FR2001H-D

Online Datasheet

Read FR2001H-D online.

FR2001H-D SEOUL | Alldatasheet

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 11

Technical content

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com Specification FR2001H-D CUSTOMER ApprovalApprovalDrawn SSC

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com

Applications

Electric appliance
O ther decoration lighting

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com 1. Absolute maximum ratings (Ta=25℃) ℃-40 ~ 100Tstg.Storage Temperature V5VRReverse Voltage mW80PdPower Dissipation ℃-40 ~ 100Topr.Operation Temperature mA50IFM *1Peak Forward Current mA30IFForward Current UnitValueSymbolParameter *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10. 2. Electro-Optical Characteristics (Ta=25℃) Min -m cd-530IF=20 ㎃IVLuminous Intensity*2 lm-1.5IF=20 ㎃ΦLuminous Flux 2.6 Max 135 625 2.0 Typ ˚IF=20 ㎃2θ1/2Viewing Angle*3 nmIF=20 ㎃λdWavelength VIF=20 ㎃VFForward Voltage nmIF=20 ㎃ΔλSpectral Bandwidth ㎂VR=5VIRReverse Current UnitConditionSymbolParameter *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com 3.Outline Dimension ( Tolerance: ±0.1, Unit: mm ) [TOP VIEW] [SIDE VIEW] [BOTTOM VIEW] [INNER CIRCUIT] - Recommended Soldering Design * MATERIALS Au Plating Copper AlloyElectrodes Epoxy ResinEncapsulating Resin Lead FramePackage MATERIALSPARTS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com 4. Electro-Optical characteristic Diagram Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 100 Forward Current IF(mA) Forward Voltage VF(V) Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 0 5 10 15 20 25 30 35 120 160 200 Luminous Intensity IV(%) Forward Current IF(mA)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com Ambient Temperature vs. Allowable Forward Current (per die) -60 -40 -20 0 20 40 60 80 100 120 Forward current IF(mA) Ambient temperature Ta(℃ ) Radiation Diagram (Ta=25 OC ) 0.0 0.2 0.4 0.6 0.8 1.0 120 150 1800.0

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com 5. Packing (1) Quantity:2,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Tolerance: ±0.2, Unit: ㎜ 180 ±0.2 Label 2 ±0.2 60 +0.2 11.4 9 ±0.3 8.0±0.1 Direction Marking (2.75) 0.85±0.1 1.5 +0.1 4.0±0.1 3.5±0.05 1.75±0.1 0.25±0.05

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com

Reel Packing Structure 제품명 SSC-FR2001H-D 수량 : 2000 SIZE(mm)TYPE 142 c CHIP LED Q'YT : 20,000EA PART : SSC-FR2001H-D CODE : DATE : LOT NO : SEOUL SEMICONDUCTOR CO.,LTD 7inch 245 a 220 b Aluminum Vinyl Bag Outer Box Reel *Material: Paper(SW3B(B)) 제품명 SSC-FR2001H-D 수량 : 2000 Acriche Semiconductor EcoLight a RoHS b MADE IN KOREATUV c

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com 6. Soldering 10 sec. Max. Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder 10 sec. Max. Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Rev. 00 Rev. 00 September 2008September 2008 www.ZLED.com www.ZLED.com 7. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.

Product Information

FR2001H-D specifications and overview.

Summary

Surface-mounted chip LED device

Description

Surface-mounted chip LED device

Source title FR2001H-D Datasheet(PDF) - Seoul Semiconductor

Related Parts

More parts from the same family.

Browse manufacturer