alri bag Lobel yuAyIL 9) Silica gel Yb (EIAU C-3811554') Reel Label (EIA C-3 compliant) 5.3.2 #E3ER EAE Recommended storage conditions SBEE:5~30 °C. iBE:70%RH IAF FRERIR: BUSBY | SR Temperature: 5 °C to 30 °C Relative humidity: 70% or less Storage period: Limited to 1 year from manufacturing date |

5.3.3 BEEHO SEA Precautions after opening aluminum bags

CBEHRIALL RORRRICT 3 ALIAS (ISTE) LT RSL. iGUBE:5~30 °C, jHBBE: 6OKRH IAT | Please be sure to give them the soldering within 3 days under the following conditions. | Temperature: 5 °C to 30 °C Relative humidity: 60% or less OMG RMMMSBLAL BAIL, R517 DARE A TROL —S— SF CRAIC | (SBBL, 532L RI FORURICREL TCR. Storage in a dry box is recommended in case that the products are not used for a long time | after opened. Or repack the reels with a desiccative by the sealer and store them under the | same conditions mentioned in 5.3.2. | QUFOBAS, BABAIS FEM OILEARE CAA 7 MBE FIOT RSL | Please perform the baking treatment under the recommended conditions in the following cases; MDE LYS —SOREDEERUBEL TORE | The blue indicator of silica gelchanges its color or fades. -BHAORBAET C3 BRBBLIS | 3 days passed after opened under the specified storage conditions. BRNRERH LN CRE SS | Products were stored out of storage condition. | (HERI) (Recommended baking conditions): | FUT IE | Products with taping | HRBE:95~100 °C, FAD: 16~24 Bef Temperature: 95 °C to 100 °C, Time: 16 to 24 hours i SLR BURSA LICH), BLEIBT) Single piece of the products (on PCB or metallic tray) | SRE: 110 °C~120 °C, BRA: 8~12 Fesfel | Temperature: 110 °C to 120 °C, Time: 8 to 12 hours ‘The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GM5BW9733C]A Doc. No. DG-089015B Page 17/ 21 AEF SME A Etat) SED TTY LIARIE CITES EY — VEO BID FE | ED SBEMBVETO CORE PA), AFL TISAI CROC LEC HEF aby, Avoid piling up the reels or applying stress to them during baking so as to protect from deformation. Please be sure to cool them to room temperature after baking. 54 388 HMBOIESARIT Information on environmental impact substances

5.4.1 RoHS #2311642 RoHS compliant product

BTU —U FINA ABAES 4 IESE TU EA CREEL IC RoHS HBAS CT (2001 484 ALMRAO ER RAARCT. ) This is a RoHS compliant product designed and manufactured in accordance with Sharp's Green Device Guidelines. (Applied to the products manufactured in and after April of 2001) 5.4.2 7-J UBC OAR Ozone Depleting Substances AMR TMC MRS BAL CHVEA. This product doesn't contain the following Ozone Depleting Substances. ABLE LAIST PRU PRE RAL TRUE A. This product doesn't have a production line whose process requires the following Ozone Depleting Substances. “BURA RA : CFCs / \\OD - DOH be, 1, I-hYOO LSU AF/LIAOAILL) Restricted substances: CFCs, Halones, CC\\,, and 1, 1, 1=Trichloroethane (Methyl chloroform) | ‘The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Model No. GMSBW9733DA Doc. No, DG-089015B Page 18/ 21 6 48FREO3ER Precautions 6.1 —ARKGE LOEB General handling ARTES SERITRSE IF MRI SIRE Nt Sra Vik, CERET PEL, Fs, LED SERIES, BRIBES Sb aM SU vik, CHEB PAL i, RRED SIM SRE CO BRISESBAIL, ARCHER SL. Any reverse voltage cannot be applied to LEDs when they are in operation or not. Design a circuit so that any fiow of reverse or forward voltage can not be applied to LEDs when they are out of operation. Please let us know if you cannot follow these design limitations of voltage. QR RADA IBAA CHEAT SHAM BVT 0 PHYT VETREA IMD ITL RRR Fel’. Since the products are very small, they are easily damaged by external stress. Please avoid applying stress to them during and after the assemblies. Oy LABEYCOS EFAORRS, BIHAO BILLY EMOBUET SCEDBVET. Color tone is subject to variation due to the afterglow of the phosphor in pulse drive. QHAELTAECAMREERLETE, AERO SBNMEYVET O COER PEL. Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result. OAM RABY OBEY, REORSPRREETERCTCEMBVET. RUM (PRL TIL, HBR RAEHEELET Static electricity or surge voltage can deteriorate product and its reliability. Please equip yourself with a wrist band or anti-electricity gloves in handling the products. Also, please make sure that all the devices and equipments must be grounded. | @AMYAL, LED RAT CHELTRRET/ V1 2OABIIRIT ACT SID, RUREEO BU — EE | BALTES. COHORT OM, LED LULO RRL, TAGE ITSL, TORDT | ARWISTA-VESA SEAMBVET . BARRE TIERS LED DSIRE IT, ARORA ABI | WPSASICMHLT TAL. 7— AIRES, BERR BO) 100 °CLURGRKTRICERRILT PEL). | Materials with high thermal conductivity are used in this product in order to allow generated heat to | escape effectively out of the product. Avoid locating other heat sources (ex. resistance, etc.) near the | products on circuit board to protect the devices from the heat damage. Please make sure that case temperature is always under 100 °C during operation, including the } self heating. OEHAICASAIT SERRMICCK, HEMMERT SHAMBVET OC, ARON AMLIC ER SECC FEL. Ete, SEEMOAL YM FICE Y MLE EAE OD IBS, Blinn BURT SEAM BVET OC, RETA REO LO RTPA. Since dust on the surface of the radiation part is hard to remove and may decrease the luminous intensity, please handle the products in a clean, non-dusty condition. Also, excessive stress to ‘the resin by collets | cof mounting equipment can damage the devices. Please verify your mounting conditions prior to use. ORES, EAMES IAL ESISERLT REL Please make sure not to apply any extemal stress to resin after mounted as well. ‘The content of this technical literature is subject to change or revision without notice.

SHARP CORPORATION Model No. GMSBW9733LA Doc. No. DG-089015B Page 19/ 21 OASLEIS. MOREE COBRA B RLS IO CHV ECA. FIORE CO CE OPE, BALI CHERE BREE ETD CEEOL TORS. . The products are not designed for the use under any of the following conditions. Please verify their performance and reliability well enough if you use under any of the following conditions; (DKS), ABR, NBL, BERETA (CI, HS, NHy, SO,, NOX EE) OBL YA CO A In a place with a lot of moisture, dew condensation, briny air, and corrosive gas (Cl, HS, NH, SO,, NOX, etc.) QRHB, BE BRP COCA | Under the direct sunlight, outdoor exposure, and in a dusty place (7K, SH, SER, SBAIE OBRAE COCR, In water, oil, medical fluid, and organic solvents OATES TORI SBA, WILEY REL TCLED IHRM Hk ABO LED ITSP LUPARIXADSBSMCEWET. CD-MOLEDICF A-VE SAS AED HSM, BM ARCEMIS LI—F 4A KERR T PSU There is the possibility of reverse voltage caused by electromotive force generated by ambient light. Connect a zener diode parallel to each LED to protect from reverse voltage in case LEDs are operated in series connection. OAR EIS SRS, ARI CEO SRAM ST OM ORES CE. Fe I RUS Sth AR OBA TEICEL TISREET SEO CEBVEL AW BRU CRE RARE AIS, MARBO Lal AICRLET. Guarantee covers the compliance to the quality standards mentioned in the Specifications; however it does-not cover the compatibility with application in the end-use, including assembly and usage environment. In case any quality problems occurred in the application of end-use, details will be separately discussed and determined between the parties hereto. The content of this technical literature is subject to change or revision without notice. |

SHARP CORPORATION Model No. GM5BW9733LA Doc. No. DG-089015B Page 20/ 21

6.2 IkATERITICOLYT Soldering

6.2.1 Y7O— Reflow

Oy BEM PERRET OD? 1 LOREAL S HILT AT BSL. fl PERE O DPA NOREEN CHITCH, BHO RY BAYBILKLY/ S97 —S IAD IE. Hyp ABORESEBRT SBR MGVETO T, MAU IO RBICEU CTS AERO LCRA PAU. Package temperature at reflow soldering is defined in the Fig. below. However, even when it is under the profile condition, extemal stress can damage the intemal packages. Please test your reflow method and verify the solderability before use. QUID-SARELETGIBA, 1 EIBRTACESEIE PIN MUBS TOT PEL (YIO-ECOREL, FSA YIAREEERLET ) In case of performing reflow process twice; the second reflow process should be given as soon as possible after the first one. (Storage in a dry box after the first reflow is recommended) QBMAINE, BEA MEN CHET, RAT ASE SC BAAICSEENETF LOD EREMREL, SANT OMICMBMECSCEMHVET. REBAR BIT HEB EEE PASC RPSL. The electrode parts have silver plated on. I they are exposed to the air with corrosive gas etc, the plated surface would be eroded, which may affect soldering, Please pay attention to the storage condition, and avoid long-term storage. @BE7OIF TIL Temperature Profile

260 MAX) nen °

3 200 femmes | Pp | | i 60 to 120s Let ee : : "5s (MAX) | 1 to 4°C/s 25 | Time [second] | HEEBET OI T+ LERRLCHVET A, BO ME EO &, C7 EIHEK, YOO | OPAMLES, HRMBEDRISHROETO SPAT SLELBHOLESF. ELVYIO | HERO HHRUBHOKES, LIP IMEICEY, FIN(ANORO 1 Y ICES FT | REMDVET OTC, GOMMESR LET. Hie, BRIO RTC In order to secure the product reliability, it is recommended to control the peak temperature and | temperature gradient. Moreover, since the thermal conduction to the products depends on the specification of the reflow machine, and the size and layout of the PCBs please test your solder | conditions carefully. This is the Nitrogen reflow-ready model. | The content of this technical literature is subject to change or revision without notice. i

SHARP CORPORATION Model No. GM5BW9733C]A Doc. No. DG-089015B Page 21/ 21 OBE aL Recommended solder pad design TRS SV IO— BH LATE —ARSLUBRH SI CKLY ISATEITHEA ER FOCEMBVET OT, REBREHCTCHAT HBO ECE FEL. Solderability depends on the reflow conditions, solder paste, and materials of the PCBs etc. Please test and verify the solderability under the actual solder method. | Rip RE Center of the product l = { ~ || i/ [| © eee een iar i “ i 1.5 1.5 (Unit: mm) 4.5 ©VI0-KOLERET YS Precautions for PCB backside dip process BECCUIO—HORRET 197 T OBES, REBOOT YS HORRUERO RYBICEY, 1 'y7-DAROREAERRT SBN MHVET OT, HALO SEA IST, FESS CREEL VicTeU ick, CRAP EL). Eh, VIET RIS TH SEUBPD | (RET 1 yFWUBETLOT REL. CHOI RET 19 T Rik, SHRO VIO | HEEMULET. i Please verify your conditions carefully in giving the dip process on the backside of the PCBs, | since the warped boards caused by heat and heat itself affect the inside of the package. It is { recommended to give the reflow process after dip process. Though it is also available to give | the reflow process before the dip process, the interval of the two processes should be as short | as possible. |

6.3 H#HIDLYT Cleaning |

POH AY Sy RUEBEN SBAMCEWET OT, BRAISED EAE EBL, HEMSVEAELY TREY, Avoid cleaning the PCBs, since packages and resins would be eroded by cleaning Please use the soldering paste without need of cleaning. : EE BEMTIAYT RAL, : Avoid ultrasonic cleaning. | ‘The content of this technical literature is subject to change or revision without notice. |

Product Information

GM5BW97330A specifications and overview.

Summary

LED DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP

Description

LED DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP

Source title GM5BW97330A Datasheet(PDF) - Sharp Corporation

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