FSUSB11MTCX

FSUSB11_06 FAIRCHILD | Alldatasheet

Document overview

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Technical content

Features

■ Space saving MicroPak™ Pb-free packaging (1.6 x 2.1mm) ■ USB 1.1 signal switching compliant ■ -3db bandwidth: >350MHz ■ Maximum 1.15Ω RON at 4.5V VCC and 4Ω for 2.7V supply ■ 0.3Ω maximum RON flatness for +5V supply ■ Broad VCC operating range: 1.65V to 5.5V ■ Fast turn-on and turn-off time ■ Break-before-make enable circuitry ■ Over-voltage tolerant, TTL-compatible control input

Applications

■ Cell Phone ■ PDS ■ Digital Camera ■ Notebook

Description

The FSUSB11 is a high-performance, dual Single-Pole Double-Throw (SPDT) switch designed for switching USB 1.1 signals. The device features ultra-low on resis- tance (R ON) of 1.15Ω maximum at 4.5V VCC and 4.3Ω at 2.7V supply. High bandwidth and ultra low (R ON) make this switch able to pass both USB low- and full-speed signal with minimum signal distortion. The device is fabri- cated with sub-micron CMOS technology to achieve fast switching speeds and designed for break-before-make operation. The select input is TTL-level compatible.

Ordering Information

Pb-Free package per JEDEC J-STD-020B. Block Diagram MicroPak™ is a trademark of Fairchild Semiconductor Corporation. Part Number Package Top Mark Pb- Free Packing Method FSUSB11L10X 10-Lead MicroPak, 1.6 x 2. 1mm ET Yes 5K units on tape and reel FSUSB11MTCX 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide FSUSB11 Yes 2500 units on tape andreel FSUSB11MUX (Preliminary) 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm FSUSB11 Yes 3K units on tape and reel

FSUSB11 Low-Power Full-Speed USB (12Mbps) Switch © 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.2 3 Absolute Maximum Ratings The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. Th e “Recommended Operating Conditions” table defines the conditions for actual device operation. Notes: 1. The input and output negative voltag e ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions Notes: 2. Unused inputs must be held HIGH or LOW. They may not float. Symbol Parameter Min. Max. Unit VCC Supply Voltage(1) -0.5 +6.0 V VS Switch Voltage(1) -0.5 V CC to +0.5 V VIN Input Voltage -0.5 +6.0 V IIK Input Diode Current -50 mA ISW Switch Current 200 mA ISWPEAK Peak Switch Current (Pulsed at 1ms Duration,<10% Duty Cycle) 400 TSTG Storage Temperature Range -65 +150 °C TJ Maximum Junction Temperature +150 °C TL Lead Temperature (Soldering, 10 seconds) +260 °C ESD Human Body Model 8000 V Symbol Parameter Min. Max. Unit VCC Supply Voltage 1.65 5.50 V VIN Control Input Voltage(2) 0V CC VCC VSW Switch Input Voltage 0 V CC VCC TA Operating Temperature -40 +85 °C

FSUSB11 Low-Power Full-Speed USB (12Mbps) Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.2 4 All typical values are at 25°C unless otherwise specified. Notes: 3. On resistance is determined by the voltage drop between D and D n pins at the indicated current through the switch. 4. ΔRON = RONmax - RONmin measured at identical VCC, temperature, and voltage. 5. Flatness is defined as the difference between the maximum and minimum value of on resistance over the specified range of conditions. Symbol Parameter Conditions VCC TA = + 25 C° TA= -40 °C to +85 C° VIH Input Voltage High 2.7 to 3.6 2.0 V 4.5 to 5.5 2.4 VIL Input Voltage Low 2.7 to 3.6 0.6 V 4.5 to 5.5 0.8 IIN Control Input Leakage V IN = 0V to VCC µA INO(OFF), INC(OFF) Off-Leakage Current of Port D 1 and D2 A = 1V, 4.5V, B0 or B1 = 1V, 4.5V 5.5 -50.0 50.0 -100 100 nA IA(ON) On-Leakage Current of Port D A = 1V, 4.5V,B0 or B1 = 1V, 4.5V or Floating 5.5 50.0 50.0 -100 100 nA RON Switch On Resistance MicroPak(3) IOUT = 100mA, D1 or D2 = 1.5V 2.7 2.6 4.0 4.3 Ω IOUT = 100 mA, D1 or D2 = 3.5V 4.50 0.95 1.15 1.30 Switch On Resistance TSSOP(3) IOUT = 100mA, D1 or D2 = 1.5V 2.7 2.8 4.5 IOUT = 100mA, D1 or D2 = 3.5V 4.5 1.5 3.0 ΔRON On Resistance Matching Between Channels MicroPak(4) IOUT = 100mA, D1 or D2 = 3.5V 4.50 0.06 0.12 0.15 Ω On Resistance Matching Between Channels TSSOP (4) IOUT = 100mA, D1 or D2 = 3.5V 4.50 0.07 0.30 RFLAT(ON) On Resistance Flatness(5) IOUT = 100mA, D1 or D2 = 0V, 0.75V, 1.5V 2.7 1.4 Ω IOUT = 100mA, B0 or B1 = 0V, 1V, 2V 4.5 0.2 0.3 0.4 ICC Quiescent Supply Current VIN = 0V or VCC, IOUT = 0V 3.6 0.1 0.5 1.0 µA 5.5 0.1 0.5 1.0

FSUSB11 Low-Power Full-Speed USB (12Mbps) Switch © 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.2 5 All typical values are at 25°C unless otherwise specified. USB Related AC Electrical Characteristics All typical values are at 25°C unless otherwise specified. Capacitance Symbol Parameter Conditions VCC TA = +25 C° TA= -40 C° to +85 C° Units Figure tON Turn-ON Time D1 or D2 = 1.5V, RL = 50Ω, CL = 35 pF 2.7 to 3.6 50.0 60.0 ns Figure 5 D1 or D2 = 3.0V, RL = 50Ω, CL = 35 pF 4.5 to 5.5 35.0 40.0 tOFF Turn-OFF Time D1 or D2 = 1.5V, RL = 50Ω, CL = 35 pF 2.7 to 3.6 20.0 30.0 ns Figure 5 D1 or D2 = 3.0V, RL = 50Ω, CL = 35 pF 4.5 to 5.5 15.0 20.0 tBBM Break-Before-Make Time D1 or D2 = 1.5V, RL = 50Ω, CL = 35 pF 2.7 to 3.6 1.0 ns Figure 6 D1 or D2 = 3.0V, RL = 50Ω, CL = 35 pF 4.5 to 5.5 20.0 1.0 Q Charge Injection CL = 1.0 nF, VGEN = 0V, 2.7 to 3.6 20.0 pC Figure 8 RGEN = 0Ω 4.5 to 5.5 10.0 OIRR OFF-Isolation f = 1MHz, R L = 50Ω 2.7 to 3.6 -70.0 dB Figure 7 4.5 to 5.5 -70.0 Xtalk Crosstalk f = 1MHz, R L = 50Ω 2.7 to 3.6 -75.0 dB Figure 7 4.5 to 5.5 -75.0 BW -3db Bandwidth R L = 50Ω 2.7 to 3.6 350 MHz Figure 10 4.5 to 5.5 350 Symbol Parameter Conditions VCC TA = +25° C Units Figure ( V ) M i n .T y p .M i n . N u m b e r tSKEW Skew RS = 39, CL = 50 pF, tR = tF = 12ns at 12Mbps 2.7 to 3.6 0.15 ns Figure 11 4.5 to 5.5 0.15 tM Rising/Fall Time Mis- match (Duty Cycle = 50%) 2.7 to 3.6 10.0 % Figure 12 4.5 to 5.5 10.0 tJ Total Jitter RS = 39, CL = 50 pF, tR = tF = 12ns at 12Mbps (PRBS = 215 1) 2.7 to 3.6 1.7 ns Figure 11 4.5 to 5.5 1.6 Symbol Parameter Conditions VCC TA = +25 C° Units Figure (V) Min. Typ. Max. Number CIN Control Pin Input Capacitance f = 1MHz 0.0 3.5 pF Figure 9 COFF Dn Port OFF Capacitance f = 1MHz 4.5 12.0 pF Figure 9 CON D Port ON Capacitance f = 1MHz 4.5 40.0 pF Figure 9

FSUSB11 Low-Power Full-Speed USB (12Mbps) Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.2 8 Tape and Reel Specification Tape Format for Micropak 10 Reel Dimensions Dimensions are in inches (millimeters) unless otherwise noted. Package Tape Number Cavity Cover Tape Designator Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed L10X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed Tape Size A B C D N W1 W2 W3 (8mm)

FSUSB11 Low-Power Full-Speed USB (12Mbps) Switch © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.2 9 Tape Dimensions for MSOP Dimensions are in millimeters (inches) unless otherwise specified. Reel Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified. T a p e S i z e ABCDN W 1 W 2 W 3 (12mm) (330) 0.059 (1.5) 0.512 (13) 0.795 (20.2) 7.008 (178) 0.448 (12.4) 0.724 (18.4) 0.468-0.606 (11.9 -15.4)

Dimensions are in millimeters (inches) unless otherwise noted. Figure 13. Pb-Free 10-Lead MicroPak, 1.6 x 2.1mm

Dimensions are in millimeters (inches) unless otherwise noted. Figure 14. 14-Lead Thin-Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Dimensions are in millimeters (inches) unless otherwise noted. Figure 15. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm

FSUSB11 Low-Power Full-Speed USB (12Mbps) Switch © 2005 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB11 Rev. 1.0.2 13