GFCSBPM2.24 AMSCO | Alldatasheet

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Technical content

GF CSBPM2.24 DATASHEETDATASHEET 1 | Version 1.1 | 2023-03-20 www.osram-os.com GF CSBPM2.24 Datasheet Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved

GF CSBPM2.24 DATASHEETDATASHEET 2 | Version 1.1 | 2023-03-20 OSLON® Square GF CSBPM2.24 A new member of the family, OSLON® Square Far Red has a unique innovative radiation pattern to illuminate plants evenly for uniform growth while reducing number of luminaires and lowering overall cost. Additionally, this high-power LED provides excellent reliability, long lifetime and low thermal resistance in a compact footprint.

Applications

  • Agriculture & Horticulture - Entertainment - Indoor Lighting - Outdoor & Industrial Lighting

Features

  • Package: SMT ceramic package with silicone lens - Typ. Radiation: 150° - ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) - Radiant Flux: typ. 430 mW - Radiant Efficiency: typ. 63% - Photon Flux: typ. 2.60 umol/s - Photon Flux Efficacy: typ. 3.81 umol/J

GF CSBPM2.24 DATASHEETDATASHEET 3 | Version 1.1 | 2023-03-20

Ordering Information

Type Total radiant flux 1) Ordering Code IF = 350 mA ΦE GF CSBPM2.24-TNUJ-1-1 380 ... 485 mW Q65113A5716

GF CSBPM2.24 DATASHEETDATASHEET 4 | Version 1.1 | 2023-03-20 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 120 °C Storage Temperature Tstg min. max. -40 °C 120 °C Junction Temperature Tj max. 125 °C Forward current IF min. max. 100 mA 1000 mA Surge Current t ≤ 10 µs; D = 0.005 ; TJ = 25 °C IFS max. 2000 mA Reverse voltage 2) VR Not designed for reverse operation ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) VESD 8 kV

GF CSBPM2.24 DATASHEETDATASHEET 5 | Version 1.1 | 2023-03-20 Characteristics IF = 350 mA; TJ = 25 °C Parameter Symbol Values Peak Wavelength λpeak typ. 730 nm Centroid Wavelength 3) IF = 350 mA λcentroid min. typ. max. 710 nm 727 nm 740 nm Spectral Bandwidth at 50% Irel,max ∆λ typ. 30 nm Viewing angle at 50% IV 2φ typ. 135 ° Forward Voltage 4) IF = 350 mA VF min. typ. max. 1.80 V 1.95 V 2.10 V Reverse current 2) IR Not designed for reverse operation Electrical thermal resistance junction/solderpoint with efficiency ηe = 63 % RthJS elec. typ. 2.7 K / W

GF CSBPM2.24 DATASHEETDATASHEET 6 | Version 1.1 | 2023-03-20 Brightness Groups Group Total radiant flux 1) Total radiant flux 1) IF = 350 mA IF = 350 mA ΦE ΦE Φp Φp Φp,b Φp,b TN 380 mW 415 mW 0.180 µmol/s 0.196 µmol/s 0.28 µmol/J 2.30 µmol/s 2.51 µmol/s 3.52 µmol/J TO 415 mW 450 mW 0.196 µmol/s 0.213 µmol/s 0.30 µmol/J 2.51 µmol/s 2.72 µmol/s 3.83 µmol/J UJ 450 mW 485 mW 0.213 µmol/s 0.229 µmol/s 0.32 µmol/J 2.72 µmol/s 2.93 µmol/s 4.14 µmol/J Note: [*] Photosynthetic Photon Flux includes wavelengths between 400 and 700 nm Note: [**] Photon Flux includes wavelengths between 280 and 800 nm Note: PPF and PF values are for reference only Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) IF = 350 mA IF = 350 mA min. max. VF VF E1 1.80 V 1.90 V E2 1.90 V 2.00 V F1 2.00 V 2.10 V Centroid Wavelength Group Centroid Wavelength 3) Centroid Wavelength 3) IF = 350 mA IF = 350 mA min. max. λcentroid λcentroid 1 710 nm 740 nm

GF CSBPM2.24 DATASHEETDATASHEET 7 | Version 1.1 | 2023-03-20 Group Name on Label Example: TN-1-E1 Brightness Wavelength Forward Voltage TN 1 E1

GF CSBPM2.24 DATASHEETDATASHEET 8 | Version 1.1 | 2023-03-20 Relative Spectral Emission 5) Irel = f (λ); IF = 350 mA; TJ = 25 °C GF CSBPM2.24 350 400 450 500 550 600 6507 00 7508 00 λ /n m 0,0 0,2 0,4 0,6 0,8 1,0Irel :V λ :f ar red Radiation Characteristics 5) Irel = f (ϕ); TJ = 25 °C GF CSBPM2.24 -100° -90° -80° -70° -60° -50° -40° -30° ϕ /° 0,0 0,2 0,4 0,6 0,8 1,0 Irel

GF CSBPM2.24 DATASHEETDATASHEET 9 | Version 1.1 | 2023-03-20 Forward current 5) IF = f(VF); TJ = 25 °C GF CSBPM2.24 VF /V 100 200 400 600 800 1000IF /m A Relative Radiant Power 5), 6) ΦE/ΦE(350 mA) = f(IF); TJ = 25 °C GF CSBPM2.24 100 400 600 800 1000 IF /m A 0,0 0,5 1,0 1,5 2,0 2,5 Φe Φe(350mA)

GF CSBPM2.24 DATASHEETDATASHEET 10 | Version 1.1 | 2023-03-20 Forward Voltage 5) ΔVF = VF - VF(25 °C) = f(Tj); IF = 350 mA GF CSBPM2.24 -40- 20 02 04 06 08 0 100 120 Tj /° C -0,3 -0,2 -0,1 0,0 0,1 0,2 0,3∆VF /V Relative Radiant Power 5) ΦE/ΦE(25 °C) = f(Tj); IF = 350 mA GF CSBPM2.24 -40- 20 02 04 06 08 0 100 120 Tj /° C 0,0 0,2 0,4 0,6 0,8 1,0 1,2Φe Φe (25°C) Centroid Wavelength 5) Δλcentr = λcentr - λcentr(25 °C) = f(Tj); IF = 350 mA GF CSBPM2.24 -40- 20 02 04 06 08 0 100 120 Tj /° C -20 -10 20∆λ centr /n m

GF CSBPM2.24 DATASHEETDATASHEET 11 | Version 1.1 | 2023-03-20 Max. Permissible Forward Current IF = f(T) 02 04 06 08 0 100 120 Ts /° C 100 200 300 400 500 600 700 800 900 1000 1100IF /m A GF CSBPM2.24 Do not use below 100 mA

GF CSBPM2.24 DATASHEETDATASHEET 12 | Version 1.1 | 2023-03-20 Dimensional Drawing 7) Further Information: Approximate Weight: 27.0 mg Package marking: Anode ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.

GF CSBPM2.24 DATASHEETDATASHEET 13 | Version 1.1 | 2023-03-20 Recommended Solder Pad 7) VROGHUVWHQFLOVROGHUUHVLVW&XDUHDIRRWSULQW For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further informa- tion can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”.

GF CSBPM2.24 DATASHEETDATASHEET 14 | Version 1.1 | 2023-03-20 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

GF CSBPM2.24 DATASHEETDATASHEET 15 | Version 1.1 | 2023-03-20 Taping 7)

GF CSBPM2.24 DATASHEETDATASHEET 16 | Version 1.1 | 2023-03-20 Tape and Reel 8) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 3000

GF CSBPM2.24 DATASHEETDATASHEET 17 | Version 1.1 | 2023-03-20 Barcode-Product-Label (BPL) Dry Packing Process and Materials 7) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

GF CSBPM2.24 DATASHEETDATASHEET 18 | Version 1.1 | 2023-03-20 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class low risk (exposure time 100 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy- ance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. This device is designed for specific/recommended applications only. Please consult OSRAM Opto Semiconductors Sales Staff in advance for detailed information on other non-recommended applications (e.g. automotive). Change management for this component is aligned with the requirements of the lighting market. For further application related information please visit www.osram-os.com/appnotes

GF CSBPM2.24 DATASHEETDATASHEET 19 | Version 1.1 | 2023-03-20 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.

GF CSBPM2.24 DATASHEETDATASHEET 20 | Version 1.1 | 2023-03-20 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 10 ms, with a tolerance of +/- 7%. 2) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause mi- gration and damage of the device. 3) Wavelength: The wavelength is measured at a current pulse of typically 10 ms, with a tolerance of ± 0.5 nm. 4) Forward Voltage: The Forward voltage is measured during a current pulse duration of typically 1 ms with a tolerance of ± 0.05V . 5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 6) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 8) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

GF CSBPM2.24 DATASHEETDATASHEET 21 | Version 1.1 | 2023-03-20

Revision History

1.0 2021-09-23 Initial Version 1.1 2023-03-20 Brightness Groups Forward Voltage Groups Characteristics

GF CSBPM2.24 DATASHEETDATASHEET 22 | Version 1.1 | 2023-03-20 Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved