FX202 CMLMICRO | Alldatasheet
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Technical content
a9 CONSUMER MICROCIRCUITS LTD FX202 is an Obsolete Product - For Information Only - PRODUCT INFORMATION PUBLICATION- D/FX'03-K/1 JANUARY 1982 - FX202C-K ToT Hi FX202Z-K Pa ay i py FX103-K | 1 tou i 2 ypu mich i & ry _._ ie FX403:K ee = FX503Z-K E ase AAAAARAAA
FEATURES
| SMALL PHYSICAL size * WIDE TEMPERATURE RANGE * C SUFFIX DEVICES TUNED TO CCIR TONESET * HERMETICALLY SEALED PACKAGE * Z SUFFIX DEVICES TUNED TO ZVEI TONESET * LOW POWER CMOS PROCESS GENERAL DESCRIPTION FX003 PRODUCTS PACKAGED IN LEADLESS CHIP CARRIERS. Products from the FX'03 range are available packaged in leadless chip carriers. This form of packaging can result in a greatly increased packing density. The ceramic leadless chip carrier provides a high level of package hermeticity and wide operating and storage temperature ranges.
DESCRIPTION
The circuit function and electrical specification of leadless chip carrier products are identical to the dual-in-line product information with the following exceptions: a) The FX003 tone decoder comprises two discrete LSI chips which are each packaged in a chip carrier. Both packages are required for a complete tone decoder, and are available to decode the CCIR or the ZVEI range of signalling tones. The product codes for a CCIR decoder are an FX102-K together with an FX202QC-K and for a ZVEI device are FX102-K and FX202QZ-K. The inter- connection and external components of the two chip carriers are given in diagram 2. The supply current taken by the FX102 and FX202 combined is typically 1200A at 5 volts supply. b) All chip carrier products are specified for operation over supply voltage range 4.5V to 6V. INTERCONNECTION OF FX102-K AND Fx202K AND EXTERNAL COMPONENTS 2n2 oD(+vE SUPPLY) a far ol 2 L sea pratense ue pL sm eamee yada or Es raw at Heil ros cm, ‘47pF| ll 47pF 5-000F 10nF vss(-Ve SuPPLr} WO (rie to vod 1f not required. CHIP CARRIERS VIENED FROM ABOVE TONG PAD (UNDERSIDE) DENOTES PAD 1. Methods of Attachment. Leadless chip carriers may be attached by reflow soldering techniques. A typical reflow temperature would be 210°C and the molten solder tends to align the chip carrier over the solder pads on the substrate. The ideal substrate material is ceramic because it has a coefficient of linear expansion very closely matched to that of the carrier. Epoxy glass printed circuit boards can be used but the unmatched expansion coefficients lead to strain on the solder joints during cooling. Handling Considerations. Care should be taken when handling any CMOS product to minimise the possibility of the static electrical discharge into the input pins. VDD (+VE SUPPLY) typica INPUT O {| -- typ 1KQ input NOMINAL 7\\ — circuit VSS(-VE SUPPLY) During storage the devices should be protected from static charges by packaging in conductive foam or storage in metal trays.
paD| —FX102-K exznae | FX103-K FX313-K FX403-K becom CML DOES NOT ASSUME ANY RESPONSIBILITY FOR THE USE OF ANY CIRCUITRY DESCRIBED. NO CIRCUIT PATENT LICENCES ARE IMPLIED AND CML RESERVES THE RIGHT AT ANY TIME WITHOUT NOTICE TO CHANGE SAID CIRCUITRY.