2SI0400T2xxC POWERINT | Alldatasheet

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Technical content

www.power.com June 2019 This Product is Covered by Patents and/or Pending Patent Applications. SCALE-iFlex™ Family 2SI0400T2xxC and 2SM0120D2xxC Gate Driver for 1.2 kV to 3.3 kV Half-Bridge Power Modules Electrical I/O Interface Product Highlights Highly Integrated, Compact Footprint

  • Ready-to-use gate driver solution optimized for power modules from 1200 V up to 3300 V blocking voltage
  • Supporting IGBT, Hybrid (Si-IGBT/SiC-Diode) and Full-SiC MOSFET power modules
  • Dual channel gate driver
  • Electrical primary-side interface with reinforced isolation
  • Optimized for paralleling of up to 4 power modules
  • Wide input supply voltage range +15 V to +48 V
  • -40 °C to +85 °C operating ambient temperature Protection and Safety Features
  • Un dervoltage lock-out (UVLO) protection for primary-side (low voltage side) and secondary-side (high voltage side)
  • Short-circuit protection with Advanced Soft Shut Down (ASSD)
  • NTC temperature sensing with reinforced isolated digital output signal (PWM-coded)
  • DC-link voltage measurement with reinforced isolated digital output signal (PWM-coded)
  • Applied double sided conformal coating Full Safety and Regulatory Compliance
  • 100% production partial discharge test
  • 100% production HIPOT compliance testing
  • Reinforced insulation in accordance with EN 50124-1 and IEC 61800-5-1

Applications

  • Wind and solar power
  • Traction inverter
  • Industrial drives
  • Other industrial applications

Description

The SCALE-iFlex gate driver family consists of a central Isolated Master Control (IMC) and Module Adapted Gate Driver (MAG) together with a cable set. The IMC is designed for operation of power modules with a blocking voltage of up to 3300 V, whereas the MAGs are available in various variants optimized for different power modules of different suppliers and chip technologies in the voltage classes of 3300 V. SCALE-iFlex enables easy paralleling of up to four power modules1 providing high flexibility and system scalability with minimum development effort. Integrated NTC temperature and DC-link voltage signals with reinforced isolation are available as substitution for discrete system level sensors. Notes: 1. For paralleling more than four power modules, please contact Power Integrations technical support. F igure 1. SCALE-iFlex IMC (left) and MAG (right) Advanced Information

www.power.com SCALE-iFlex Product Portfolio IMC Product Voltage Class Gate Power 2SI0400T2A1C-33 3300 V 2x 4W Product Portfolio MAG Product Power Module Technology Voltage Class Current Class Package Power Module Supplier 2SM0120D2C0C-FMF750DC-66A SiC-MOSFET 3300 V 750 A LV100 Mitsubishi Product Portfolio SCALE-iFlex Cable Product From-To Connector Pins Length IMCC61-050-1 IMC to MAG Molex connector, Milli-Grid 6 500 mm IMCC81-050-1 IMC to MAG Molex connector, Milli-Grid 8 500 mm MAGC61-015-1 MAG to MAG Molex connector, Milli-Grid 6 150 mm MAGC81-015-1 MAG to MAG Molex connector, Milli-Grid 8 150 mm Notes: --

Figure 2. IMC Interfaces. IMC to MAG molex connector for gate driver channel 1. IMC to MAG molex connector for gate driver channel 2. IMC to external system controller (D-Sub connector). potential. All primary-side signals refer to these pins. supplying the SCALE-iFlex gate driver. for supplying the SCALE-iFlex gate driver. This pin is the command input for channel 2. This pin is the status output for channel 2. This pin is the command input for channel 1. This pin is the status output for channel 1. connected power modules reported). absence of VV15 the indicator is OFF. condition the indicator is ON.

Figure 3. MAG Interfaces (2SM0120D2C0C shown). power modules are paralleled. power modules are paralleled. (connector X1) in case power modules are paralleled. (connector X2) in case power modules are paralleled. Gate contact of channel 1 switch. Auxiliary emitter (source) contact of channel 1 switch. Auxiliary collector (drain) contact of channel 1 switch. Gate contact of channel 2 switch. Auxiliary emitter (source) contact of channel 2 switch. NTC temperature sensor contact. White optical indicator for status feedback signal of channel 1. During a fault condition the indicator is OFF. White optical indicator for status feedback signal of channel 2. During a fault condition the indicator is OFF.

www.power.com SCALE-iFlex (Electrical Interface) Under Voltage Monitoring The supply voltages are closely monitored on the IMC as well as on each MAG. In case of an under voltage condition (UVLO) a failure signal will be provided on the status output of the IMC. If the UVLO is present on the primary- side supply, both status output signals will be set to GND and all gate driver channels will be turned-off synchronously. In case of an UVLO on the secondary-side of the IMC or on any MAG, the status signal of the respective channel will be set to GND and the corresponding power semiconductor(s) will be turned-off. Note: An UVLO event on a MAG will only turn-off the affected MAG immediately. All other paralleled power semiconductors of the related channel will be turned-off after the delay tSOx. The red optical indicator F at the IMC will be activated when the failure condition occurs and remains ON until the next rising edge of an input signal is received, provided the failure condition is no longer present. IMC Inputs (Primary-Side X300) The input logic of IN1 and IN2 is designed to work with 15 V logic levels to provide sufficient signal/noise ratio. Both inputs have positive logic and are edge triggered. Gate driver signals are transferred from the IN1 and IN2 pins to the gate of the attached MAG(s) with a propagation delay of tP(LH) for the turn-on and tP(HL) for the turn-off commands. IMC Outputs (Primary-Side X300) The IMC provides three different output signals:  Status feedback SOx (pins 21 and 23)  Digital NTC temperature signal TPM (pin 24)  Digital DC-link voltage signal DLK (pin 25) The status feedback signal stays at V15 under no-fault condition. In case of a fault, e.g. detected short-circuit of the driven power module or an under voltage lock-out condition (UVLO) on primary- and/or secondary-side, the status feedback is set to GND potential for a duration of tblk. During this time no gate signals will be transmitted to the respective gate driver channel. Each MAG is sensing the NTC temperature of the attached power module. This signal is forwarded to the IMC and can be accessed at terminal TPM. If more than one MAG is used, only the signal of the highest NTC temperature is considered. The temperature signal at terminal TPM is pulse-width modulated with a fixed carrier frequency fTPM. The larger the duty cycle the larger the NTC temperature. To eliminate unintended noise overlapping the temperature signal between MAG and IMC a filter is implemented in the read-out circuitry. The filter time is given with tTPM. Note: The NTC temperature does not represent the junction temperature of any of the semiconductor dies within the power module. Instead, it is a good indication of the baseplate temperature of the power module. The DC-link voltage is measured at the first MAG, i.e. the one which is directly connected to the IMC. The measured signal is forwarded to the IMC and can be accessed at terminal DLK. To eliminate unintended noise overlapping the DC-link voltage signal between MAG and IMC a filter is implemented in the read-out circuitry. The filter time is given with tDLK. The DC-link voltage signal at terminal DLK is pulse-width modulated with a fix carrier frequency fDLK. The larger the duty cycle the larger the DC-link voltage. All output signals are galvanically isolated from the secondary- side and provide reinforced isolation. Note: In case of repetitive errors in the data transmission of the TPM signal and/or DLK signal from the secondary-side towards the primary-side, both outputs are set to LOW (i.e. GND potential) until the next valid data frame is received. In case the cable from the IMC to the first MAG is not connected the TPM signal will be set to HIGH and the DLK signal have a fix duty cycle of 5%. This also corresponds to modules which do not feature an NTC. IMC Output (Secondary-Side X100, X200) The IMC provides per channel an output connector towards the first MAG. Details on recommended routing and general mounting are given in section Mounting Instruction. MAG Cable Terminals (X1, X2, X3, X4) All MAGs have two connector terminals per channel. The first MAG needs to be connected to the secondary-side of the IMC. It is important that the channel assignment is not mixed up. Channel 1 from the IMC (X100) must be connected to channel 1 of the MAG (X1). Accordingly, channel 2 of the IMC (X200) with channel 2 of the MAG (X2). In case more than one MAG is used, i.e. paralleling of two to four power modules, the first MAG needs be connected with the second MAG. Accordingly the second MAG with the third MAG and so on. Also here the channel assignment must not be mixed up, i.e. terminal X1 has to be connected with X3 and terminal X2 with X4. Details on recommended routing and general mounting are given in section Mounting Instruction. MAG Screw Terminals The MAG is mounted on top of the power module and fixed by screws. Details are given in the section Mounting Instruction. Cables SCALE-iFlex gate driver require a set of cables to establish the electrical connection between the IMC and the first MAG as well as between paralleled MAGs. The usage of cables allows for a flexible positioning of the IMC within the application. Furthermore, it allows adapting to various pitches between paralleled power modules. For instance forced air cooled systems require a larger pitch than liquid cooled systems due to the difference of heat spreading.

(i.e. getting less negative) with increasing load. events of the power semiconductor are avoided. corresponding power semiconductor with ASSD. indicator F is then set to OFF. relevant MAG datasheet section. detection only and cannot provide overcurrent protection. and can be easily provided by the application. the transconductance of the power semiconductor. semiconductor is turned-off within its safe operating area. loop feedback (Figure 6, t1 to t2). conditions and not under normal operating conditions (e.g. at nominal current or under overcurrent conditions). Figure 6. Advanced Soft Shut Down (ASSD).

www.power.com SCALE-iFlex (Electrical Interface) Optical Indicators The IMC and MAGs have optical indicators to signal the following operating conditions:  IMC One white LED (P in Figure 2), which monitors the voltage VV15. One red LED (F), which is ON in case of short-circuit or UVLO condition occurred at any driver channel and OFF during normal operation. The ON status is latched as long until the actual fault is gone and a first rising edge of any input channel is received. Note: After power-up of the IMC the LED (F) stays ON as this is interpreted as an UVLO condition. The IMC starts operating as soon as the nominal supply voltage levels are reached and a first rising edge of any input channel is received.  MAG One white LED per driver channel (F1 for channel 1 and F2 for channel 2 in Figure 3), which is ON during normal operation and OFF during short-circuit or UVLO condition. Failure signals stay until time tblk has elapsed.

www.power.com SCALE-iFlex Absolute Maximum Ratings – IMC 2SI0400T2A1C-33 Parameters Symbol Conditions Min Max Unit Absolute Maximum Ratings2 Primary-side supply voltage VVCC VCC to GND 0 50.4 V VV15 V15 to GND 0 16.0 Primary-side supply current IVCC tbd mA IV15 tbd Logic input voltage (command signal) VINx INx to GND 0 VV15 + 0.5 V Logic output voltage (status signal) VSOx SOx to GND 0 VV15 + 0.5 V TPM output current (NTC temperature signal) ITPM 20 mA DLK output current (DC-link voltage signal) IDLK 20 mA Switching Frequency fSW 25 kHz Gate output power per channel3 PIMCgx 4 W Test voltage primary-side to secondary-side Viso,ps 50 Hz, 60 s 10800 VRMS Test voltage secondary-side to secondary-side Viso,ss 50 Hz, 60 s 6700 VRMS Operating voltage primary-side to secondary-side Vop Transient only 3300 Vpk Permanently applied 2500 VDC Common-mode transient immunity |dv/dt| tbd 50 kV/µs Storage temperature4 Tstg -40 50 °C Operating ambient temperature Tamb -40 85 °C Component Surface Temperature5 Tsurf 125 °C Relative humidity Hr,IMC No condensation 93 % Altitude of operation6 AIMC 2000 m Notes: 2. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. 3. Power budget designed for maximum four MAGs in parallel. 4. The storage temperature inside the original package or in case the coating material of coated products may touch external parts must be limited to the given value. Otherwise, it is limited to 85°C. 5. The component surface temperature, which may strongly vary depending on the operating condition, must be limited to the given value for coated driver versions to ensure long-term reliability of the coating material. 6. Operation above this level requires a voltage derating to ensure proper isolation coordination.

www.power.com SCALE-iFlex (Electrical Interface) Recommended Operating Conditions – IMC Parameter Symbol Conditions TA = -40 °C to 85 °C Min Typ Max Unit Power Supply Primary-Side Supply Voltage VVCC VCC to GND 23.5 49.0 V VV15 V15 to GND 14.5 15 15.5

www.power.com SCALE-iFlex Absolute Maximum Ratings – MAG (all versions) Parameters Symbol Conditions Min Max Unit Absolute Maximum Ratings7 Gate output power per channel PMAGx 1 W Gate peak current IGate,pk 20 A Minimum gate resistors RG,min Turn on and turn off 0.5 Ω Common-mode transient peak voltage8 |dvE| Between parallel connected emitters (sources) 15 V Common-mode current |ICMrms| Between parallel connected MAGs 1.2 ARMS |ICMpk| Between parallel connected MAGs 15 Apk DC-link voltage VDLK

3300 V versions, steady-state 2200 V

3300 V versions, < 60 s 2500 V

Collector-emitter (drain-source) voltage VCE Transient only, 3300 V versions 3300 V Storage temperature9 Tstg -40 50 °C Operating ambient temperature Tamb -40 85 °C Component Surface Temperature10 Tsurf 125 °C Relative humidity Hr,MAG No condensation 93 % Altitude of operation11 AMAG 2000 m Notes: 7. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. 8. This value guarantees proper signal transmission from MAG to MAG. In case this value is exceeded due to electrical and/or mechanical constrains in the target application, it is recommended to add ferrite cores to the cables, which interconnect the MAGs. Such ferrites will reduce the effective common-more current through the cables. In any case the limiting values of ICMrms and ICMpk must not be exceeded. 9. The storage temperature inside the original package or in case the coating material of coated products may touch external parts must be limited to the given value. Otherwise, it is limited to 85°C. 10. The component surface temperature, which may strongly vary depending on the operating condition, must be limited to the given value for coated driver versions to ensure long-term reliability of the coating material. 11. Operation above this level requires a voltage derating to ensure proper isolation coordination.

www.power.com SCALE-iFlex (Electrical Interface) Characteristics – IMC 2SI0400T2A1C-33 Parameter Symbol Conditions TA = 25 °C Min Typ Max Unit Power Supply Supply current IVCC VVCC = 24 V, 1 MAG connected, without load 110 mA VVCC = 24 V, 320 nF load per channel, 4 MAGs connected, fSW = 5 kHz, 50 % duty cycle 578 mA IV15 VV15 = 15 V, 1 MAG connected, without load 156 mA VV15 = 15 V, 320 nF load per channel, 4 MAGs connected, fSW = 5 kHz, 50 % duty cycle 883 mA Power supply monitoring threshold (primary-side) UVLOVCC Referenced to GND Clear fault (resume operation) tbd 19.6 tbd V Set fault (suspend operation) tbd 18 tbd V Hysteresis tbd 1.6 V UVLOV15 Clear fault (resume operation) 11.6 12.6 13.6 V Set fault (suspend operation) 11.0 12.0 13.0 V Hysteresis 0.35 V Power supply monitoring threshold (secondary-side) UVLOVISOx Referenced to respective terminal E1 or E2 of the attached MAG Clear fault (resume operation) 11.6 12.6 13.6 V Set fault (suspend operation) 11.0 12.0 13.0 V Hysteresis 0.35 V UVLOCOMx Clear fault (resume operation) -5.15 V Set fault (suspend operation) -4.85 V Hysteresis 0.3 V Output voltage (secondary-side) VVISOx Referenced to VCOMx VVCC = 24 V, 1 MAG, without load, Channel 2 (Low Side) 25.5 V VVCC = 24 V, 320 nF load per channel, fSW = 5 kHz, 50 % duty cycle, Channel 2 (Low Side) 23.7 V Coupling capacitance Cio Primary-side to secondary-side, total per channel 19 pF Logic Inputs and Status Outputs Input impedance RINx 4.4 4.5 4.6 kΩ Turn-on threshold Vth-on,INx INx to GND 7.6 10.1 12.6 V Turn-off threshold Vth-off,INx INx to GND 4.1 6.4 8.1 V Status output voltage12 VSOx SOx to GND , ISOX < 0.5 mA 12 V Notes: 12. Internal 4.7 kΩ pull-up resistor is connected to V15.

www.power.com SCALE-iFlex Parameter Symbol Conditions TA = 25 °C Min Typ Max Unit Timing Characteristics Turn-on delay tP(LH) Vth-on,INx to 50% of VGE(on), no load attached Cable length between IMC and MAG of 0.5 m 260 ns Turn-off delay tP(LH) Vth-off,INx to 50% of VGE(off), no load attached Cable length between IMC and MAG of 0.5 m 225 ns Transmission delay of fault state tSOX Cable length between IMC and MAG of 0.5 m 6.5 µs Delay to clear fault state tblk Cable length between IMC and MAG of 0.5 m 18.5 ms NTC Temperature Signal Output Logic low level VTPM,L TPM to GND, ITPM = 10 mA 0.6 V Logic high level VTPM,H TPM to GND, ITPM = -10 mA V15 - 0.9 V Carrier frequency fTPM 10 kHz Duty cycle DCTPM TNTC ≤ 20 °C 5 % TNTC ≥ 130 °C 95 % Filter time tTPM Analog filter, 3 / 95% 10 ms Transmission delay tTPM,tot Complete transmission line 25 ms Sample rate STPM 98 Hz DC-Link Signal Output Logic low level VDLK,L DLK to GND, ITPM = 10 mA 0.6 V Logic high level VDLK,H DLK to GND, ITPM = -10 mA V15 - 0.9 V Carrier frequency fDLK 10 kHz Duty cycle DCDLK VDC-Link = 0 V 5 % VDC-Link ≥ 2900 V (3300 V version) 95 % Filter time tDLK Analog filter, 3 / 95% 1.0 ms Transmission delay tDLK,tot Complete transmission line 2.0 ms Sample rate SDLK 980 Hz

www.power.com SCALE-iFlex (Electrical Interface) Parameter Symbol Conditions TA = 25 °C Min Typ Max Unit Electrical Isolation Test voltage Viso,ps Primary-side to secondary-side 10800 VRMS Viso,ss Secondary-side to secondary-side 6700 VRMS Partial discharge extinction voltage PD,ps Primary-side to secondary-side 4950 Vpk PD,ss Secondary-side to secondary-side 3960 Vpk Creepage distance CPGP-S Primary-side to secondary-side, on PCB 50 mm CPGS-S Secondary-side to secondary-side, on PCB 25 mm CPGS-B Secondary-side to bottom of the housing 25 mm Clearance distance CLRP-S Primary-side to secondary-side 23.8 mm CLRS-S Secondary-side to secondary-side 14 mm CLRS-B Secondary to bottom of the housing 23.8 mm Housing Tracking Resistance (Comparative Tracking Index) CTI DIN EN 60112 (VDE 0303-11):2010-05 EN / IEC 60112:2033 + A1:2009 600 IP Code IEC 60529, terminal contacts excluded 20 Mounting Mounting torque MIMC Screw M4 tbd Nm Bending13 lbend According to IPC 0.75 % Notes: 13. Refer to section Mounting Instruction for absolute values of allowed bending distances of the IMC housing.

www.power.com SCALE-iFlex Characteristics – MAG (all versions) Parameter Symbol Conditions TA = 25 °C Min Typ Max Unit Power Supply Total idle power consumption PMAGidle No load, both MAG channels 0.6 W Power supply monitoring threshold UVLOVISOx Referenced to respective terminal E1 or E2 Clear fault (resume operation) 11.6 12.6 13.6 V Set fault (suspend operation) 11.0 12.0 13.0 V Hysteresis 0.35 V UVLOCOMx Clear fault (resume operation) -5.15 V Set fault (suspend operation) -4.85 V Hysteresis 0.3 V Gate Output Gate turn-on voltage VGE(on) VVCC = 24 V, 1 MAG, without load, referenced to terminal E1 or E2 15 V Gate turn-off voltage VGE(off) Referenced to respective terminal E1 or E2 VVCC = 24 V, 1 MAG, without load, Channel 1 (High Side) -11.7 V VVCC = 24 V, 1 MAG, without load, Channel 2 (Low Side) -10.5 VVCC = 24 V, 320 nF load per channel, fSW = 5 kHz, 50 % duty cycle, Channel 1 (High Side) -8.9 VVCC = 24 V, 320 nF load per channel, fSW = 5 kHz, 50 % duty cycle, Channel 2 (Low Side) -8.7 Short-Circuit Protection Static VCE-monitoring threshold VCE(stat) 3300 V versions 113 V Response time

3300 V versions

tres,Si 10% to 90% of VGE DC-link voltage = 2500 V 8.0 µs DC-link voltage = 1500 V 8.1 DC-link voltage = 1000 V 9.4 Response time,

3300 V versions,

tres,SiC 10% to 90% of VGE DC-link voltage = 2500 V 3.0 µs DC-link voltage = 1500 V 4.0 µs DC-link voltage = 1000 V tbd µs Delay to power semiconductor turn-off after short-circuit detection tpd,SOx Single power module 0.2 µs Electrical Isolation Creepage distance CPGS-S Secondary-side to secondary-side 22 mm Clearance distance CLRS-S Secondary-side to secondary-side 8 mm Notes:

www.power.com SCALE-iFlex (Electrical Interface) Parameter Symbol Conditions TA = 25 °C Min Typ Max Unit Mounting Terminal connection torque14 MMAG Screw M3 and M4 0.8 Nm Screw header/washer diameter14 dM3 Terminals G1, E1, C1, G2, E2 and NTC 8.0 mm Terminals S1, S2, S3 and S4 7.5 mm Notes: 14. Refer also to the Section Mounting Instruction.

www.power.com SCALE-iFlex Characteristics – 2SM0120D2C0C-FMF750DC-66A Parameter Symbol Conditions TA = 25 °C Min Typ Max Unit Gate Output Turn-on gate resistor RG(on) 0.4 Ω Turn-off gate resistor RG(off) 1.4 Ω Auxiliary gate capacitor CGE N.A. nF

www.power.com SCALE-iFlex (Electrical Interface) Application Guidelines The following guidelines are meant to optimize the overall system performance when using SCALE-iFlex gate drivers in various applications. IMC Power Supply The IMC can be supplied either by a fixed voltage of VV15 or a wide range supply voltage VVCC. In case of a wide range supply the internally generated reference voltage of 15 V is present at the terminal V15. If required an additional external load may be connected to V15. However, the total load (i.e. external load and all gate output loads) must not exceed the power rating of the IMC. Not allowed is to add a further feeding power supply to V15. If the wide range supply is not used, the IMC needs to be supplied by a fixed voltage of VV15 at terminal V15. In this case VCC must not be connected, i.e. stay floating. Gate Output Power Calculation Each MAG can provide up to 1 W of gate output power per channel. This value must not be exceeded to prevent any electrical and/or thermal overload of the SCALE-iFlex gate driver. The gate output power is related to the power module’s gate charge QG as stated in the correspondig datasheet, actual switching frequency fSW, and gate turn-on VGE(on) and turn-off VGE(off) voltage and can be estimated according to equation (1). ( ) (1) The voltages VGE(on)* and VGE(off)* refer to the referenced gate turn-on and turn-off gate voltages of the respective driven power semiconductor datasheet at which the gate charge QG is given. DC-Link Design The mechanical and electrical design of the DC-link of the target application determines during turn-off events of the driven power semiconductor the over voltages ∆VCE according to equation (2). Here, L describes the overall DC-link stray inductance (i.e. sum stray inductance of DC-capacitors, DC-link bus bar and power module) and diC/dt the collector (drain) current change. (2) If the over voltage ∆VCE plus the applied DC-link voltage VDC exceed the breakdown voltage of the driven power module (refer to the reverse bias safe operating area RBSOA), the power module may be damaged. In case of excessive turn-off over voltages, one or more of the following application parameters have to be decreased:  DC-link voltage VDC  Stray inductance L  Collector current iC Therefore, during the installation and testing of the target application the actual over voltages ∆VCE at different conditions have to be measured. Note: SCALE-iFlex gate driver will not actively limit any over voltage during turn-off events under normal and over current conditions. Only during turning-off a short-circuit condition, the over voltage is limited to safe values by employing an Advanced Soft Shut Down (ASSD) scheme. Paralleling of Power Modules SCALE-iFlex gate drivers are optimized for paralleling of up to four power modules. Nevertheless, the following basic rules should be obeyed to ensure minimum load current imbalances and general proper system operation. The load current sharing between paralleled power modules depends on several factors:  Deviation of the power modules parameters like IGBT saturation voltage VCEsat, diode forward voltage VF, rise and fall times tr and tf, turn-on and turn-off delay times td(on) and td(off). They are influencing the current sharing in the conducting (static) and switching (dynamic) phase.  Deviation in the cooling of the power modules. The before mentioned parameters are mostly temperature dependent. Inhomogeneous cooling of paralleled power modules influences therefore the static and dynamic current sharing.  Deviation of the gate loop impedance. It leads to static and dynamic current imbalances.  Deviation of the apparent DC-link stray inductance and resistance per paralleled power module. It leads to static and dynamic current imbalances. Power module parameter deviations can be addressed by screening of power modules as offered by some manufacturers. The deviation in cooling can be compensated to a fair degree by the inherent positive temperature coefficient of the power modules. In case one power module takes over more current than the other power modules, it will heat-up more than the others. As a result the saturation voltage is increased, which leads to a reduction of the current in the power module. The system is self-regulated to a certain extent. Deviations of the gate loop impedances are minimized due to the usage of identical MAGs and tight design, process and assembly control. Part of the gate loop impedance is also the terminal screw connection of the MAG towards the power module. Here the recommended (i.e. maximum) mounting torque must be obeyed to minimize its influence. Deviation of the apparent DC-link stray inductance and resistance between paralleled power modules refers to the mechanical arrangement of the power modules and DC-link. Due to these deviations, dynamic voltage spikes dVE between the auxiliary emitters of the paralleled power modules will occur. The voltage spikes will interfere with the actual gate voltage and cause a circulating current over the gate driver emitter (source) terminals. Optimizing the mechanical setup will reduce the voltage spike and the circulating current. The MAGs have a rated maximum dVE voltage, which must not be exceeded at any time. Exceedance of this parameter may  lead to excessive common mode currents in the connecting cables and connectors, potentially impacting the long-term product reliability,

will eventually destroy them. SCALE-iFlex gate driver are designed for 2-level topologies. requirements are fulfilled). safe operating area) violation of the power module. disturbance of the performance of the gate driver. Figure 17. Arrangement of the AC-Busbar for paralleled modules

Figure 18. IMC Dimensions.

Figure 19. MAG Dimensions.

www.power.com SCALE-iFlex (Electrical Interface) Transportation and Storage Conditions For transportation and storage conditions refer to Power Integrations’ Application Note AN-1501. RoHS Statement On the basis of Annexes II and III of European Directive 2011/65/EC of 008 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), we hereby state that the products described in this datasheet do not contain lead (Pb), mercury (Hg), hexavalent chromium (Cr VI), cadmium (Cd), polibrometo of bipenyl (PBB) or polibrometo diphenyl ether (PBDE) in concentrations exceeding the restrictions set forth in Annex II of 2011/65/EC with due consideration of the applicable exemptions as listed in Annex III of 2011/65/EC.

www.power.com SCALE-iFlex Part Ordering Information IMC

2 S I 04 00 T 2 A 1 C - 33 45=4500V

33=3300V Voltage Class Feature C=Conformal Coating Revision T=Ring Core V=Versatile Fiber-optics Version SCALETM Technology Generation Insulation Technology Peak Output Current in A I=SCALE-iFlexTM Isolated Master Control (IMC) Output Power in W Driver Type SCALETM Technology Number of Channels MAG

2 S M 01 20 D 2 A 0 C - Power Module Part Number

C=Conformal Coating Feature A=1.7 – 3.3kV LV-Package, ABB, Fuji etc. Revision B=3.3 – 6.5 kV HV-Package, ABB, Fuji etc. C=1.7 – 3.3kV LV-Package, Infineon, Mitsubishi etc. D=3.3 – 6.5 kV HV-Package, Infineon, Mitsubishi etc. Version D=Coreless (PCB-base) SCALETM Technology Generation Insulation Technology Peak Output Current in A M=SCALE-iFlexTM Module Adapted Gate Driver (MAG) Output Power in W Driver Type SCALETM Technology Number of Channels Cable IMC C 6 1 - 050 - 0 Version Cable Length in mm 1=molex Connector Type Amount of Pins Cable IMC=Cable from IMC to MAG MAG=Cable from MAG to MAG From - To

www.power.com SCALE-iFlex (Electrical Interface) Revision Notes Date A Target Datasheet 06/19 For the latest updates, visit our website: www.power.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. The statements, technical information and recommendations contained herein are believed to be accurate as of the date hereof. All parameters, numbers, values and other technical data included in the technical information were calculated and determined to our best knowledge in accordance with the relevant technical norms (if any). They may base on assumptions or operational conditions that do not necessarily apply in general. We exclude any representation or warranty, express or implied, in relation to the accuracy or completeness of the statements, technical information and recommendations contained herein. No responsibility is accepted for the accuracy or sufficiency of any of the statements, technical information, recommendations or opinions communicated and any liability for any direct, indirect or consequential loss or damage suffered by any person arising therefrom is expressly disclaimed. Patent Information The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. Safety Notice The data contained in this datasheet is intended exclusively for technically trained staff. Handling all high-voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory. Any handling of electronic devices is subject to general specifications for protecting electrostatic-sensitive devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI logo, TOPSwitch, TinySwitch, SENZero, SCALE, SCALE-iDriver, SCALE-iFlex, Qspeed, PeakSwitch, LYTSwitch, LinkZero, LinkSwitch, InnoSwitch, HiperTFS, HiperPFS, HiperLCS, DPA-Switch, CAPZero, Clampless, EcoSmart, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2019, Power Integrations, Inc.

www.power.com SCALE-iFlex Power Integrations Worldwide Sales Support Locations World Headquarters

5245 Hellyer Avenue

San Jose, CA 95138, USA Main: +1-408-414-9200 Customer Service: Worldwide: +1-65-635-64480 Americas: +1-408-414-9621 e-mail: usasales@power.com China (Shanghai) Rm 2410, Charity Plaza, No. 88 North Caoxi Road, Shanghai, PRC 200030 Phone: +86-21-6354-6323 e-mail: chinasales@power.com China (Shenzhen) 17/F, Hivac Building, No. 2, Keji Nan 8th Road, Nanshan District, Shenzhen, China, 518057 Phone: +86-755-8672-8689 e-mail: chinasales@power.com Germany (AC-DC/LED Sales) Einsteinring 24

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59469 Ense Germany

Tel: +49-2938-64-39990 e-mail: igbt-driver.sales@ power.com India #1, 14th Main Road Vasanthanagar Bangalore

560052 India

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Phone: +81-45-471-1021 e-mail: japansales@power.com Korea RM 602, 6FL Korea City Air Terminal B/D, 159-6 Samsung-Dong, Kangnam-Gu, Seoul, 135-728, Korea Phone: +82-2-2016-6610 e-mail: koreasales@power.com Singapore

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#19-01/05 Goldhill Plaza Singapore, 308900 Phone: +65-6358-2160 e-mail: singaporesales@ power.com Taiwan 5F, No. 318, Nei Hu Rd., Sec. 1, Nei Hu Dist., Taipei 11493, Taiwan R.O.C. Phone: +886-2-2659-4570 e-mail: taiwansales@ power.com UK Building 5, Suite 21 The Westbrook Centre Milton Road Cambridge CB4 1YG Phone: +44 (0) 7823-557484 e-mail: eurosales@power.com